Large expert-curated database for benchmarking document similarity detection in biomedical literature search

Document recommendation systems for locating relevant literature have mostly relied on methods developed a decade ago. This is largely due to the lack of a large offline gold-standard benchmark of relevant documents that cover a variety of research fields such that newly developed literature search techniques can be compared, improved and translated into practice. To overcome this bottleneck, we have established the RElevant LIterature SearcH consortium consisting of more than 1500 scientists from 84 countries, who have collectively annotated the relevance of over 180 000 PubMed-listed articles with regard to their respective seed (input) article/s. The majority of annotations were contributed by highly experienced, original authors of the seed articles. The collected data cover 76% of all unique PubMed Medical Subject Headings descriptors. No systematic biases were observed across different experience levels, research fields or time spent on annotations. More importantly, annotations of the same document pairs contributed by different scientists were highly concordant. We further show that the three representative baseline methods used to generate recommended articles for evaluation (Okapi Best Matching 25, Term Frequency-Inverse Document Frequency and PubMed Related Articles) had similar overall performances. Additionally, we found that these methods each tend to produce distinct collections of recommended articles, suggesting that a hybrid method may be required to completely capture all relevant articles. The established database server located at https://relishdb.ict.griffith.edu.au is freely available for the downloading of annotation data and the blind testing of new methods. We expect that this benchmark will be useful for stimulating the development of new powerful techniques for title and title/abstract-based search engines for relevant articles in biomedical research.Peer reviewe

Reliability analysis of complex systems using symbolic logic

System reliability is an important parameter in the operation of modern utility systems, spacecraft and manufacturing facilities. Over the last several decades researchers have used many different methods to determine complex system reliability. This paper uses new and novel techniques which are based on artificial intelligence and expert systems to determine system reliability. This work is based on heuristic search and a symbolic logic system which provides symbolic representation for overall system reliability when there is a single input and single output. Pivotal decomposition is used on a recursive basis to repeatedly reduce complex systems/subsystems to simpler systems. Eventually, these simpler systems are further reduced into easily resolved series-parallel arrangements. This symbolic logic system uses a heuristic based ‘hill climbing’ search algorithm. The algorithm identifies the pivotal or complex component. Once this pivotal component is selected, additional procedures are used to symbolically recognize other components within the resulting subgraphs which are made superfluous by the selection of the pivot component. These superfluous components are removed, and the simplification process is allowed to continue on a recursive basis. Once further recursive analysis is not needed, additional rules are employed to reduce the result to a system recognizable form in terms of series-parallel components. Finally, a ‘symbolic processor’ is used to convert this recognized form into a symbolic sum of products equation representing the overall system

Effect of Grain Orientation and Local Strain on the Quality of Polycrystalline YBa\u3csub\u3e2\u3c/sub\u3eCu\u3csub\u3e3\u3c/sub\u3eO\u3csub\u3e7\u3c/sub\u3e Superconductive Films

The critical current densities of superconducting thin films and their dependence on the film structural characteristics has been a major research interest for more than a decade. Controlling this relationship is crucial if large-scale high-quality YBa 2 Cu 3 O 7 (YBCO) tapes are to be produced. Two major keystones of information have been established in this field. Firstly, there is a direct relationship between the critical current density and the grain-boundary angle in polycrystalline YBCO films. Grain boundaries with a mismatch angle higher than 5° usually result in reduced critical current densities. This detrimental effect of large-angle grain boundaries to the quality of YBCO films has been attributed to strain fields resulting from such grain boundaries. Secondly, the quality of the YBCO film can be enhanced by straining its lattice in specific direction. Here, we report, for the first time, direct experimental results coupling local grain orientation and local strain maps of thin YBCO films deposited on a (001) biaxially textured nickel substrate. These results were correlated to the quality of the film and showed how grain structure in the nickel substrate affects the grain structure in the YBCO films even in the presence of several buffer layers. More importantly, the data show that highquality films with high critical current densities can be produced, in spite of large-angle grain boundaries, if the film is compressed in the range of 0.5% strain normal to the a axis

Induced Stresses and Structural Changes in Silicon Wafers as a Result of Laser Micro-Machining

Laser micro-machining has proven to be a very powerful and successful tool for precision machining and micro-fabrication with applications in electronics, MEMS, medical, and biomedical fields. A large number of studies were devoted to the investigation of laser-based micro-machining covering the different aspects of the machining process. Induced stresses due to laser micro-machining process were, however, not fully investigated. In this paper, we report, for the first time, the results of utilizing micro-Raman spectroscopy as a powerful stress measurement technique in investigating stresses as well as structural changes induced in a silicon single crystal wafer as a result of laser micro-machining. It was found that laser machining of silicon wafers has induced tensile stress in the range 0.8–1.0 GPa. The machining process has also led to the creation of as much as 14% amorphous silicon in the machined area

Effect of Grain Orientation and Local Strain on the Quality of Polycrystalline YBa\u3csub\u3e2\u3c/sub\u3eCu\u3csub\u3e3\u3c/sub\u3eO\u3csub\u3e7\u3c/sub\u3e Superconductive Films

The critical current densities of superconducting thin films and their dependence on the film structural characteristics has been a major research interest for more than a decade. Controlling this relationship is crucial if large-scale high-quality YBa 2 Cu 3 O 7 (YBCO) tapes are to be produced. Two major keystones of information have been established in this field. Firstly, there is a direct relationship between the critical current density and the grain-boundary angle in polycrystalline YBCO films. Grain boundaries with a mismatch angle higher than 5° usually result in reduced critical current densities. This detrimental effect of large-angle grain boundaries to the quality of YBCO films has been attributed to strain fields resulting from such grain boundaries. Secondly, the quality of the YBCO film can be enhanced by straining its lattice in specific direction. Here, we report, for the first time, direct experimental results coupling local grain orientation and local strain maps of thin YBCO films deposited on a (001) biaxially textured nickel substrate. These results were correlated to the quality of the film and showed how grain structure in the nickel substrate affects the grain structure in the YBCO films even in the presence of several buffer layers. More importantly, the data show that highquality films with high critical current densities can be produced, in spite of large-angle grain boundaries, if the film is compressed in the range of 0.5% strain normal to the a axis

Induced Stresses and Structural Changes in Silicon Wafers as a Result of Laser Micro-Machining

Laser micro-machining has proven to be a very powerful and successful tool for precision machining and micro-fabrication with applications in electronics, MEMS, medical, and biomedical fields. A large number of studies were devoted to the investigation of laser-based micro-machining covering the different aspects of the machining process. Induced stresses due to laser micro-machining process were, however, not fully investigated. In this paper, we report, for the first time, the results of utilizing micro-Raman spectroscopy as a powerful stress measurement technique in investigating stresses as well as structural changes induced in a silicon single crystal wafer as a result of laser micro-machining. It was found that laser machining of silicon wafers has induced tensile stress in the range 0.8–1.0 GPa. The machining process has also led to the creation of as much as 14% amorphous silicon in the machined area

MultiDisciplinary Design for Uninhabited Air Vehicles

Contemporary product design and process development is based on an iterative specify-evaluate-revise approach which is often time intensive and therein non-responsive to customer needs. The engineering of a product incorporates numerous stages involving conceptual through detailed design. For small quantities or lot sizes (1-25 parts), the product design and process planning steps account for an inordinate share of the overall development cycle. An integrated geometric, performance analysis, and materials processing evaluation environment for concurrent, multidisciplinary design is needed to not only address design-through-production efficiencies and costs but enable more responsive product development cycles. The environment should enable the user to interactively evaluate alternativ

Local Grain Orientation and Strain in Polycrystalline YBa\u3cem\u3e\u3csub\u3e2\u3c/sub\u3e\u3c/em\u3eCu\u3cem\u3e\u3csub\u3e3\u3c/sub\u3e\u3c/em\u3eO\u3cem\u3e\u3csub\u3e7−δ\u3c/sub\u3e\u3c/em\u3e Superconductor Thin Films Measured by Raman Spectroscopy

We report direct measurements of local grain orientation and residual strain in polycrystalline,C-axis oriented thin YBa2Cu3O7−δ superconducting films using polarized Raman spectroscopy. Strain dependence of the Ag Raman active mode at 335 cm−1 was calibrated and used to measure local strain in the films. Our data showed that high quality films are associated with the connected path of uniform grain orientation (single crystal-like) across the film and uniform residual strain in the range of −0.3%. Nonuniform grain orientation or high angle grain boundaries and nonuniform local strains were associated with low quality films