Adaptive optical interconnects: The ADDAPT project

Existing optical networks are driven by dynamic user and application demands but operate statically at their maximum performance. Thus, optical links do not offer much adaptability and are not very energy-effcient. In this paper a novel approach of implementing performance and power adaptivity from system down to optical device, electrical circuit and transistor level is proposed. Depending on the actual data load, the number of activated link paths and individual device parameters like bandwidth, clock rate, modulation format and gain are adapted to enable lowering the components supply power. This enables exible energy-efficient optical transmission links which pave the way for massive reductions of CO2 emission and operating costs in data center and high performance computing applications. Within the FP7 research project Adaptive Data and Power Aware Transceivers for Optical Communications (ADDAPT) dynamic high-speed energy-efficent transceiver subsystems are developed for short-range optical interconnects taking up new adaptive technologies and methods. The research of eight partners from industry, research and education spanning seven European countries includes the investigation of several adaptive control types and algorithms, the development of a full transceiver system, the design and fabrication of optical components and integrated circuits as well as the development of high-speed, low-loss packaging solutions. This paper describes and discusses the idea of ADDAPT and provides an overview about the latest research results in this field

PIXAPP Photonics Packaging Pilot Line development of a silicon photonic optical transceiver with pluggable fiber connectivity

This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance

Using the Light Microscopy Module (LMM) on the International Space Station (ISS), The Advanced Colloids Experiment (ACE) and MacroMolecular Biophysics (MMB)

The Light Microscopy Module (LMM) was launched to the International Space Station (ISS) in 2009 and began science operations in 2010. It continues to support Physical and Biological scientific research on ISS. During 2016, if all goes as planned, three experiments will be completed: [1] Advanced Colloids Experiments with Heated base-2 (ACE-H2) and [2] Advanced Colloids Experiments with Temperature control (ACE-T1). Preliminary results, along with an overview of present and future LMM capabilities will be presented; this includes details on the planned data imaging processing and storage system, along with the confocal upgrade to the core microscope. [1] a consortium of universities from the State of Kentucky working through the Experimental Program to Stimulate Competitive Research (EPSCoR): Stuart Williams, Gerold Willing, Hemali Rathnayake, et al. and [2] from Chungnam National University, Daejeon, S. Korea: Chang-Soo Lee, et al

PIXAPP Photonics Packaging Pilot Line development of a silicon photonic optical transceiver with pluggable fiber connectivity

This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance

NEUROPULS: NEUROmorphic energy-efficient secure accelerators based on Phase change materials aUgmented siLicon photonicS

International audienceThis special session paper introduces the Horizon Europe NEUROPULS project, which targets the development of secure and energy-efficient RISC-V interfaced neuromorphic accelerators using augmented silicon photonics technology. Our approach aims to develop an augmented silicon photonics platform, an FPGA-powered RISC-V-connected computing platform, and a complete simulation platform to demonstrate the neuromorphic accelerator capabilities. In particular, their main advantages and limitations will be addressed concerning the underpinning technology for each platform. Then, we will discuss three targeted use cases for edge-computing applications: Global National Satellite System (GNSS) anti-jamming, autonomous driving, and anomaly detection in edge devices. Finally, we will address the reliability and security aspects of the stand-alone accelerator implementation and the project use case