Sol–gel encapsulation for power electronics utilizing 3-Glycidyloxypropyltriethoxysilane and 3-Mercaptopropyltrimethoxysilane

3-Glycidyloxypropyltriethoxysilane and 3-Mercaptosilane were used to prepare a composite together with aluminum oxide. The compound is a potential candidate for being used as inorganic encapsulation. FTIR results paired with head-space analysis revealed a hardening of the composite at above 130 °C and degradation of the sol–gel-network above 150 °C. The adhesion of these compounds was tested via shear tests. It showed, that the addition of 3-Mercaptopropyltriethoxysilane enhanced the adhesion on silver significantly. This is attributed to the covalent nature of the Ag-S bond, which is forming as compared to the solely dispersive forces, when 3-Mercaptopropyltriethxysilane is not used. By conducting the shear test under temperature activation energies for the breakages were calculated. These coincide well with the binding energy of Ag-S in case silver surfaces are examined. In the case of a copper surface, a mixture of covalent and dipole–dipole interactions are found, since the activation energy for breakage is smaller as the Cu-O bond energy

Modeling of capillary-driven flows in axisymmetric geometries

We present an analytical approach, as well as computer simulations based on the free surface lattice-Boltzmann (FSLB) method, in order to model capillary-driven infiltration of liquids into porous structures. The analytical method is an extension of the Lucas-Washburn (LW) equation and applies to axisymmetric geometries with a circular cross-section. The treatment of irregular capillaries is achieved by a discretization procedure in which the original geometry is divided into small cylinders. In order to validate the derived analytical equation, we perform FSLB simulations in test geometries which show a good agreement

Modeling of capillary-driven flows in axisymmetric geometries

\u3cp\u3eWe present an analytical approach, as well as computer simulations based on the free surface lattice-Boltzmann (FSLB) method, in order to model capillary-driven infiltration of liquids into porous structures. The analytical method is an extension of the Lucas-Washburn (LW) equation and applies to axisymmetric geometries with a circular cross-section. The treatment of irregular capillaries is achieved by a discretization procedure in which the original geometry is divided into small cylinders. In order to validate the derived analytical equation, we perform FSLB simulations in test geometries which show a good agreement.\u3c/p\u3

Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for finite element calculations

Automotive electronic devices are exposed to substantially harsher thermo-mechanical loads compared to commercial consumer electronic products. As a consequence, solder joints carrying out the electrical interconnection between the components undergo deformation and degradation under thermal cycling, which can determine the lifetime of the electronic assembly in long term operation. In the past decade, lifetime prediction methods for solder joints based on finite element (FE) simulations are increasingly employed in the process of product design. However, constitutive FE models for solder alloys capable of describing their mechanical behavior at the relevant conditions of automotive applications are still not widely established. Here, we employ a unified viscoplastic material model initially proposed by Chaboche et al. in order to address the mechanical properties of an as-casted Sn-based solder alloy under a cyclic mechanical load. Extensive experimental investigations at temperatures from -40°C up to +150°C reveal a complex nonlinear interplay between hardening, recovery and thermally activated inelastic deformation processes in the material studied. We identified the necessary constitutive model terms and performed parameter calibration according to their specific functionality. A very good agreement between the numerical calculations and experimental data is achieved, which renders the constitutive model used a very promising approach for a wide use in FE simulations of lead-free solder alloys