A review of data mining applications in semiconductor manufacturing

The authors acknowledge Fundacao para a Ciencia e a Tecnologia (FCT-MCTES) for its financial support via the project UIDB/00667/2020 (UNIDEMI).For decades, industrial companies have been collecting and storing high amounts of data with the aim of better controlling and managing their processes. However, this vast amount of information and hidden knowledge implicit in all of this data could be utilized more efficiently. With the help of data mining techniques unknown relationships can be systematically discovered. The production of semiconductors is a highly complex process, which entails several subprocesses that employ a diverse array of equipment. The size of the semiconductors signifies a high number of units can be produced, which require huge amounts of data in order to be able to control and improve the semiconductor manufacturing process. Therefore, in this paper a structured review is made through a sample of 137 papers of the published articles in the scientific community regarding data mining applications in semiconductor manufacturing. A detailed bibliometric analysis is also made. All data mining applications are classified in function of the application area. The results are then analyzed and conclusions are drawn.publishersversionpublishe

Design, processing and testing of LSI arrays, hybrid microelectronics task

Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated

Adaptive Data Mining Approach for Pcb Defect Detection and Classification

Objective: To develop a model for PCB defect detection and classification with the help of soft computing technique. Methodology: To improve the performance of the prediction and classification we propose a hybrid approach for feature reduction and classification. The proposed approach is divided into three main stages: (i) data pre-processing (ii) feature selection and reduction and (iii) Classification. In this approach, pre-processing, feature selection and reduction is carried out by measuring of confidence with the adaptive genetic algorithm. Prediction and classification is carried out by using neural network classifier. A genetic algorithm is used for data preprocessing to achieve the feature reduction and confidence measurement. Findings: The system is implemented using MatLab 2013b. The resulting analysis shows that the proposed approach is capable of detecting and classifying defects in PCB board

Data mining in manufacturing: a review based on the kind of knowledge

In modern manufacturing environments, vast amounts of data are collected in database management systems and data warehouses from all involved areas, including product and process design, assembly, materials planning, quality control, scheduling, maintenance, fault detection etc. Data mining has emerged as an important tool for knowledge acquisition from the manufacturing databases. This paper reviews the literature dealing with knowledge discovery and data mining applications in the broad domain of manufacturing with a special emphasis on the type of functions to be performed on the data. The major data mining functions to be performed include characterization and description, association, classification, prediction, clustering and evolution analysis. The papers reviewed have therefore been categorized in these five categories. It has been shown that there is a rapid growth in the application of data mining in the context of manufacturing processes and enterprises in the last 3 years. This review reveals the progressive applications and existing gaps identified in the context of data mining in manufacturing. A novel text mining approach has also been used on the abstracts and keywords of 150 papers to identify the research gaps and find the linkages between knowledge area, knowledge type and the applied data mining tools and techniques

R&D Paths of Pixel Detectors for Vertex Tracking and Radiation Imaging

This report reviews current trends in the R&D of semiconductor pixellated sensors for vertex tracking and radiation imaging. It identifies requirements of future HEP experiments at colliders, needed technological breakthroughs and highlights the relation to radiation detection and imaging applications in other fields of science.Comment: 17 pages, 2 figures, submitted to the European Strategy Preparatory Grou

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Intelligent shop scheduling for semiconductor manufacturing

Semiconductor market sales have expanded massively to more than 200 billion dollars annually accompanied by increased pressure on the manufacturers to provide higher quality products at lower cost to remain competitive. Scheduling of semiconductor manufacturing is one of the keys to increasing productivity, however the complexity of manufacturing high capacity semiconductor devices and the cost considerations mean that it is impossible to experiment within the facility. There is an immense need for effective decision support models, characterizing and analyzing the manufacturing process, allowing the effect of changes in the production environment to be predicted in order to increase utilization and enhance system performance. Although many simulation models have been developed within semiconductor manufacturing very little research on the simulation of the photolithography process has been reported even though semiconductor manufacturers have recognized that the scheduling of photolithography is one of the most important and challenging tasks due to complex nature of the process. Traditional scheduling techniques and existing approaches show some benefits for solving small and medium sized, straightforward scheduling problems. However, they have had limited success in solving complex scheduling problems with stochastic elements in an economic timeframe. This thesis presents a new methodology combining advanced solution approaches such as simulation, artificial intelligence, system modeling and Taguchi methods, to schedule a photolithography toolset. A new structured approach was developed to effectively support building the simulation models. A single tool and complete toolset model were developed using this approach and shown to have less than 4% deviation from actual production values. The use of an intelligent scheduling agent for the toolset model shows an average of 15% improvement in simulated throughput time and is currently in use for scheduling the photolithography toolset in a manufacturing plant

Yield and Reliability Analysis for Nanoelectronics

As technology has continued to advance and more break-through emerge, semiconductor devices with dimensions in nanometers have entered into all spheres of our lives. Accordingly, high reliability and high yield are very much a central concern to guarantee the advancement and utilization of nanoelectronic products. However, there appear to be some major challenges related to nanoelectronics in regard to the field of reliability: identification of the failure mechanisms, enhancement of the low yields of nano products, and management of the scarcity and secrecy of available data [34]. Therefore, this dissertation investigates four issues related to the yield and reliability of nanoelectronics. Yield and reliability of nanoelectronics are affected by defects generated in the manufacturing processes. An automatic method using model-based clustering has been developed to detect the defect clusters and identify their patterns where the distribution of the clustered defects is modeled by a new mixture distribution of multivariate normal distributions and principal curves. The new mixture model is capable of modeling defect clusters with amorphous, curvilinear, and linear patterns. We evaluate the proposed method using both simulated and experimental data and promising results have been obtained. Yield is one of the most important performance indexes for measuring the success of nano fabrication and manufacturing. Accurate yield estimation and prediction is essential for evaluating productivity and estimating production cost. This research studies advanced yield modeling approaches which consider the spatial variations of defects or defect counts. Results from real wafer map data show that the new yield models provide significant improvement in yield estimation compared to the traditional Poisson model and negative binomial model. The ultra-thin SiO2 is a major factor limiting the scaling of semiconductor devices. High-k gate dielectric materials such as HfO2 will replace SiO2 in future generations of MOS devices. This study investigates the two-step breakdown mechanisms and breakdown sequences of double-layered high-k gate stacks by monitoring the relaxation of the dielectric films. The hazard rate is a widely used metric for measuring the reliability of electronic products. This dissertation studies the hazard rate function of gate dielectrics breakdown. A physically feasible failure time distribution is used to model the time-to-breakdown data and a Bayesian approach is adopted in the statistical analysis

Bubble memory module

Design, fabrication and test of partially populated prototype recorder using 100 kilobit serial chips is described. Electrical interface, operating modes, and mechanical design of several module configurations are discussed. Fabrication and test of the module demonstrated the practicality of multiplexing resulting in lower power, weight, and volume. This effort resulted in the completion of a module consisting of a fully engineered printed circuit storage board populated with 5 of 8 possible cells and a wire wrapped electronics board. Interface of the module is 16 bits parallel at a maximum of 1.33 megabits per second data rate on either of two interface buses