13 research outputs found

    3D-Integrated Multi-Sensor Demonstrator System for Environmental Monitoring

    No full text
    This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system

    3D-integrated multi-sensor demonstrator system for environmental monitoring

    No full text
    This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system

    3D-integrated multi-sensor demonstrator system for environmental monitoring

    No full text
    \u3cp\u3eThis paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.\u3c/p\u3
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