6,760 research outputs found
A review of advances in pixel detectors for experiments with high rate and radiation
The Large Hadron Collider (LHC) experiments ATLAS and CMS have established
hybrid pixel detectors as the instrument of choice for particle tracking and
vertexing in high rate and radiation environments, as they operate close to the
LHC interaction points. With the High Luminosity-LHC upgrade now in sight, for
which the tracking detectors will be completely replaced, new generations of
pixel detectors are being devised. They have to address enormous challenges in
terms of data throughput and radiation levels, ionizing and non-ionizing, that
harm the sensing and readout parts of pixel detectors alike. Advances in
microelectronics and microprocessing technologies now enable large scale
detector designs with unprecedented performance in measurement precision (space
and time), radiation hard sensors and readout chips, hybridization techniques,
lightweight supports, and fully monolithic approaches to meet these challenges.
This paper reviews the world-wide effort on these developments.Comment: 84 pages with 46 figures. Review article.For submission to Rep. Prog.
Phy
Pixel Detectors for Charged Particles
Pixel Detectors, as the current technology of choice for the innermost vertex
detection, have reached a stage at which large detectors have been built for
the LHC experiments and a new era of developments, both for hybrid and for
monolithic or semi-monolithic pixel detectors is in full swing. This is largely
driven by the requirements of the upgrade programme for the superLHC and by
other collider experiments which plan to use monolithic pixel detectors for the
first time. A review on current pixel detector developments for particle
tracking and vertexing is given, comprising hybrid pixel detectors for superLHC
with its own challenges in radiation and rate, as well as on monolithic,
so-called active pixel detectors, including MAPS and DEPFET pixels for RHIC and
superBelle.Comment: 19 pages, 23 drawings in 14 figure
R&D Paths of Pixel Detectors for Vertex Tracking and Radiation Imaging
This report reviews current trends in the R&D of semiconductor pixellated
sensors for vertex tracking and radiation imaging. It identifies requirements
of future HEP experiments at colliders, needed technological breakthroughs and
highlights the relation to radiation detection and imaging applications in
other fields of science.Comment: 17 pages, 2 figures, submitted to the European Strategy Preparatory
Grou
Advances on CMOS image sensors
This paper offers an introduction to the technological advances of image sensors designed using
complementary metal–oxide–semiconductor (CMOS) processes along the last decades. We review
some of those technological advances and examine potential disruptive growth directions for CMOS
image sensors and proposed ways to achieve them. Those advances include breakthroughs on
image quality such as resolution, capture speed, light sensitivity and color detection and advances on
the computational imaging. The current trend is to push the innovation efforts even further as the
market requires higher resolution, higher speed, lower power consumption and, mainly, lower cost
sensors. Although CMOS image sensors are currently used in several different applications from
consumer to defense to medical diagnosis, product differentiation is becoming both a requirement and
a difficult goal for any image sensor manufacturer. The unique properties of CMOS process allows the
integration of several signal processing techniques and are driving the impressive advancement of the
computational imaging. With this paper, we offer a very comprehensive review of methods,
techniques, designs and fabrication of CMOS image sensors that have impacted or might will impact
the images sensor applications and markets
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Near-Zero-Power Temperature Sensing via Tunneling Currents Through Complementary Metal-Oxide-Semiconductor Transistors.
Temperature sensors are routinely found in devices used to monitor the environment, the human body, industrial equipment, and beyond. In many such applications, the energy available from batteries or the power available from energy harvesters is extremely limited due to limited available volume, and thus the power consumption of sensing should be minimized in order to maximize operational lifetime. Here we present a new method to transduce and digitize temperature at very low power levels. Specifically, two pA current references are generated via small tunneling-current metal-oxide-semiconductor field effect transistors (MOSFETs) that are independent and proportional to temperature, respectively, which are then used to charge digitally-controllable banks of metal-insulator-metal (MIM) capacitors that, via a discrete-time feedback loop that equalizes charging time, digitize temperature directly. The proposed temperature sensor was integrated into a silicon microchip and occupied 0.15 mm2 of area. Four tested microchips were measured to consume only 113 pW with a resolution of 0.21 °C and an inaccuracy of ±1.65 °C, which represents a 628× reduction in power compared to prior-art without a significant reduction in performance
Characterisation of AMS H35 HV-CMOS monolithic active pixel sensor prototypes for HEP applications
Monolithic active pixel sensors produced in High Voltage CMOS (HV-CMOS)
technology are being considered for High Energy Physics applications due to the
ease of production and the reduced costs. Such technology is especially
appealing when large areas to be covered and material budget are concerned.
This is the case of the outermost pixel layers of the future ATLAS tracking
detector for the HL-LHC. For experiments at hadron colliders, radiation
hardness is a key requirement which is not fulfilled by standard CMOS sensor
designs that collect charge by diffusion. This issue has been addressed by
depleted active pixel sensors in which electronics are embedded into a large
deep implantation ensuring uniform charge collection by drift. Very first small
prototypes of hybrid depleted active pixel sensors have already shown a
radiation hardness compatible with the ATLAS requirements. Nevertheless, to
compete with the present hybrid solutions a further reduction in costs
achievable by a fully monolithic design is desirable. The H35DEMO is a large
electrode full reticle demonstrator chip produced in AMS 350 nm HV-CMOS
technology by the collaboration of Karlsruher Institut f\"ur Technologie (KIT),
Institut de F\'isica d'Altes Energies (IFAE), University of Liverpool and
University of Geneva. It includes two large monolithic pixel matrices which can
be operated standalone. One of these two matrices has been characterised at
beam test before and after irradiation with protons and neutrons. Results
demonstrated the feasibility of producing radiation hard large area fully
monolithic pixel sensors in HV-CMOS technology. H35DEMO chips with a substrate
resistivity of 200 cm irradiated with neutrons showed a radiation
hardness up to a fluence of ncm with a hit efficiency of
about 99% and a noise occupancy lower than hits in a LHC bunch
crossing of 25ns at 150V
Pixel Detectors
Pixel detectors for precise particle tracking in high energy physics have
been developed to a level of maturity during the past decade. Three of the LHC
detectors will use vertex detectors close to the interaction point based on the
hybrid pixel technology which can be considered the state of the art in this
field of instrumentation. A development period of almost 10 years has resulted
in pixel detector modules which can stand the extreme rate and timing
requirements as well as the very harsh radiation environment at the LHC without
severe compromises in performance. From these developments a number of
different applications have spun off, most notably for biomedical imaging.
Beyond hybrid pixels, a number of monolithic or semi-monolithic developments,
which do not require complicated hybridization but come as single sensor/IC
entities, have appeared and are currently developed to greater maturity. Most
advanced in terms of maturity are so called CMOS active pixels and DEPFET
pixels. The present state in the construction of the hybrid pixel detectors for
the LHC experiments together with some hybrid pixel detector spin-off is
reviewed. In addition, new developments in monolithic or semi-monolithic pixel
devices are summarized.Comment: 14 pages, 38 drawings/photographs in 21 figure
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