807 research outputs found

    Precision Dimensional Metrology Based on a Femtosecond Pulse Laser

    Get PDF

    Programmable spectral shaping to improve the measurement precision of frequency comb mode-resolved spectral interferometric ranging

    Full text link
    Comb-mode resolved spectral domain interferometry (CORE-SDI), which is capable of measuring length of kilometers or more with precision on the order of nanometers, is considered to be a promising technology for next-generation length standards, replacing laser displacement interferometers. In this study, we aim to improve the measurement precision of CORE-SDI using programmable spectral shaping. We report the generation of effectively broad and symmetric light sources through the programmable spectral shaping. The light source used here was generated by the spectrally-broadened electro-optic comb with a repetition rate of 17.5 GHz. Through the programmable spectral shaping, the optical spectrum was flattened within 1 dB, resulting in a square-shaped optical spectrum. As a result, the 3-dB spectral width was extended from 1.15 THz to 6.7 THz. We performed a comparison between the measurement results of various spectrum shapes. We confirmed an improvement in the measurement precision from 69 nm to 6 nm, which was also corroborated by numerical simulations. We believe that this study on enhancing the measurement precision of CORE-SDI through the proposed spectral shaping will make a significant contribution to reducing the measurement uncertainty of future CORE-SDI systems, thereby advancing the development of next-generation length standards.Comment: 22 pages, 10 figure

    Resting-State Glucose Metabolism Level Is Associated with the Regional Pattern of Amyloid Pathology in Alzheimer's Disease

    Get PDF
    It has been suggested that glucose metabolism within the brain's default network is directly associated with—and may even cause—the amyloid pathology of Alzheimer's disease (AD). Here we performed 2-[18F]fluoro-2-deoxy-D-glucose (FDG) and [11C]-labeled Pittsburgh Compound B (PIB) positron emission tomography (PET) on cognitively normal elderly subjects and on AD patients and conducted quantitative regional analysis of FDG- and PIB-PET images using an automated region of interest technique. We confirmed that resting glucose metabolism within the posterior components of the brain's default network is high in normal elderly subjects and low in AD patients, which is partially in agreement with the regional pattern of PIB uptake within the default network of AD patients. However, in several regions outside the default network, glucose metabolism was high in normal elderly subjects but was not depressed in AD patients, who exhibited significantly increased PIB uptakes in these regions. In contrast, the level of resting glucose metabolism in the default network and in regions outside the default network in normal elderly subjects was significantly correlated with the level of regional PIB uptake in AD patients. These results are discussed with experimental evidence suggesting that beta amyloid production and amyloid precursor protein regulation are dependent on neuronal activity

    Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays

    Get PDF
    Several techniques have been proposed for kerfless wafering of thin Si wafers, which is one of the most essential techniques for reducing Si material loss in conventional wafering methods to lower cell cost. Proton induced exfoliation is one of promising kerfless techniques due to the simplicity of the process of implantation and cleaving. However, for application to high efficiency solar cells, it is necessary to cope with some problems such as implantation damage removal and texturing of (111) oriented wafers. This study analyzes the end-of-range defects at both kerfless and donor wafers and ion cutting sites. Thermal treatment and isotropic etching processes allow nearly complete removal of implantation damages in the cleaved-thin wafers. Combining laser interference lithography and a reactive ion etch process, a facile nanoscale texturing process for the kerfless thin wafers of a (111) crystal orientation has been developed. We demonstrate that the introduction of nanohole array textures with an optimal design and complete damage removal lead to an improved efficiency of 15.2% based on the kerfless wafer of a 48 mu m thickness using the standard architecture of the Al back surface field

    Production of He-4 and (4) in Pb-Pb collisions at root(NN)-N-S=2.76 TeV at the LHC

    Get PDF
    Results on the production of He-4 and (4) nuclei in Pb-Pb collisions at root(NN)-N-S = 2.76 TeV in the rapidity range vertical bar y vertical bar <1, using the ALICE detector, are presented in this paper. The rapidity densities corresponding to 0-10% central events are found to be dN/dy4(He) = (0.8 +/- 0.4 (stat) +/- 0.3 (syst)) x 10(-6) and dN/dy4 = (1.1 +/- 0.4 (stat) +/- 0.2 (syst)) x 10(-6), respectively. This is in agreement with the statistical thermal model expectation assuming the same chemical freeze-out temperature (T-chem = 156 MeV) as for light hadrons. The measured ratio of (4)/He-4 is 1.4 +/- 0.8 (stat) +/- 0.5 (syst). (C) 2018 Published by Elsevier B.V.Peer reviewe

    A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices

    No full text
    Abstract Smart devices have been fabricated based on design concept of multiple layer structures which require through silicon vias to transfer electric signals between stacked layers. Because even a single defect leads to fail of the packaged devices, the dimensions of the through silicon vias are needed to be measured through whole sampling inspection process. For that, a novel hybrid optical probe working based on optical interferometry, confocal microscopy and optical microscopy was proposed and realized for enhancing inspection efficiency in this report. The optical microscope was utilized for coarsely monitoring the specimen in a large field of view, and the other methods of interferometry and confocal microscopy were used to measure dimensions of small features with high speed by eliminating time-consuming process of the vertical scanning. Owing to the importance of the reliability, the uncertainty evaluation of the proposed method was fulfilled, which offers a practical example for estimating the performance of inspection machines operating with numerous principles at semiconductor manufacturing sites. According to the measurement results, the mean values of the diameter and depth were 40.420 µm and 5.954 µm with the expanded uncertainty of 0.050 µm (k = 2) and 0.208 µm (k = 2), respectively
    corecore