Creating sustainable cities one building at a time: towards an integrated urban design framework

One of the tenets of urban sustainability is that more compact urban forms that are more densely occupied are more efficient in their overall use of space and of energy. In many designs this has been translates into high-rise buildings with a focus on energy management at their outer envelopes. However, pursuing this building focused approach alone means that buildings are treated as stand-alone entities with minimal consideration to their impact on the surrounding urban landscape and vice versa. Where urban density is high, individual buildings interact with each other, reducing access to sunshine and daylight, obstructing airflow and raising outdoor air temperature. If/when each building pursues its own sustainability agenda without regard to its urban context, the result will diminish the natural energy resources available to nearby buildings and worsen the outdoor environment generally. This paper examines some of these urban impacts using examples from the City of London where rapid transformation is taking place as very tall buildings with exceptional energy credentials are being inserted into a low-rise city without a plan for the overall impact of urban form. The focus of the paper is on access to sunshine and wind and the wider implications of sustainable strategies that that focuses on individual buildings to the exclusion of the surrounding urban landscape. The work highlights the need for a framework that accounts for the synergistic outcomes that result from the mutual interactions of buildings in urban spaces

A Meta-study on the Thermal Properties of Carbon Nanotubes in Thermal Interface Materials

Computer Integrated Circuit (IC) microprocessors are becoming more powerful and densely packed while cooling mechanisms are seeing an equivalent improvement to compensate. A significant limit to cooling performance is thermal transfer between die and heatsink. In this meta study we evaluate carbon nanotube (CNT) thermal interface materials (TIMs) in order to determine how to maximise thermal transfer efficiency. We gathered information from over 15 articles focused on the thermodynamic parameters of CNT TIMs from databases such as Scopus, IEEE Xplore and ScienceDirect. Articles were filtered by key words including ‘carbon nanotubes’ and ‘thermal interface materials’ to identify scientific articles relevant to our research on TIMs. From our meta study we have found that enhancing CNTs will provide the best improvement in TIMs. The parameters analysed to determine TIM performance included thermal resistance, thermal conductivity and the effect of CNT concentration on computer operation time. Through our investigation we understood that increasing the concentration of CNT from 0 to 2 wt % increases the operation time from 75 seconds at 66°C to 200s at 63°C as well as increasing the thermal conductivity by 1.82 times for the AS5 thermal paste with 2 wt % CNT. Furthermore, CNT TIM pastes with less thickness have a lower thermal resistance of 0.4 K/W. However not all these parameters have been tested with computer chips. This means that in order to increase current heat transfer efficiency limit, we must integrate these parameters into experimental models. Keywords: Thermal Interface Material; Thermal Paste; Carbon Nanotubes; Thermal Transfer Efficiency; Integrated Circuit; Heat Sink; Heat Dissipation

Design, fabrication, and characterization of a compact hierarchical manifold microchannel heat sink array for two-phase cooling

High-heat-flux removal is critical for the nextgeneration electronic devices to reliably operate within their temperature limits. A large portion of the thermal resistance in a traditional chip package is caused by thermal resistances at interfaces between the device, heat spreaders, and the heat sink; embedding the heat sink directly into the heat-generating device can eliminate these interface resistances and drastically reduce the overall thermal resistance. Microfluidic cooling within the embedded heat sink improves the heat dissipation, with two-phase operation offering the potential for dissipation of very high heat fluxes while maintaining moderate chip temperatures. To enable multichip stacking and other heterogeneous packaging approaches, it is important to densely integrate all fluid flow paths into the device; volumetric heat dissipation emerges as a performance metric in this new heat sinking paradigm. In this paper, a compact hierarchical manifold microchannel design is presented that utilizes an integrated multilevel manifold distributor to feed coolant to an array of microchannel heat sinks. The flow features in the manifold layers and microchannels are fabricated in silicon wafers using deep reactive-ion etching. The heat source is simulated via Joule heating using thin-film platinum heaters. The on-chip spatial temperature measurements are made using four-wire resistance temperature detectors. The individual manifold layers and the microchannel-bearing wafers are diced and bonded into a sealed stack via thermocompression bonding using gold layers at the mating surfaces. Thermal and hydrodynamic testing is performed by pumping the dielectric fluid HFE-7100 through the device at a known flow rate

Directed Placement for mVLSI Devices

Continuous-flow microfluidic devices based on integrated channel networks are becoming increasingly prevalent in research in the biological sciences. At present, these devices are physically laid out by hand by domain experts who understand both the underlying technology and the biological functions that will execute on fabricated devices. The lack of a design science that is specific to microfluidic technology creates a substantial barrier to entry. To address this concern, this article introduces Directed Placement, a physical design algorithm that leverages the natural "directedness" in most modern microfluidic designs: fluid enters at designated inputs, flows through a linear or tree-based network of channels and fluidic components, and exits the device at dedicated outputs. Directed placement creates physical layouts that share many principle similarities to those created by domain experts. Directed placement allows components to be placed closer to their neighbors compared to existing layout algorithms based on planar graph embedding or simulated annealing, leading to an average reduction in laid-out fluid channel length of 91% while improving area utilization by 8% on average. Directed placement is compatible with both passive and active microfluidic devices and is compatible with a variety of mainstream manufacturing technologies

Array atomic force microscopy for real-time multiparametric analysis.

Nanoscale multipoint structure-function analysis is essential for deciphering the complexity of multiscale biological and physical systems. Atomic force microscopy (AFM) allows nanoscale structure-function imaging in various operating environments and can be integrated seamlessly with disparate probe-based sensing and manipulation technologies. Conventional AFMs only permit sequential single-point analysis; widespread adoption of array AFMs for simultaneous multipoint study is challenging owing to the intrinsic limitations of existing technological approaches. Here, we describe a prototype dispersive optics-based array AFM capable of simultaneously monitoring multiple probe-sample interactions. A single supercontinuum laser beam is utilized to spatially and spectrally map multiple cantilevers, to isolate and record beam deflection from individual cantilevers using distinct wavelength selection. This design provides a remarkably simplified yet effective solution to overcome the optical cross-talk while maintaining subnanometer sensitivity and compatibility with probe-based sensors. We demonstrate the versatility and robustness of our system on parallel multiparametric imaging at multiscale levels ranging from surface morphology to hydrophobicity and electric potential mapping in both air and liquid, mechanical wave propagation in polymeric films, and the dynamics of living cells. This multiparametric, multiscale approach provides opportunities for studying the emergent properties of atomic-scale mechanical and physicochemical interactions in a wide range of physical and biological networks

R&D Paths of Pixel Detectors for Vertex Tracking and Radiation Imaging

This report reviews current trends in the R&D of semiconductor pixellated sensors for vertex tracking and radiation imaging. It identifies requirements of future HEP experiments at colliders, needed technological breakthroughs and highlights the relation to radiation detection and imaging applications in other fields of science.Comment: 17 pages, 2 figures, submitted to the European Strategy Preparatory Grou