Impact of package parasitics on crosstalk in mixed-signal ICs

This paper presents an approach for the analysis and the experimental evaluation of crosstalk effects due to current pulses drawn from voltage supplies in mixed analog-digital CMOS integrated circuits. A realistic model of bonding and package parasitics has been derived to study digital switching noise injected through bonding interconnections. Simulations results indicate that disturbances due to switching currents in digital blocks propagate through the substrate and affect analog voltages, thus degrading circuit performance. Test structures have been integrated into a test chip mounted with different technologies, in order to compare the measurements on test chips. Measurements confirm simulation results. Chip-on-board mounting technology has better performance with respect to chip-in-package, due to the reduction of parasitic elements

Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].

Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation

High-speed communication circuits: voltage control oscillators and VCO-derived filters

Voltage Controlled Oscillators (VCO) and filters are the two main topics of focus in this dissertation.;A temperature and process compensated VCO, which is designed to operate at 2 GHz, and whose frequency variation due to incoming data is limited to 1% of its center frequency was presented. The test results show that, without process changes present, the frequency variation due to a temperature change over 0°C to 100°C is around 1.1% of its center frequency. This is a reduction of a factor of 10 when compared to the temperature variation of a conventional VCO.;A new method of designing continuous-time monolithic filters derived from well-known voltage controlled oscillators (VCOs) was introduced. These VCO-derived filters are capable of operating at very high frequencies in standard CMOS processes. Prototype low-pass and band-pass filters designed in a TSMC 0.25 mum process are discussed. Simulation results for the low-pass filter designed for a cutoff frequency of 4.3 GHz show a THD of -40 dB for a 200 mV peak-peak sinusoidal input. The band-pass filter has a resonant frequency programmable from 2.3 GHz to 3.1 GHz, a programmable Q from 3 to 85, and mid-band THD of -40 dB for an 80 mV peak-peak sinusoidal input signal.;A third contribution in this dissertation was the design of a new current mirror with accurate mirror gain for low beta bipolar transistors. High mirror gain accuracy is achieved by using a split-collector transistor to compensate for base currents of the source-coupled

Scintillator Pad Detector: Very Front End Electronics

El Laboratori d'Altes Energies de La Salle és un membre d'un grup acreditat per la Generalitat. Aquest grup està format per part del Departament d'Estructura i Constituents de la Matèria de la Facultat de Física de la Universitat de Barcelona, part del departament d'Electrònica de la mateixa Facultat i pel grup de La Salle. Tots ells estan involucrats en el disseny d'un subdetector en l'experiment de LHCb del CERN: el SPD (Scintillator Pad Detector). El SPD és part del Calorímetre de LHCb. Aquest sistema proporciona possibles hadrons d'alta energia, electrons i fotons pel primer nivell de trigger. El SPD està format per una làmina centellejeadora de plàstic, dividida en 600 cel.les de diferent tamany per obtenir una millor granularitat aprop del feix. Les partícules carregades que travessin el centellejador generaran una ionització del mateix, a diferència dels fotons que no la ionitzaran. Aquesta ionització, generarà un pols de llum que serà recollit per una WLS que està enrotllada dins de les cel.les centellejadores. La llum serà transmesa al sistema de lectura mitjançant fibres clares. Per reducció de costos, aquestes 6000 cel.les estan dividides en grups, usant MAPMT (fotomultiplicadors multiànode) de 64 canals per rebre la informació en el sistema de lectura. El senyal de sortida dels fotomultilplicadors és irregular degut al baix nivell de fotoestadística, uns 20-30 fotoelectrons per MIP, i degut també a la resposta de la fibra WLS, que té un temps de baixada lent. Degut a tot això, el processat del senyal, es realitza primer durant la integració de la càrrega total i finalment per la correcció de la cua que conté el senyal provinent del PMT. Aquesta Tesi està enfocada en el sistema de lectura de l'electrònica del VFE del SPD. Aquest, està format per un ASIC (dissenyat pel grup de la UB) encarregat d'integrar el senyal, compensar el senyal restant i comparar el nivell d'energia obtingut amb un llindar programable (fa la distinció entre electrons i fotons), una FPGA que programa aquests llindars i compensacions de cada ASIC i fa el mapeig de cada canal rebut en el detector i finalment usa serialitzadors LVDS per enviar la informació de sortida al trigger de primer nivell. En el disseny d'aquest tipus d'electrònica s'haurà de tenir en compte, per un costat, restriccions de tipus mecànic: l'espai disponible per l'electrònica és limitat i escàs, i per un altre costat, el nivell de radiació que deurà suportar és considerable i s'haurà de comprobar que tots els components superin un cert test de radiació, i finalment, també s'haurà de tenir en compte la distància que separa els VFE dels racks on la informació és enviada i el tipus de senyal amb el que es treballa en aquest tipus d'experiments: mixta i de poc rang.El Laboratorio de Altas Energías de la Salle es un miembro de un grupo acreditado por La Generalitat. Este grupo está formado por parte del departamento de Estructura i Constituents de la Matèria de la Facultad de Física de la Universidad de Barcelona, parte del departamento de Electrónica de la misma Facultad y el grupo de La Salle. Todos ellos están involucrados en el diseño de un subdetector en el experimento de LHCb del CERN: El SPD (Scintillator Pad Detector). El SPD es parte del Calorímetro de LHCb. Este sistema proporciona posibles hadrones de alta energía, electrones y fotones para el primer nivel de trigger.El SPD está diseñado para distinguir entre electrones y fotones para el trigger de primer nivel. Este detector está formado por una lámina centelleadora de plástico, dividida en 6000 celdas de diferente tamaño para obtener una mejor granularidad cerca del haz. Las partículas cargadas que atraviesen el centelleador generarán una ionización del mismo, a diferencia de los fotones que no la generarán. Esta ionización generará, a su vez, un pulso de luz que será recogido por una WLS que está enrollada dentro de las celdas centelleadoras. La luz será transmitida al sistema de lectura mediante fibras claras. Para reducción de costes, estas 6000 celdas están divididas en grupos, utilizando un MAPMT (fotomultiplicadores multiánodo) de 64 canales para recibir la información en el sistema de lectura. La señal de salida de los fotomultiplicadores es irregular debido al bajo nivel de fotoestadística, unos 20-30 fotoelectrones por MIP, y debido también a la respuesta de la fibra WLS, que tiene un tiempo de bajada lento. Debido a todo esto, el procesado de la señal, se realiza primero mediante la integración de la carga total y finalmente por la substracción de la señal restante fuera del período de integración. Esta Tesis está enfocada en el sistema de lectura de la electrónica del VFE del SPD. Éste, está formado por un ASIC (diseñado por el grupo de la UB) encargado de integrar la señal, compensar la señal restante y comparar el nivel de energía obtenido con un umbral programable (que distingue entre electrones y fotones), y una FPGA que programa estos umbrales y compensaciones de cada ASIC, y mapea cada uno de los canales recibidos en el detector y finalmente usa serializadores LVDS para enviar la información de salida al trigger de primer nivel. En el diseño de este tipo de electrónica se deberá tener en cuenta, por un lado, restricciones del tipo mecánico: el espacio disponible para la electrónica en sí, es limitado y escaso, por otro lado, el nivel de radiación que deberá soportar es considerable y se tendrá que comprobar que todos los componentes usado superen un cierto test de radiación, y finalmente, también se deberá tener en cuenta la distancia que separa los VFE de los racks dónde la información es enviada y el tipo de señal con el que se trabaja en este tipo de experimentos: mixta y de poco rango.Laboratory in La Salle is a member of a Credited Research Group by La Generatitat. This group is formed by a part of the ECM department, a part of the Electronics department at UB (University of Barcelona) and La Salle's group. Together, they are involved in the design of a subdetector at LHCb Experiment at CERN: the SPD (Scintillator Pad Detector). The SPD is a part of LHCb Calorimeter. That system provides high energy hadrons, electron and photons candidates for the first level trigger. The SPD is designed to distinguish electrons and photons for this first level trigger. This detector is a plastic scintillator layer, divided in about 6000 cells of different size to obtain better granularity near the beam. Charged particles will produce, and photons will not, ionisation on the scintillator. This ionisation generates a light pulse that is collected by a Wavelength Shifting (WLS) fibre that is twisted inside the scintillator cell. The light is transmitted through a clear fibre to the readout system. For cost reduction, these 6000 cells are divided in groups using a MAPMT of 64 channels for receiving information in the readout system. The signal outing the SPD PMTs is rather unpredictable as a result of the low number of photostatistics, 20-30 photoelectrons per MIP, and the due to the response of the WLS fibre, which has low decay time. Then, the signal processing must be performed by first integrating the total charge and later subtracting to avoid pile-up. This PhD is focused on the VFE (Very Front End) of SPD Readout system. It is performed by a specific ASIC (designed by the UB group) which integrates the signal, makes the pile-up compensation, and compares the level obtained to a programmable threshold (distinguishing electrons and photons), an FPGA which programs the ASIC thresholds, pile-up subtraction and mapping the channels in the detector and finally LVDS serializers, in order to send information to the first level trigger system. Not only mechanical constraints had to be taken into account in the design of the card as a result of the little space for the readout electronics but also, on one hand, the radiation quote expected in the environment and on the other hand, the distance between the VFE electronics and the racks were information is sent and the signal range that this kind of experiments usually have

The ALICE TPC, a large 3-dimensional tracking device with fast readout for ultra-high multiplicity events

The design, construction, and commissioning of the ALICE Time-Projection Chamber (TPC) is described. It is the main device for pattern recognition, tracking, and identification of charged particles in the ALICE experiment at the CERN LHC. The TPC is cylindrical in shape with a volume close to 90 m^3 and is operated in a 0.5 T solenoidal magnetic field parallel to its axis. In this paper we describe in detail the design considerations for this detector for operation in the extreme multiplicity environment of central Pb--Pb collisions at LHC energy. The implementation of the resulting requirements into hardware (field cage, read-out chambers, electronics), infrastructure (gas and cooling system, laser-calibration system), and software led to many technical innovations which are described along with a presentation of all the major components of the detector, as currently realized. We also report on the performance achieved after completion of the first round of stand-alone calibration runs and demonstrate results close to those specified in the TPC Technical Design Report.Comment: 55 pages, 82 figure

Electromagnetic Interference and Compatibility

Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials

Optoelectronic devices and packaging for information photonics

This thesis studies optoelectronic devices and the integration of these components onto optoelectronic multi chip modules (OE-MCMs) using a combination of packaging techniques. For this project, (1×12) array photodetectors were developed using PIN diodes with a GaAs/AlGaAs strained layer structure. The devices had a pitch of 250μm, operated at a wavelength of 850nm. Optical characterisation experiments of two types of detector arrays (shoe and ring) were successfully performed. Overall, the shoe devices achieved more consistent results in comparison with ring diodes, i.e. lower dark current and series resistance values. A decision was made to choose the shoe design for implementation into the high speed systems demonstrator. The (1x12) VCSEL array devices were the optical sources used in my research. This was an identical array at 250μm pitch configuration used in order to match the photodetector array. These devices had a wavelength of 850nm. Optoelectronic testing of the VCSEL was successfully conducted, which provided good beam profile analysis and I-V-P measurements of the VCSEL array. This was then implemented into a simple demonstrator system, where eye diagrams examined the systems performance and characteristics of the full system and showed positive results. An explanation was given of the following optoelectronic bonding techniques: Wire bonding and flip chip bonding with its associated technologies, i.e. Solder, gold stud bump and ACF. Also, technologies, such as ultrasonic flip chip bonding and gold micro-post technology were looked into and discussed. Experimental work implementing these methods on packaging the optoelectronic devices was successfully conducted and described in detail. Packaging of the optoelectronic devices onto the OEMCM was successfully performed. Electrical tests were successfully carried out on the flip chip bonded VCSEL and Photodetector arrays. These results verified that the devices attached on the MCM achieved good electrical performance and reliable bonding. Finally, preliminary testing was conducted on the fully assembled OE-MCMs. The aim was to initially power up the mixed signal chip (VCSEL driver), and then observe the VCSEL output