CAD methodologies for low power and reliable 3D ICs

The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answer to the device scaling and interconnect problems that industry faces today. Yet, since multiple dies are stacked vertically in 3D ICs, new problems arise such as thermal, power delivery, and so on. New physical design methodologies and optimization techniques should be developed to address the problems and exploit the design freedom in 3D ICs. Towards the objective, this dissertation includes four research projects. The first project is on the co-optimization of traditional design metrics and reliability metrics for 3D ICs. It is well known that heat removal and power delivery are two major reliability concerns in 3D ICs. To alleviate thermal problem, two possible solutions have been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic-channel (MFC) based cooling. For power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. In this project, a co-optimization methodology for signal, power, and thermal interconnects in 3D ICs is presented. The goal of the proposed approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space explorations for early design stages. The second project is a study on 3D IC partition. For a 3D IC, the target circuit needs to be partitioned into multiple parts then mapped onto the dies. The partition style impacts design quality such as footprint, wirelength, timing, and so on. In this project, the design methodologies of 3D ICs with different partition styles are demonstrated. For the LEON3 multi-core microprocessor, three partitioning styles are compared: core-level, block-level, and gate-level. The design methodologies for such partitioning styles and their implications on the physical layout are discussed. Then, to perform timing optimizations for 3D ICs, two timing constraint generation methods are demonstrated that lead to different design quality. The third project is on the buffer insertion for timing optimization of 3D ICs. For high performance 3D ICs, it is crucial to perform thorough timing optimizations. Among timing optimization techniques, buffer insertion is known to be the most effective way. The TSVs have a large parasitic capacitance that increases the signal slew and the delay on the downstream. In this project, a slew-aware buffer insertion algorithm is developed that handles full 3D nets and considers TSV parasitics and slew effects on delay. Compared with the well-known van Ginneken algorithm and a commercial tool, the proposed algorithm finds buffering solutions with lower delay values and acceptable runtime overhead. The last project is on the ultra-high-density logic designs for monolithic 3D ICs. The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high-density device integration at the individual transistor-level. The benefits and challenges of monolithic 3D integration technology for logic designs are investigated. First, a 3D standard cell library for transistor-level monolithic 3D ICs is built and their timing and power behavior are characterized. Then, various interconnect options for monolithic 3D ICs that improve design quality are explored. Next, timing-closed, full-chip GDSII layouts are built and iso-performance power comparisons with 2D IC designs are performed. Important design metrics such as area, wirelength, timing, and power consumption are compared among transistor-level monolithic 3D, gate-level monolithic 3D, TSV-based 3D, and traditional 2D designs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin; Committee Member: Mukhopadhyay, Saiba

Multipurpose Programmable Integrated Photonics: Principles and Applications

[ES] En los últimos años, la fotónica integrada programable ha evolucionado desde considerarse un paradigma nuevo y prometedor para implementar la fotónica a una escala más amplia hacia convertirse una realidad sólida y revolucionaria, capturando la atención de numerosos grupos de investigación e industrias. Basada en el mismo fundamento teórico que las matrices de puertas lógicas programables en campo (o FPGAs, en inglés), esta tecnología se sustenta en la disposición bidimensional de bloques unitarios de lógica programable (en inglés: PUCs) que -mediante una programación adecuada de sus actuadores de fase- pueden implementar una gran variedad de funcionalidades que pueden ser elaboradas para operaciones básicas o más complejas en muchos campos de aplicación como la inteligencia artificial, el aprendizaje profundo, los sistemas de información cuántica, las telecomunicaciones 5/6-G, en redes de conmutación, formando interconexiones en centros de datos, en la aceleración de hardware o en sistemas de detección, entre otros. En este trabajo, nos dedicaremos a explorar varias aplicaciones software de estos procesadores en diferentes diseños de chips. Exploraremos diferentes enfoques de vanguardia basados en la optimización computacional y la teoría de grafos para controlar y configurar con precisión estos dispositivos. Uno de estos enfoques, la autoconfiguración, consiste en la síntesis automática de circuitos ópticos -incluso en presencia de efectos parasitarios como distribuciones de pérdidas no uniformes a lo largo del diseño hardware, o bajo interferencias ópticas y eléctricas- sin conocimiento previo sobre el estado del dispositivo. Hay ocasiones, sin embargo, en las que el acceso a esta información puede ser útil. Las herramientas de autocalibración y autocaracterización nos permiten realizar una comprobación rápida del estado de nuestro procesador fotónico, lo que nos permite extraer información útil como la corriente eléctrica que suministrar a cada actuador de fase para cambiar el estado de su PUC correspondiente, o las pérdidas de inserción de cada unidad programable y de las interconexiones ópticas que rodean a la estructura. Estos mecanismos no solo nos permiten identificar rápidamente cualquier PUC o región del chip defectuosa en nuestro diseño, sino que también revelan otra alternativa para programar circuitos fotónicos en nuestro diseño a partir de valores de corriente predefinidos. Estas estrategias constituyen un paso significativo para aprovechar todo el potencial de estos dispositivos. Proporcionan soluciones para manejar cientos de variables y gestionar simultáneamente múltiples acciones de configuración, una de las principales limitaciones que impiden que esta tecnología se extienda y se convierta en disruptiva en los próximos años.[CA] En els darrers anys, la fotònica integrada programable ha evolucionat des de considerarse un paradigma nou i prometedor per implementar la fotònica a una escala més ampla cap a convertir-se en una realitat sòlida i revolucionària, capturant l'atenció de nombrosos grups d'investigaciò i indústries. Basada en el mateix fonament teòric que les matrius de portes lògiques programable en camp (o FPGAs, en anglès), aquesta tecnología es sustenta en la disposición bidimensional de blocs units lògics programables (en anglès: PUCs) que -mitjançant una programación adequada dels seus actuadors de fase- poden implementar una gran varietat de funcionalitats que poden ser elaborades per a operacions bàsiques o més complexes en molts camps d'aplicació com la intel·ligència artificial, l'aprenentatge profund, els sistemes d'informació quàntica, les telecomunicacions 5/6-G, en xarxes de comutació, formant interconnexions en centres de dades, en l'acceleració de hardware o en sistemes de detecció, entre d'altres. En aquest treball, ens dedicarem a explorar diverses capatitats de programari d'aquests processadors en diferents dissenys de xips. Explorem diferents enfocaments de vanguardia basats en l'optimització computacional i la teoría de grafs per controlar i configurar amb precisió aquests dispositius. Un d'aquests enfocaments, l'autoconfiguració, tracta de la síntesi automática de circuits òptics -fins i tot en presencia d'efectes parasitaris com ara pèrdues no uniformes o crosstalk òptic i elèctric- sense cap coneixement previ sobre l'estat del dispositiu. Tanmateix, hi ha ocasions en les quals l'accés a aquesta información pot ser útil. Les eines d'autocalibració i autocaracterització ens permeten realizar una comprovació ràpida de l'estat del nostre procesador fotònic, el que ens permet obtener informació útil com la corrent eléctrica necessària per alimentar cada actuador de fase per canviar l'estat del seu PUC corresponent o la pèrdua d'inserció de cada unitat programable i de les interconnexions òptiques que envolten l'estructura. Aquests mecanisms no només ens permeten identificar ràpidament qualsevol PUC o área del xip defectuosa en el nostre disseny , sinó que també ens mostren una altra alternativa per programar circuits fotònics en el nostre disseny a partir de valors de corrent predefinits. Aquestes estratègies constitueixen un pas gegant per a aprofitar tot el potencial d'aquests dispositius. Proporcionen solucions per a gestionar centenars de variables i alhora administrar múltiples accions de configuració, una de les principals limitacions que impideixen que aquesta tecnología esdevingui disruptiva en els pròxims anys.[EN] In recent years, programmable integrated photonics (PIP) has evolved from a promising, new paradigm to deploy photonics to a larger scale to a solid, revolutionary reality, bringing up the attention of numerous research and industry players. Based on the same theoretical foundations than field-programmable gate arrays (FPGAs), this technology relies on common, two-dimensional integrated optical hardware configurations based on the interconnection of programmable unit cells (PUCs), which -by suitable programming of their phase actuators- can implement a variety of functionalities that can be elaborated for basic or more complex operation in many application fields, such as artificial intelligence, deep learning, quantum information systems, 5/6-G telecommunications, switching, data center interconnections, hardware acceleration and sensing, amongst others. In this work, we will dedicate ourselves to explore several software capabilities of these processors under different chip designs. We explore different cutting-edge approaches based on computational optimization and graph theory to precisely control and configure these devices. One of these, self-configuration, deals with the automated synthesis of optical circuit configurations -even in presence of parasitic effects such as nonuniform losses, optical and electrical crosstalk- without any need for prior knowledge about hardware state. There are occasions, though, in which accessing to this information may be of use. Self-calibration and self-characterization tools allow us to perform a quick check to our photonic processor's status, allowing us to retrieve useful pieces of information such as the electrical current needed to supply to each phase actuator to change its corresponding PUC state arbitrarily or the insertion loss of every unit cell and optical interconnection surrounding the structure. These mechanisms not only allow us to quickly identify any malfunctioning PUCs or chip areas in our design, but also reveal another alternative to program photonic circuits in our design from current pre-sets. These strategies constitute a gigantic step to unleash all the potential of these devices. They provide solutions to handle with hundreds of variables and simultaneously manage multiple configuration actions, one of the main limitations that prevent this technology to scale up and become disruptive in the years to come.López Hernández, A. (2023). Multipurpose Programmable Integrated Photonics: Principles and Applications [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/19686

Energy consumption in networks on chip : efficiency and scaling

Computer architecture design is in a new era where performance is increased by replicating processing cores on a chip rather than making CPUs larger and faster. This design strategy is motivated by the superior energy efficiency of the multi-core architecture compared to the traditional monolithic CPU. If the trend continues as expected, the number of cores on a chip is predicted to grow exponentially over time as the density of transistors on a die increases. A major challenge to the efficiency of multi-core chips is the energy used for communication among cores over a Network on Chip (NoC). As the number of cores increases, this energy also increases, imposing serious constraints on design and performance of both applications and architectures. Therefore, understanding the impact of different design choices on NoC power and energy consumption is crucial to the success of the multi- and many-core designs. This dissertation proposes methods for modeling and optimizing energy consumption in multi- and many-core chips, with special focus on the energy used for communication on the NoC. We present a number of tools and models to optimize energy consumption and model its scaling behavior as the number of cores increases. We use synthetic traffic patterns and full system simulations to test and validate our methods. Finally, we take a step back and look at the evolution of computer hardware in the last 40 years and, using a scaling theory from biology, present a predictive theory for power-performance scaling in microprocessor systems