79,982 research outputs found

    On Micromechanical Parameter Identification With Integrated DIC and the Role of Accuracy in Kinematic Boundary Conditions

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    Integrated Digital Image Correlation (IDIC) is nowadays a well established full-field experimental procedure for reliable and accurate identification of material parameters. It is based on the correlation of a series of images captured during a mechanical experiment, that are matched by displacement fields derived from an underlying mechanical model. In recent studies, it has been shown that when the applied boundary conditions lie outside the employed field of view, IDIC suffers from inaccuracies. A typical example is a micromechanical parameter identification inside a Microstructural Volume Element (MVE), whereby images are usually obtained by electron microscopy or other microscopy techniques but the loads are applied at a much larger scale. For any IDIC model, MVE boundary conditions still need to be specified, and any deviation or fluctuation in these boundary conditions may significantly influence the quality of identification. Prescribing proper boundary conditions is generally a challenging task, because the MVE has no free boundary, and the boundary displacements are typically highly heterogeneous due to the underlying microstructure. The aim of this paper is therefore first to quantify the effects of errors in the prescribed boundary conditions on the accuracy of the identification in a systematic way. To this end, three kinds of mechanical tests, each for various levels of material contrast ratios and levels of image noise, are carried out by means of virtual experiments. For simplicity, an elastic compressible Neo-Hookean constitutive model under plane strain assumption is adopted. It is shown that a high level of detail is required in the applied boundary conditions. This motivates an improved boundary condition application approach, which considers constitutive material parameters as well as kinematic variables at the boundary of the entire MVE as degrees of freedom in...Comment: 37 pages, 25 figures, 2 tables, 2 algorithm

    One-step deposition of nano-to-micron-scalable, high-quality digital image correlation patterns for high-strain in-situ multi-microscopy testing

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    Digital Image Correlation (DIC) is of vital importance in the field of experimental mechanics, yet, producing suitable DIC patterns for demanding in-situ mechanical tests remains challenging, especially for ultra-fine patterns, despite the large number of patterning techniques in the literature. Therefore, we propose a simple, flexible, one-step technique (only requiring a conventional deposition machine) to obtain scalable, high-quality, robust DIC patterns, suitable for a range of microscopic techniques, by deposition of a low melting temperature solder alloy in so-called 'island growth' mode, without elevating the substrate temperature. Proof of principle is shown by (near-)room-temperature deposition of InSn patterns, yielding highly dense, homogeneous DIC patterns over large areas with a feature size that can be tuned from as small as 10nm to 2um and with control over the feature shape and density by changing the deposition parameters. Pattern optimization, in terms of feature size, density, and contrast, is demonstrated for imaging with atomic force microscopy, scanning electron microscopy (SEM), optical microscopy and profilometry. Moreover, the performance of the InSn DIC patterns and their robustness to large deformations is validated in two challenging case studies of in-situ micro-mechanical testing: (i) self-adaptive isogeometric digital height correlation of optical surface height profiles of a coarse, bimodal InSn pattern providing microscopic 3D deformation fields (illustrated for delamination of aluminum interconnects on a polyimide substrate) and (ii) DIC on SEM images of a much finer InSn pattern allowing quantification of high strains near fracture locations (illustrated for rupture of a Fe foil). As such, the high controllability, performance and scalability of the DIC patterns offers a promising step towards more routine DIC-based in-situ micro-mechanical testing.Comment: Accepted for publication in Strai

    Photoelasticity revived for Tactile Sensing

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    Parameter identification of a mechanical ductile damage using Artificial Neural Networks in sheet metal forming.

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    In this paper, we report on the developed and used of finite element methods, have been developed and used for sheet forming simulations since the 1970s, and have immensely contributed to ensure the success of concurrent design in the manufacturing process of sheets metal. During the forming operation, the Gurson–Tvergaard–Needleman (GTN) model was often employed to evaluate the ductile damage and fracture phenomena. GTN represents one of the most widely used ductile damage model. In this investigation, many experimental tests and finite element model computation are performed to predict the damage evolution in notched tensile specimen of sheet metal using the GTN model. The parameters in the GTN model are calibrated using an Artificial Neural Networks system and the results of the tensile test. In the experimental part, we used an optical measurement instruments in two phases: firstly during the tensile test, a digital image correlation method is applied to determinate the full-field displacements in the specimen surface. Secondly a profile projector is employed to evaluate the localization of deformation (formation of shear band) just before the specimen’s fracture. In the validation parts of this investigation, the experimental results of hydroforming part and Erichsen test are compared with their numerical finite element model taking into account the GTN model. A good correlation was observed between the two approaches

    Review of the Synergies Between Computational Modeling and Experimental Characterization of Materials Across Length Scales

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    With the increasing interplay between experimental and computational approaches at multiple length scales, new research directions are emerging in materials science and computational mechanics. Such cooperative interactions find many applications in the development, characterization and design of complex material systems. This manuscript provides a broad and comprehensive overview of recent trends where predictive modeling capabilities are developed in conjunction with experiments and advanced characterization to gain a greater insight into structure-properties relationships and study various physical phenomena and mechanisms. The focus of this review is on the intersections of multiscale materials experiments and modeling relevant to the materials mechanics community. After a general discussion on the perspective from various communities, the article focuses on the latest experimental and theoretical opportunities. Emphasis is given to the role of experiments in multiscale models, including insights into how computations can be used as discovery tools for materials engineering, rather than to "simply" support experimental work. This is illustrated by examples from several application areas on structural materials. This manuscript ends with a discussion on some problems and open scientific questions that are being explored in order to advance this relatively new field of research.Comment: 25 pages, 11 figures, review article accepted for publication in J. Mater. Sc

    Some experimental observations of crack-tip mechanics with displacement data

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    Estudio de la mecánica en el vértice de la grieta mediante datos de desplazamiento.In the past two decades, crack-tip mechanics has been increasingly studied with full-field techniques. Within these techniques, Digital Image Correlation (DIC) has been most widely used due to its many advantages, to extract important crack-tip information, including Stress Intensity Factor (SIF), Crack Opening Displacement, J-integral, T-stress, closure level, plastic zone size, etc. However, little information is given in the literature about the experimental setup that provides best estimations for the different parameters. The current work aims at understanding how the experimental conditions used in DIC influence the crack-tip information extracted experimentally. The influence of parameters such as magnification factor, size of the images, position of the images with respect the crack-tip and size of the subset used in the correlation is studied. The influence is studied in terms of SIF and T-stress by using Williams’ model. The concept of determination of the K-dominance zone from experimental data has also explored. In this regard, cyclic loading on a fatigue crack in a compact tension (CT) specimen, made of aluminium 2024-T351 alloy, has been applied and the surface deformation ahead of the crack tip has been examined. The comparison between theoretical and experimental values of KI showed that the effect of subset size on the measured KI is negligible compared to the effect of size of the image.Universidad de Málaga. Campus de Excelencia Internacional Andalucía Tech

    Photoelastic Stress Analysis

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    Emerging technologies for the non-invasive characterization of physical-mechanical properties of tablets

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    The density, porosity, breaking force, viscoelastic properties, and the presence or absence of any structural defects or irregularities are important physical-mechanical quality attributes of popular solid dosage forms like tablets. The irregularities associated with these attributes may influence the drug product functionality. Thus, an accurate and efficient characterization of these properties is critical for successful development and manufacturing of a robust tablets. These properties are mainly analyzed and monitored with traditional pharmacopeial and non-pharmacopeial methods. Such methods are associated with several challenges such as lack of spatial resolution, efficiency, or sample-sparing attributes. Recent advances in technology, design, instrumentation, and software have led to the emergence of newer techniques for non-invasive characterization of physical-mechanical properties of tablets. These techniques include near infrared spectroscopy, Raman spectroscopy, X-ray microtomography, nuclear magnetic resonance (NMR) imaging, terahertz pulsed imaging, laser-induced breakdown spectroscopy, and various acoustic- and thermal-based techniques. Such state-of-the-art techniques are currently applied at various stages of development and manufacturing of tablets at industrial scale. Each technique has specific advantages or challenges with respect to operational efficiency and cost, compared to traditional analytical methods. Currently, most of these techniques are used as secondary analytical tools to support the traditional methods in characterizing or monitoring tablet quality attributes. Therefore, further development in the instrumentation and software, and studies on the applications are necessary for their adoption in routine analysis and monitoring of tablet physical-mechanical properties
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