An accurate, trimless, high PSRR, low-voltage, CMOS bandgap reference IC

Bandgap reference circuits are used in a host of analog, digital, and mixed-signal systems to establish an accurate voltage standard for the entire IC. The accuracy of the bandgap reference voltage under steady-state (dc) and transient (ac) conditions is critical to obtain high system performance. In this work, the impact of process, power-supply, load, and temperature variations and package stresses on the dc and ac accuracy of bandgap reference circuits has been analyzed. Based on this analysis, the a bandgap reference that 1. has high dc accuracy despite process and temperature variations and package stresses, without resorting to expensive trimming or noisy switching schemes, 2. has high dc and ac accuracy despite power-supply variations, without using large off-chip capacitors that increase bill-of-material costs, 3. has high dc and ac accuracy despite load variations, without resorting to error-inducing buffers, 4. is capable of producing a sub-bandgap reference voltage with a low power-supply, to enable it to operate in modern, battery-operated portable applications, 5. utilizes a standard CMOS process, to lower manufacturing costs, and 6. is integrated, to consume less board space has been proposed. The functionality of critical components of the system has been verified through prototypes after which the performance of the complete system has been evaluated by integrating all the individual components on an IC. The proposed CMOS bandgap reference can withstand 5mA of load variations while generating a reference voltage of 890mV that is accurate with respect to temperature to the first order. It exhibits a trimless, dc 3-sigma accuracy performance of 0.84% over a temperature range of -40°C to 125°C and has a worst case ac power-supply ripple rejection (PSRR) performance of 30dB up to 50MHz using 60pF of on-chip capacitance. All the proposed techniques lead to the development of a CMOS bandgap reference that meets the low-cost, high-accuracy demands of state-of-the-art System-on-Chip environments.Ph.D.Committee Chair: Rincon-Mora, Gabriel; Committee Member: Ayazi, Farrokh; Committee Member: Bhatti, Pamela; Committee Member: Leach, W. Marshall; Committee Member: Morley, Thoma

SIRU development. Volume 1: System development

A complete description of the development and initial evaluation of the Strapdown Inertial Reference Unit (SIRU) system is reported. System development documents the system mechanization with the analytic formulation for fault detection and isolation processing structure; the hardware redundancy design and the individual modularity features; the computational structure and facilities; and the initial subsystem evaluation results

Automatic controls and regulators: A compilation

Devices, methods, and techniques for control and regulation of the mechanical/physical functions involved in implementing the space program are discussed. Section one deals with automatic controls considered to be, essentially, start-stop operations or those holding the activity in a desired constraint. Devices that may be used to regulate activities within desired ranges or subject them to predetermined changes are dealt with in section two

Integrated Circuits for Programming Flash Memories in Portable Applications

Smart devices such as smart grids, smart home devices, etc. are infrastructure systems that connect the world around us more than before. These devices can communicate with each other and help us manage our environment. This concept is called the Internet of Things (IoT). Not many smart nodes exist that are both low-power and programmable. Floating-gate (FG) transistors could be used to create adaptive sensor nodes by providing programmable bias currents. FG transistors are mostly used in digital applications like Flash memories. However, FG transistors can be used in analog applications, too. Unfortunately, due to the expensive infrastructure required for programming these transistors, they have not been economical to be used in portable applications. In this work, we present low-power approaches to programming FG transistors which make them a good candidate to be employed in future wireless sensor nodes and portable systems. First, we focus on the design of low-power circuits which can be used in programming the FG transistors such as high-voltage charge pumps, low-drop-out regulators, and voltage reference cells. Then, to achieve the goal of reducing the power consumption in programmable sensor nodes and reducing the programming infrastructure, we present a method to program FG transistors using negative voltages. We also present charge-pump structures to generate the necessary negative voltages for programming in this new configuration

Design of an Ultra-Low Power RTC for the IoT

The Internet of Things is growing at an exponential rate. This new perception of reality is being researched even further nowadays because society is starting to develop an interest on these technologies. Market potential is increasing even further, since the foreseeable implementations are diverse and still to be detected. The future applications for the IoT are enthusiastic and they will increase the overall quality of life of the citizens of the world. Developing a component that is crucial for the sustainability of this implementation is the task that truly motivates the intended work for this project. Designing the full-custom circuitry and physical layout of a Real Time Clock becomes a job that has a lot of minor details that need considerable attention. These technicalities truly tone the developers skill and knowledge of different design principles. Besides, developing the solution using subthreshold CMOS techniques will put emphasis on different technological procedures. Producing devices that are heavily dependent on PVT variations, operational frequency and power consumption define this new task, that needs a stable approach to all these diverse figure of merits, even though they are all interconnected. The study and understanding of these different approaches allows for a more complex in depth grasp of this recent intriguing proceedings

128 mA CMOS LDO with 108 db PSRR at 2.4 MHz frequency

A low dropout (LDO) voltage regulator with high power supply rejection ratio (PSRR) and low temperature coefficient (TC) is presented in this paper. Large 1µF off-chip load capacitor is used to achieve the high PSRR. However, this decreases the gain and pushes the LDO’s output pole to lower frequency causing the circuit to become unstable. The proposed LDO uses rail-to-rail folded cascode amplifier to compensate the gain and stability problems. 2nd order curvature characteristic is used in bandgap voltage reference circuit that is applied at the input of the amplifier to minimize the TC. The characteristic is achieved by implementing MOSFET transistors operate in weak and strong inversions. The LDO is designed using 0.18µm CMOS technology and achieves a constant 1.8V output voltage for input voltages from 3.2V to 5V and load current up to a 128mA at temperature between -40°C to 125°C. The proposed LDO is targeted for RF application which has stringent requirement on noise rejection over a broad range of frequency

A fully-integrated 180 nm CMOS 1.2 V low-dropout regulator for low-power portable applications

This paper presents the design and postlayout simulation results of a capacitor-less low dropout (LDO) regulator fully integrated in a low-cost standard 180 nm Complementary Metal-Oxide-Semiconductor (CMOS) technology which regulates the output voltage at 1.2 V from a 3.3 to 1.3 V battery over a -40 to 120 degrees C temperature range. To meet with the constraints of system-on-chip (SoC) battery-operated devices, ultralow power (I-q = 8.6 mu A) and minimum area consumption (0.109 mm(2)) are maintained, including a reference voltage V-ref = 0.4 V. It uses a high-gain dynamically biased folded-based error amplifier topology optimized for low-voltage operation that achieves an enhanced regulation-fast transient performance trade-off

A Low-Voltage Mobility-Based Frequency Reference for Crystal-Less ULP Radios

The design of a 100 kHz frequency reference based on the electron mobility in a MOS transistor is presented. The proposed low-voltage low-power circuit requires no off-chip components, making it suitable for application in wireless sensor networks (WSN). After a single-point calibration, the spread of its output frequency is less than 1.1% (3 ) over the temperature range from -22 C to 85 C. Fabricated in a baseline 65 nm CMOS technology, the frequency reference circuit occupies 0.11 mm

A Fully Integrated High-Temperature, High-Voltage, BCD-on-SOI Voltage Regulator

Developments in automotive (particularly hybrid electric vehicles), aerospace, and energy production industries over the recent years have led to expanding research interest in integrated circuit (IC) design toward high-temperature applications. A high-voltage, high-temperature SOI process allows for circuit design to expand into these extreme environment applications. Nearly all electronic devices require a reliable supply voltage capable of operating under various input voltages and load currents. These input voltages and load currents can be either DC or time-varying signals. In this work, a stable supply voltage for embedded circuit functions is generated on chip via a voltage regulator circuit producing a stable 5-V output voltage. Although applications of this voltage regulator are not limited to gate driver circuits, this regulator was developed to meet the demands of a gate driver IC. The voltage regulator must provide reliable output voltage over an input range from 10 V to 30 V, a temperature range of −50 ºC to 200 ºC, and output loads from 0 mA to 200 mA. Additionally, low power stand-by operation is provided to help reduce heat generation and thus lower operating junction temperature. This regulator is based on the LM723 Zener reference voltage regulator which allows stable performance over temperature (provided proper design of the temperature compensation scheme). This circuit topology and the SOI silicon process allow for reliable operation under all application demands. The designed voltage regulator has been successfully tested from −50 ºC to 200 ºC while demonstrating an output voltage variation of less than 25 mV under the full range of input voltage. Line regulation tests from 10 V to 35 V show a 3.7-ppm/V supply sensitivity. With the use of a high-temperature ceramic output capacitor, a 5-nsec edge, 0 to 220 mA, 1-µsec pulse width load current induced only a 55 mV drop in regulator output voltage. In the targeted application, load current pulse widths will be much shorter, thereby improving the load transient performance. Full temperature and input voltage range tests reveal the no-load supply current draw is within 330 µA while still providing an excess of 200 mA of load current upon demand