Comparative analysis of two operational amplifier topologies for a 40MS/s 12-bit pipelined ADC in 0.35μm CMOS

This paper describes a comparative analysis between two topologies of operational amplifiers to design a 40 MS/s 12-bit pipeline analog to digital converter (ADC). The analysis includes AC and transient simulation to select the proper topology. This ADC is implemented in a 0.35 mum AMS CMOS technology with 3.3 V single power supply. The capacitors and selected operational amplifiers were scaled for low power dissipation. All analog components of this pipeline ADC are fully differential, as there are dynamic comparators, analog multiplexers and operational amplifiers with gain boosting.This work has been partially supported by Fundación Séneca of Región de Murcia(Ref:03094/PI/05)and MEC of Spain(Ref:TIN2006-15460-C04-04)

A 12-bit, 40 msamples/s, low-power, low-area pipeline analog-to-digital converter in CMOS 0.18 mum technology.

With advancements in digital signal processing in recent years, the need for high-speed, high-resolution analog-to-digital converters (ADCs) which can be used in the analog front-end has been increasing. Some examples of these applications are image and video signal processing, wireless communications and asymmetrical digital subscriber line (ADSL). In CMOS integrated circuit design, it is desirable to integrate the digital circuit and the ADC in one microchip to reduce the cost of fabrication. Consequently the power dissipation and area of the ADCs are important design factors. The original contributions in this thesis are as follows. Since the performance of pipeline ADCs significantly depends on the op-amps and comparators circuits, the performance of various comparators is analyzed and the effect of op-amp topology on the performance of pipeline ADCs is investigated. This thesis also presents a novel architecture for design of low-power and low-area pipelined ADCs which will be more useful for very low voltage applications in the future. At the schematic level, a low-power CMOS implementation of the current-mode MDAC is presented and an improved voltage comparator is designed. With the proposed design and the optimization methodology it is possible to reduce power dissipation and area compared with conventional fully differential schemes.Dept. of Electrical and Computer Engineering. Paper copy at Leddy Library: Theses & Major Papers - Basement, West Bldg. / Call Number: Thesis2004 .M64. Source: Masters Abstracts International, Volume: 43-01, page: 0281. Adviser: C. Chen. Thesis (M.A.Sc.)--University of Windsor (Canada), 2004

Minimal Power Latch for Single-Slope ADCs

A latch circuit that uses two interoperating latches. The latch circuit has the beneficial feature that it switches only a single time during a measurement that uses a stair step or ramp function as an input signal in an analog to digital converter. This feature minimizes the amount of power that is consumed in the latch and also minimizes the amount of high frequency noise that is generated by the latch. An application using a plurality of such latch circuits in a parallel decoding ADC for use in an image sensor is given as an example

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Design of Power Management Integrated Circuits and High-Performance ADCs

A battery-powered system has widely expanded its applications to implantable medical devices (IMDs) and portable electronic devices. Since portable devices or IMDs operate in the energy-constrained environment, their low-power operations in combination with efficiently sourcing energy to them are key problems to extend device life. This research proposes novel circuit techniques for two essential functions of a power receiving unit (PRU) in the energy-constrained environment, which are power management and signal processing. The first part of this dissertation discusses power management integrated circuits for a PRU. From a power management perspective, the most critical two circuit blocks are a front-end rectifier and a battery charger. The front-end CMOS active rectifier converts transmitted AC power into DC power. High power conversion efficiency (PCE) is required to reduce power loss during the power transfer, and high voltage conversion ratio (VCR) is required for the rectifier to enable low-voltage operations. The proposed 13.56-MHz CMOS active rectifier presents low-power circuit techniques for comparators and controllers to reduce increasing power loss of an active diode with offset/delay calibration. It is implemented with 5-V devices of a 0.35 µm CMOS process to support high voltage. A peak PCE of 89.0%, a peak VCR of 90.1%, and a maximum output power of 126.7 mW are measured for 200Ω loading. The linear battery charger stores the converted DC power into a battery. Since even small power saving can be enough to run the low-power PRU, a battery charger with low IvQ is desirable. The presented battery charger is based on a single amplifier for regulation and the charging phase transition from the constant-current (CC) phase to the constant-voltage (CV) phase. The proposed unified amplifier is based on stacked differential pairs which share the bias current. Its current-steering property removes multiple amplifiers for regulation and the CC-CV transition, and achieves high unity-gain loop bandwidth for fast regulation. The charger with the maximum charging current of 25 mA is implemented in 0.35 µm CMOS. A peak charger efficiency of 94% and average charger efficiency of 88% are achieved with an 80-mAh Li-ion polymer battery. The second part of this dissertation focuses on analog-to-digital converters (ADCs). From a signal processing perspective, an ADC is one of the most important circuit blocks in the PRU. Hence, an energy-efficient ADC is essential in the energy-constrained environment. A pipelined successive approximation register (SAR) ADC has good energy efficiency in a design space of moderate-to-high speeds and resolutions. Process-Voltage-Temperature variations of a dynamic amplifier in the pipelined-SAR ADC is a key design issue. This research presents two dynamic amplifier architectures for temperature compensation. One is based on a voltage-to-time converter (VTC) and a time-to-voltage converter (TVC), and the other is based on a temperature-dependent common-mode detector. The former amplifier is adopted in a 13-bit 10-50 MS/s subranging pipelined-SAR ADC fabricated in 0.13-µm CMOS. The ADC can operate under the power supply voltage of 0.8-1.2 V. Figure-of-Merits (FoMs) of 4-11.3 fJ/conversion-step are achieved. The latter amplifier is also implemented in 0.13-µm CMOS, consuming 0.11 mW at 50 MS/s. Its measured gain variation is 2.1% across the temperature range of -20°C to 85 °C

A robust 2.4 GHz time-of-arrival based ranging system with sub-meter accuracy: feasibility study and realization of low power CMOS receiver

Draadloze sensornetwerken worden meer en meer aangewend om verschillende soorten informatie te verzamelen. De locatie, waar deze informatie verzameld is, is een belangerijke eigenschap en voor sommige toepassingen, zoals het volgen van personen of goederen, zelfs de meest belangrijke en mogelijkmakende factor. Om de positie van een sensor te bepalen, is een technologie nodig die de afstand tot een gekend referentiepunt schat. Door verschillende afstandsmetingen te combineren, is het mogelijk de absolute locatie van de node te berekenen

Digital ADCs and ultra-wideband RF circuits for energy constrained wireless applications by Denis Clarke Daly.

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2009.Cataloged from PDF version of thesis.Includes bibliographical references (p. 173-183).Ongoing advances in semiconductor technology have enabled a multitude of portable, low power devices like cellular phones and wireless sensors. Most recently, as transistor device geometries reach the nanometer scale, transistor characteristics have changed so dramatically that many traditional circuits and architectures are no longer optimal and/or feasible. As a solution, much research has focused on developing 'highly digital' circuits and architectures that are tolerant of the increased leakage, variation and degraded voltage headrooms associated with advanced CMOS processes. This thesis presents several highly digital, mixed-signal circuits and architectures designed for energy constrained wireless applications. First, as a case study, a highly digital, voltage scalable flash ADC is presented. The flash ADC, implemented in 0.18 [mu]m CMOS, leverages redundancy and calibration to achieve robust operation at supply voltages from 0.2 V to 0.9 V. Next, the thesis expands in scope to describe a pulsed, noncoherent ultra-wideband transceiver chipset, implemented in 90 nm CMOS and operating in the 3-to-5 GHz band. The all-digital transmitter employs capacitive combining and pulse shaping in the power amplifier to meet the FCC spectral mask without any off-chip filters. The noncoherent receiver system-on-chip achieves both energy efficiency and high performance by employing simple amplifier and ADC structures combined with extensive digital calibration. Finally, the transceiver chipset is integrated in a complete system for wireless insect flight control.(cont.) Through the use of a flexible PCB and 3D die stacking, the total weight of the electronics is kept to 1 g, within the carrying capacity of an adult Manduca sexta moth. Preliminary wireless flight control of a moth in a wind tunnel is demonstrated.Ph.D

Voltage-to-Time Converter for High-Speed Time-Based Analog-to-Digital Converters

In modern complementary metal oxide semiconductor (CMOS) technologies, the supply voltage scales faster than the threshold voltage (Vth) of the transistors in successive smaller nodes. Moreover, the intrinsic gain of the transistors diminishes as well. Consequently, these issues increase the difficulty of designing higher speed and larger resolution analog-to-digital converters (ADCs) employing voltage-domain ADC architectures. Nevertheless, smaller transistor dimensions in state-of-the-art CMOS technologies leads to reduced capacitance, resulting in lower gate delays. Therefore, it becomes beneficial to first convert an input voltage to a 'time signal' using a voltage-to-time converter (VTC), instead of directly converting it into a digital output. This 'time-signal' could then be converted to a digital output through a time-to-digital converter (TDC) for complete analog-to-digital conversion. However, the overall performance of such an ADC will still be limited to the performance level of the voltage-to-time conversion process. Hence, this thesis presents the design of a linear VTC for a high-speed time-based ADC in 28 nm CMOS process. The proposed VTC consists of a sample-and-hold (S/H) circuit, a ramp generator and a comparator to perform the conversion of the input signal from the voltage to the time domain. Larger linearity is attained by integrating a constant current (with high output impedance) over a capacitor, generating a linear ramp. The VTC operates at 256 MSPS consuming 1.3 mW from 1 V supply with a full-scale 1 V pk-pk differential input signal, while achieving a time-domain output signal with a spurious-free-dynamic-range (SFDR) of 77 dB and a signal-to-noise-and-distortion ratio (SNDR) of 56 dB at close to Nyquist frequency (f = 126.5 MHz). The proposed VTC attains an output range of 2.7 ns, which is the highest linear output range for a VTC at this speed, published to date

Attitude transfer assembly design for MAGSAT

A description is given of a design for an instrument system that will monitor the orientation of a boom-mounted vector magnetometer relative to the main spacecraft body. The attitude of the magnetometer is measured with respect to X and Z axes lateral to the boom length and also a twist axis around the boom center line. These measurements are made in a noncontact optical approach employing a three-axis autocollimator system mounted on the main body of the spacecraft with only passive elements (reflectors) located at the end of the 20-foot boom