Thermal Modeling and Characterization of Nanoscale Metallic Interconnects

Temperature rise due to Joule heating of on-chip interconnects can severely affect performance and reliability of next generation microprocessors. Thermal predictions become difficult due to large number of features, and the impact of electron size effects on electrical and thermal transport. It is thus necessary to develop efficient numerical approaches, and accurate metal and dielectric thermal characterization techniques. In this research, analytical, numerical, and experimental techniques were developed to enable accurate and efficient predictions of interconnect temperature rise. A finite element based compact thermal model was developed to obtain temperature rise with fewer elements and acceptable accuracy. Temperature drop across the interconnect cross-section was ignored. The compact model performed better than standard finite element model in two and three-dimensional case studies, and the predictions for a real world structure agreed closely with experimentally measured temperature rise. A numerical solution was developed for electron transport based on the Boltzmann Transport Equation (BTE). This deterministic technique, based on the path integral solution of BTE within the relaxation time approximation, free electron model, and linear response, was applied to a constriction in a finite size thin metallic film. A correlation for effective conductance was obtained for different constriction sizes. The Atomic Force Microscope (AFM) based Scanning Joule Expansion Microscopy (SJEM) was used to develop a new technique to measure thermal conductivity of thin metallic films in the size effect regime. This technique does not require suspended metal structures, and thus preserves the original electron interface scattering characteristics. The thermal conductivities of 43 nm and 131 nm gold films were extracted to be 82 W/mK and 162 W/mK respectively. These measurements were close to Wiedemann-Franz Law predictions and are significantly smaller than the bulk value of 318 W/mK due to electron size effects. The technique can potentially be applied to interconnects in the sub-100 nm regime. A semi-analytical solution for the 3-omega method was derived to account for thermal conduction within the metallic heater. It is shown that significant errors can result when the previous solution is applied for anisotropic thermal conductivity measurements.Ph.D.Committee Co-Chair: Joshi, Yogendra; Committee Co-Chair: King, William; Committee Member: Hesketh, Peter; Committee Member: Marchenkov, Alexei; Committee Member: Meindl, James; Committee Member: Sitaraman, Sures

Thermal analysis of lithium ion battery-equipped smartphone explosions

Thermal management of mobile electronics has been carried out because performance of the application processor has increased and power dissipation in miniaturized devices is proportional to its functionalities. There have been various studies on thermal analyses related to mobile electronics with the objectives of improving analysis methodologies and cooling strategies to guarantee device safety. Despite these efforts, failure to control thermal energy, especially in smartphones, has resulted in explosions, because thermal behaviors in the device under various operating conditions have not been sufficiently conducted. Therefore, several scenarios that caused the failure in thermal management of smartphone was analyzed to provide improved insight into thermal design deducing the parameters, that affect the thermal management of device. Overcurrent in battery due to malfunction of battery management system or immoderate addition of functionalities to the application processor are considered as reliable causes leading to the recent thermal runaways and explosions. From the analyses, it was also confirmed that the heat generation of the battery, which have not been considered importantly in previous literature, has significant effect on thermal management, and heat spreading could be suppressed according to arrangement of AP and battery. The heat pipe, which is utilized as a cooling device in mobile electronics, was also included in the thermal analyses. Although the heat pipes have been expected to improve the thermal management in mobile electronics, it showed limited heat transfer capacity due to its operating conditions and miniaturization. The demonstrated results of our analysis warn against vulnerabilities of smartphones in terms of safety in design

Computational Design and Optimisation of Pin Fin Heat Sinks with Rectangular Perforations

The benefits of using pin heat sinks (PHSs) with single, rectangular slotted or notched pin perforations, are explored computationally, using a conjugate heat transfer model. Results show that the heat transfer increases monotonically while the pressure drop decreases monotonically as the size of the rectangular perforation increases. Performance comparisons with PHSs with multiple circular perforations show favourable heat transfer and pressure drop characteristics. However, the reduced manufacturing complexity of rectangular notched pins in particular provide strong motivation for their use in practical applications. Detailed parameterisation and optimisation studies into the benefits of single rectangular notch perforations demonstrate the scope for improving heat transfer and reducing mechanical fan power consumption yet further by careful design of pin density and pin perforations in PHSs

Heat transfer enhancement in a micro-channel cooling system using cylindrical vortex generators.

Three-dimensional conjugate heat transfer under laminar flow conditions within a micro-channel is analysed numerically to explore the impact of a new design of vortex generator positioned at intervals along the base of the channel. The vortex generators are cylindrical with quarter-circle and half-circle cross sections, with variants spanning the whole width of the channel or parts of the channel. Micro-channels with Reynolds number ranging from 100 to 2300 are subjected to a uniform heat flux relevant to microelectronics cooling. To ensure the accuracy of the results, validations against previous microchannel studies were conducted and found to be in good agreement, before the new vortex generators with radii up to 400 µm were analysed. Using a thermal-hydraulic performance parameter expressed in a new way, the VGs described here are shown to offer significant potential in combatting the challenges of heat transfer in the technological drive toward lower weight/smaller volume electrical and electronic devices

A two teraflop swarm

© 2018 Jones, Studley, Hauert and Winfield. We introduce the Xpuck swarm, a research platform with an aggregate raw processing power in excess of two teraflops. The swarm uses 16 e-puck robots augmented with custom hardware that uses the substantial CPU and GPU processing power available from modern mobile system-on-chip devices. The augmented robots, called Xpucks, have at least an order of magnitude greater performance than previous swarm robotics platforms. The platform enables new experiments that require high individual robot computation and multiple robots. Uses include online evolution or learning of swarm controllers, simulation for answering what-if questions about possible actions, distributed super-computing for mobile platforms, and real-world applications of swarm robotics that requires image processing, or SLAM. The teraflop swarm could also be used to explore swarming in nature by providing platforms with similar computational power as simple insects. We demonstrate the computational capability of the swarm by implementing a fast physics-based robot simulator and using this within a distributed island model evolutionary system, all hosted on the Xpucks