Thermal management of mobile electronics has been carried out because performance of the application processor has increased and power dissipation in miniaturized devices is proportional to its functionalities. There have been various studies on thermal analyses related to mobile electronics with the objectives of improving analysis methodologies and cooling strategies to guarantee device safety. Despite these efforts, failure to control thermal energy, especially in smartphones, has resulted in explosions, because thermal behaviors in the device under various operating conditions have not been sufficiently conducted. Therefore, several scenarios that caused the failure in thermal management of smartphone was analyzed to provide improved insight into thermal design deducing the parameters, that affect the thermal management of device. Overcurrent in battery due to malfunction of battery management system or immoderate addition of functionalities to the application processor are considered as reliable causes leading to the recent thermal runaways and explosions. From the analyses, it was also confirmed that the heat generation of the battery, which have not been considered importantly in previous literature, has significant effect on thermal management, and heat spreading could be suppressed according to arrangement of AP and battery. The heat pipe, which is utilized as a cooling device in mobile electronics, was also included in the thermal analyses. Although the heat pipes have been expected to improve the thermal management in mobile electronics, it showed limited heat transfer capacity due to its operating conditions and miniaturization. The demonstrated results of our analysis warn against vulnerabilities of smartphones in terms of safety in design
