A liquid crystalline copper phthalocyanine derivative for high performance organic thin film transistors

This journal is © The Royal Society of Chemistry 2012Bottom-gate, bottom-contact organic thin film transistors (OTFTs) were fabricated using solvent soluble copper 1,4,8,11,15,18,22,25-octakis(hexyl)phthalocyanine as the active semiconductor layer. The compound was deposited as 70 nm thick spin-coated films onto gold source–drain electrodes supported on octadecyltrichlorosilane treated 250 nm thick SiO2 gate insulators. The performance of the OTFTs was optimised by investigating the effects of vacuum annealing of the films at temperatures between 50 0C and 200 0C, a range that included the thermotropic mesophase of the bulk material. These effects were monitored by ultraviolet-visible absorption spectroscopy, atomic force microscopy and XRD measurements. Device performance was shown to be dependent upon the annealing temperature due to structural changes of the film. Devices heat treated at 100 0C under vacuum (≥10-7 mbar) were found to exhibit the highest field-effect mobility, 0.7 cm2 V^-1 s^-1, with an on–off current modulation ratio of~107, a reduced threshold voltage of 2.0 V and a sub-threshold swing of 1.11 V per decade.UK Technology Strategy Board (Project no: TP/6/EPH/6/S/K2536J) and UK National Measurement System (Project IRD C02 ‘‘Plastic Electronics’’, 2008–2011)

High‐Volume Processed, ITO‐Free Superstrates and Substrates for Roll‐to‐Roll Development of Organic Electronics

The fabrication of substrates and superstrates prepared by scalable roll‐to‐roll methods is reviewed. The substrates and superstrates that act as the flexible carrier for the processing of functional organic electronic devices are an essential component, and proposals are made about how the general availability of various forms of these materials is needed to accelerate the development of the field of organic electronics. The initial development of the replacement of indium‐tin‐oxide (ITO) for the flexible carrier materials is described and a description of how roll‐to‐roll processing development led to simplification from an initially complex make‐up to higher performing materials through a more simple process is also presented. This process intensification through process simplification is viewed as a central strategy for upscaling, increasing throughput, performance, and cost reduction