6 research outputs found

    DeepMAsED: evaluating the quality of metagenomic assemblies

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    Motivation: Methodological advances in metagenome assembly are rapidly increasing in the number of published metagenome assemblies. However, identifying misassemblies is challenging due to a lack of closely related reference genomes that can act as pseudo ground truth. Existing reference-free methods are no longer maintained, can make strong assumptions that may not hold across a diversity of research projects, and have not been validated on large-scale metagenome assemblies. Results: We present DeepMAsED, a deep learning approach for identifying misassembled contigs without the need for reference genomes. Moreover, we provide an in silico pipeline for generating large-scale, realistic metagenome assemblies for comprehensive model training and testing. DeepMAsED accuracy substantially exceeds the state-of-the-art when applied to large and complex metagenome assemblies. Our model estimates a 1% contig misassembly rate in two recent large-scale metagenome assembly publications. Conclusions: DeepMAsED accurately identifies misassemblies in metagenome-assembled contigs from a broad diversity of bacteria and archaea without the need for reference genomes or strong modeling assumptions. Running DeepMAsED is straight-forward, as well as is model re-training with our dataset generation pipeline. Therefore, DeepMAsED is a flexible misassembly classifier that can be applied to a wide range of metagenome assembly projects

    ResMiCo: increasing the quality of metagenome-assembled genomes with deep learning

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    The number of published metagenome assemblies is rapidly growing due to advances in sequencing technologies. However, sequencing errors, variable coverage, repetitive genomic regions, and other factors can produce misassemblies, which are challenging to detect for taxonomically novel genomic data. Assembly errors can affect all downstream analyses of the assemblies. Accuracy for the state of the art in reference-free misassembly prediction does not exceed an AUPRC of 0.57, and it is not clear how well these models generalize to real-world data. Here, we present the Residual neural network for Misassembled Contig identification (ResMiCo), a deep learning approach for reference-free identification of misassembled contigs. To develop ResMiCo, we first generated a training dataset of unprecedented size and complexity that can be used for further benchmarking and developments in the field. Through rigorous validation, we show that ResMiCo is substantially more accurate than the state of the art, and the model is robust to novel taxonomic diversity and varying assembly methods. ResMiCo estimated 4.7% misassembled contigs per metagenome across multiple real-world datasets. We demonstrate how ResMiCo can be used to optimize metagenome assembly hyperparameters to improve accuracy, instead of optimizing solely for contiguity. The accuracy, robustness, and ease-of-use of ResMiCo make the tool suitable for general quality control of metagenome assemblies and assembly methodology optimization.Author summary Metagenome assembly quality is fundamental to all downstream analyses of such data. The number of metagenome assemblies, especially metagenome-assembled genomes (MAGs), is rapidly increasing, but tools to assess the quality of these assemblies lack the accuracy needed for robust quality control. Moreover, existing models have been trained on datasets lacking complexity and realism, which may limit their generalization to novel data. Due to the limitations of existing models, most studies forgo such approaches and instead rely on CheckM to assess assembly quality, an approach that only utilizes a small portion of all genomic information and does not identify specific misassemblies. We harnessed existing large genomic datasets and high-performance computing to produce a training dataset of unprecedented size and complexity and thereby trained a deep learning model for predicting misassemblies that can robustly generalize to novel taxonomy and varying assembly methodologies.Competing Interest StatementThe authors have declared no competing interest
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