382 research outputs found

    Towards Scalable Strain Gauge-Based Joint Torque Sensors

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    During recent decades, strain gauge-based joint torque sensors have been commonly used to provide high-fidelity torque measurements in robotics. Although measurement of joint torque/force is often required in engineering research and development, the gluing and wiring of strain gauges used as torque sensors pose difficulties during integration within the restricted space available in small joints. The problem is compounded by the need for a scalable geometric design to measure joint torque. In this communication, we describe a novel design of a strain gauge-based mono-axial torque sensor referred to as square-cut torque sensor (SCTS), the significant features of which are high degree of linearity, symmetry, and high scalability in terms of both size and measuring range. Most importantly, SCTS provides easy access for gluing and wiring of the strain gauges on sensor surface despite the limited available space. We demonstrated that the SCTS was better in terms of symmetry (clockwise and counterclockwise rotation) and more linear. These capabilities have been shown through finite element modeling (ANSYS) confirmed by observed data obtained by load testing experiments. The high performance of SCTS was confirmed by studies involving changes in size, material and/or wings width and thickness. Finally, we demonstrated that the SCTS can be successfully implementation inside the hip joints of miniaturized hydraulically actuated quadruped robot-MiniHyQ. This communication is based on work presented at the 18th International Conference on Climbing and Walking Robots (CLAWAR)

    Nonlinearity of Apparent Mass for Multielement Bodies

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    Peer Reviewedhttps://deepblue.lib.umich.edu/bitstream/2027.42/140689/1/1.j054214.pd

    Thermal conductivity measurement of liquids in a microfluidic device

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    A new microfluidic-based approach to measuring liquid thermal conductivity is developed to address the requirement in many practical applications for measurements using small (microlitre) sample size and integration into a compact device. The approach also gives the possibility of high-throughput testing. A resistance heater and temperature sensor are incorporated into a glass microfluidic chip to allow transmission and detection of a planar thermal wave crossing a thin layer of the sample. The device is designed so that heat transfer is locally one-dimensional during a short initial time period. This allows the detected temperature transient to be separated into two distinct components: a short-time, purely one-dimensional part from which sample thermal conductivity can be determined and a remaining long-time part containing the effects of three-dimensionality and of the finite size of surrounding thermal reservoirs. Identification of the one-dimensional component yields a steady temperature difference from which sample thermal conductivity can be determined. Calibration is required to give correct representation of changing heater resistance, system layer thicknesses and solid material thermal conductivities with temperature. In this preliminary study, methanol/water mixtures are measured at atmospheric pressure over the temperature range 30–50°C. The results show that the device has produced a measurement accuracy of within 2.5% over the range of thermal conductivity and temperature of the tests. A relation between measurement uncertainty and the geometric and thermal properties of the system is derived and this is used to identify ways that error could be further reduced

    Identification of key temperature measurement technologies for the enhancement of product and equipment integrity in the light controlled factory

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    Thermal effects in uncontrolled factory environments are often the largest source of uncertainty in large volume dimensional metrology. As the standard temperature for metrology of 20°C cannot be achieved practically or economically in many manufacturing facilities, the characterisation and modelling of temperature offers a solution for improving the uncertainty of dimensional measurement and quantifying thermal variability in large assemblies. Technologies that currently exist for temperature measurement in the range of 0-50°C have been presented alongside discussion of these temperature measurement technologies' usefulness for monitoring temperatures in a manufacturing context. Particular aspects of production where the technology could play a role are highlighted as well as practical considerations for deployment. Contact sensors such as platinum resistance thermometers can produce accuracy closest to the desired accuracy given the most challenging measurement conditions calculated to be ∼0.02°C. Non-contact solutions would be most practical in the light controlled factory (LCF) and semi-invasive appear least useful but all technologies can play some role during the initial development of thermal variability models

    Development and Implementation of Image-based Algorithms for Measurement of Deformations in Material Testing

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    This paper presents the development and implementation of three image-based methods used to detect and measure the displacements of a vast number of points in the case of laboratory testing on construction materials. Starting from the needs of structural engineers, three ad hoc tools for crack measurement in fibre-reinforced specimens and 2D or 3D deformation analysis through digital images were implemented and tested. These tools make use of advanced image processing algorithms and can integrate or even substitute some traditional sensors employed today in most laboratories. In addition, the automation provided by the implemented software, the limited cost of the instruments and the possibility to operate with an indefinite number of points offer new and more extensive analysis in the field of material testing. Several comparisons with other traditional sensors widely adopted inside most laboratories were carried out in order to demonstrate the accuracy of the implemented software. Implementation details, simulations and real applications are reported and discussed in this paper

    Novel Designs for Application Specific MEMS Pressure Sensors

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    In the framework of developing innovative microfabricated pressure sensors, we present here three designs based on different readout principles, each one tailored for a specific application. A touch mode capacitive pressure sensor with high sensitivity (14 pF/bar), low temperature dependence and high capacitive output signal (more than 100 pF) is depicted. An optical pressure sensor intrinsically immune to electromagnetic interference, with large pressure range (0–350 bar) and a sensitivity of 1 pm/bar is presented. Finally, a resonating wireless pressure sensor power source free with a sensitivity of 650 KHz/mmHg is described. These sensors will be related with their applications in  harsh environment, distributed systems and medical environment, respectively. For many aspects, commercially available sensors, which in vast majority are piezoresistive, are not suited for the applications proposed

    Origin of Pressure-Induced Metallization in Cu3N: An X-ray Absorption Spectroscopy Study

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    The authors are grateful to Professor Alain Polian for providing the NDAC cell.High-pressure (0–26.7 GPa) Cu K-edge X-ray absorption spectroscopy is used to study possible structural modifications of anti-perovskite-type copper nitride (Cu3N) crystal lattice. The analysis of X-ray absorption near-edge structure (XANES) and extended X-ray absorption fine structure (EXAFS), based on theoretical full-multiple-scattering and single-scattering approaches, respectively, suggests that at all pressures the local atomic structure of Cu3N remains close to that in cubic (Formula presented.) phase. Therefore, the transition to metal state above 5 GPa, observed previously using pressure-dependent electrical resistance and optical absorption measurements, is explained by the band gap collapse due to a decrease of the unit cell volume. We found that the lattice parameter of Cu3N is reduced by ≈2% upon increasing pressure up to 26.7 GPa, and the structure is restored upon pressure release.This study was supported by Latvian National Research program IMIS2. The experiment at the SOLEIL synchrotron radiation facility received funding from the European Community’s Seventh Framework Programme (FP7/2007-2013) CALIPSO under Grant agreement no. 312284; Institute of Solid State Physics, University of Latvia as the Center of Excellence has received funding from the European Union’s Horizon 2020 Framework Programme H2020-WIDESPREAD-01-2016-2017-TeamingPhase2 under grant agreement No. 739508, project CAMART

    Non-destructive technologies for fruit and vegetable size determination - a review

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    Here, we review different methods for non-destructive horticultural produce size determination, focusing on electronic technologies capable of measuring fruit volume. The usefulness of produce size estimation is justified and a comprehensive classification system of the existing electronic techniques to determine dimensional size is proposed. The different systems identified are compared in terms of their versatility, precision and throughput. There is general agreement in considering that online measurement of axes, perimeter and projected area has now been achieved. Nevertheless, rapid and accurate volume determination of irregular-shaped produce, as needed for density sorting, has only become available in the past few years. An important application of density measurement is soluble solids content (SSC) sorting. If the range of SSC in the batch is narrow and a large number of classes are desired, accurate volume determination becomes important. A good alternative for fruit three-dimensional surface reconstruction, from which volume and surface area can be computed, is the combination of height profiles from a range sensor with a two-dimensional object image boundary from a solid-state camera (brightness image) or from the range sensor itself (intensity image). However, one of the most promising technologies in this field is 3-D multispectral scanning, which combines multispectral data with 3-D surface reconstructio
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