Layer assignment and routing optimization for advanced technologies

As VLSI technology scales to deep sub-micron and beyond, it becomes increasingly challenging to achieve timing closure for VLSI design. Since a complete design flow consists of several phases, such as logic synthesis, placement, and routing, interconnect synthesis plays an important role which includes buffer insertion/sizing and timing-driven routing. Although progress has been achieved by many advanced routing techniques, the following aspects can be exploited sufficiently for further improvement: (1) incremental layer assignment for timing optimization; (2) signal routing with the requirement of regularity; (3) power-efficient optical-electrical interconnect paradigm. Thus, to perform the layer assignment and routing optimization for advanced technologies, an automated routing engine in a global view is essential to benefit the interconnect design while satisfying specific requirements. This dissertation proposes a set of algorithms and methodology on layer assignment and routing optimization for advanced technologies. The research includes two timing-driven incremental layer assignment approaches, synergistic topology generation and routing synthesis for signal groups, and optical-electrical routing design for power efficiency. For incremental layer assignment, most of the conventional approaches target via minimization but neglect the timing issues. Meanwhile, via delays are ignored but should be considered in emerging technology nodes. Then two timing-driven incremental layer assignment frameworks are proposed, where all the nets are solved simultaneously with the integration of via delays: (1) optimization of the total sum of net delays and reduction of slew violations; (2) minimization of critical path timing in selected nets. For on-chip signal routing, the bundled bits in one group may have different pin locations, but they have to be routed in a regular manner by sharing common topologies. Very few previous works target inter-bit regularity via multi-layer topology selection. Furthermore, the routability and wire-length of the signal bits should also be optimized. Then an advanced synergistic routing engine is promoted, which is able to not only control routability and wire-length but also guide each bit routing intelligently for design regularity. For optical-electrical co-design routing, optical interconnect shows its advantage due to the dominance of bandwidth-distance-power properties. The previous works lack a detailed exploration of optical-electrical co-design for on-chip interconnects. During the transmission, signal quality can be affected by various loss sources and Electrical to Optical (EO)/Optical to Electrical (OE) conversion overheads should also be considered. Then a power-efficient routing flow for on-chip signals is presented, where optical connections can collaborate with electrical wires seamlessly. The effectiveness of proposed algorithms and techniques is demonstrated in this dissertation. These approaches are able to achieve the improvements regarding specific metrics and eventually benefit the routing flow.Electrical and Computer Engineerin

Architectural Exploration and Design Methodologies of Photonic Interconnection Networks

Photonic technology is becoming an increasingly attractive solution to the problems facing today's electronic chip-scale interconnection networks. Recent progress in silicon photonics research has enabled the demonstration of all the necessary optical building blocks for creating extremely high-bandwidth density and energy-efficient links for on- and off-chip communications. From the feasibility and architecture perspective however, photonics represents a dramatic paradigm shift from traditional electronic network designs due to fundamental differences in how electronics and photonics function and behave. As a result of these differences, new modeling and analysis methods must be employed in order to properly realize a functional photonic chip-scale interconnect design. In this work, we present a methodology for characterizing and modeling fundamental photonic building blocks which can subsequently be combined to form full photonic network architectures. We also describe a set of tools which can be utilized to assess the physical-layer and system-level performance properties of a photonic network. The models and tools are integrated in a novel open-source design and simulation environment called PhoenixSim. Next, we leverage PhoenixSim for the study of chip-scale photonic networks. We examine several photonic networks through the synergistic study of both physical-layer metrics and system-level metrics. This holistic analysis method enables us to provide deeper insight into architecture scalability since it considers insertion loss, crosstalk, and power dissipation. In addition to these novel physical-layer metrics, traditional system-level metrics of bandwidth and latency are also obtained. Lastly, we propose a novel routing architecture known as wavelength-selective spatial routing. This routing architecture is analogous to electronic virtual channels since it enables the transmission of multiple logical optical channels through a single physical plane (i.e. the waveguides). The available wavelength channels are partitioned into separate groups, and each group is routed independently in the network. Each partition is spectrally multiplexed, as opposed to temporally multiplexed in the electronic case. The wavelength-selective spatial routing technique benefits network designers by provider lower contention and increased path diversity

Roadmap on semiconductor-cell biointerfaces.

This roadmap outlines the role semiconductor-based materials play in understanding the complex biophysical dynamics at multiple length scales, as well as the design and implementation of next-generation electronic, optoelectronic, and mechanical devices for biointerfaces. The roadmap emphasizes the advantages of semiconductor building blocks in interfacing, monitoring, and manipulating the activity of biological components, and discusses the possibility of using active semiconductor-cell interfaces for discovering new signaling processes in the biological world

Fully Integrated Biochip Platforms for Advanced Healthcare

Recent advances in microelectronics and biosensors are enabling developments of innovative biochips for advanced healthcare by providing fully integrated platforms for continuous monitoring of a large set of human disease biomarkers. Continuous monitoring of several human metabolites can be addressed by using fully integrated and minimally invasive devices located in the sub-cutis, typically in the peritoneal region. This extends the techniques of continuous monitoring of glucose currently being pursued with diabetic patients. However, several issues have to be considered in order to succeed in developing fully integrated and minimally invasive implantable devices. These innovative devices require a high-degree of integration, minimal invasive surgery, long-term biocompatibility, security and privacy in data transmission, high reliability, high reproducibility, high specificity, low detection limit and high sensitivity. Recent advances in the field have already proposed possible solutions for several of these issues. The aim of the present paper is to present a broad spectrum of recent results and to propose future directions of development in order to obtain fully implantable systems for the continuous monitoring of the human metabolism in advanced healthcare applications

Proceedings of the 5th International Workshop on Reconfigurable Communication-centric Systems on Chip 2010 - ReCoSoC\u2710 - May 17-19, 2010 Karlsruhe, Germany. (KIT Scientific Reports ; 7551)

ReCoSoC is intended to be a periodic annual meeting to expose and discuss gathered expertise as well as state of the art research around SoC related topics through plenary invited papers and posters. The workshop aims to provide a prospective view of tomorrow\u27s challenges in the multibillion transistor era, taking into account the emerging techniques and architectures exploring the synergy between flexible on-chip communication and system reconfigurability

Two-dimensional (2D) Monolayer Materials: Exfoliation, Characterization, and Application

Monolayer two-dimensional (2D) materials have been regarded as a hot topic in the fields of condensed matter physics, materials science, and chemistry due to their unique physical, chemical, and electronic properties. However, the research on the preparation method and properties understanding of the 2D monolayer are inadequate. In this dissertation, taking 2D nickel-iron layered double hydroxides (NiFe LDHs) and molybdenum disulfide (MoS2) as examples, the practicability of the direct synthesis of NiFe LDHs monolayer and the thermal enhancement catalytic performance of 2D MoS2 monolayer (MoS2 ML) are discussed. First, a one-pot synthetic strategy (bottom-up method) is presented to synthesize 2D NiFe-based LDHs monolayers, including NiFe, Co-, Ru-, doped, and Au-modified NiFe LDHs. The prerequisite and universality of this strategy are investigated and confirmed. The features of LDHs are characterized by advanced technologies. The obtained LDH bulks own a large interlayer spacing up to 8.2 Å, which can be facilely exfoliated into monolayers in water by hand-shaking within 10 s. As a result, the as-prepared NiFe-based LDH monolayers display a good electrocatalytic oxygen evolution reaction (OER) performance. This facile strategy paves the way for designing easily exfoliated LDHs for highly active catalysts and energy conversion devices based on other monolayer LDHs. Second, with gold-modified tape, 2D MoS2 ML is exfoliated from the bulk crystal through a micromechanical exfoliation method (top-down strategy). The thermal effects of MoS2 ML are confirmed by Raman and photoluminescence (PL) spectra. Moreover, an on-chip MoS2 ML hydrogen evolution reaction (HER) reactor is designed and fabricated. The thermal effects generate efficient electron transfer in the MoS2 ML and at the electrolyte-catalyst (MoS2 ML) interface, leading to an enhanced HER performance. Compared to the results obtained at room temperature, the MoS2 ML shows a direct thermal enhanced HER performance at higher temperatures. In summary, the findings and understandings, the direct synthesis and direct thermal enhancement catalytic performance, of 2D monolayers offer a guideline for synthesizing and catalyst application of other 2D monolayers

SIMD based multicore processor for image and video processing

制度:新 ; 報告番号:甲3602号 ; 学位の種類:博士(工学) ; 授与年月日:2012/3/15 ; 早大学位記番号:新595

NASA SBIR abstracts of 1990 phase 1 projects

The research objectives of the 280 projects placed under contract in the National Aeronautics and Space Administration (NASA) 1990 Small Business Innovation Research (SBIR) Phase 1 program are described. The basic document consists of edited, non-proprietary abstracts of the winning proposals submitted by small businesses in response to NASA's 1990 SBIR Phase 1 Program Solicitation. The abstracts are presented under the 15 technical topics within which Phase 1 proposals were solicited. Each project was assigned a sequential identifying number from 001 to 280, in order of its appearance in the body of the report. The document also includes Appendixes to provide additional information about the SBIR program and permit cross-reference in the 1990 Phase 1 projects by company name, location by state, principal investigator, NASA field center responsible for management of each project, and NASA contract number

Achieving Functional Correctness in Large Interconnect Systems.

In today's semi-conductor industry, large chip-multiprocessors and systems-on-chip are being developed, integrating a large number of components on a single chip. The sheer size of these designs and the intricacy of the communication patterns they exhibit have propelled the development of network-on-chip (NoC) interconnects as the basis for the communication infrastructure in these systems. Faced with the interconnect's growing size and complexity, several challenges hinder its effective validation. During the interconnect's development, the functional verification process relies heavily on the use of emulation and post-silicon validation platforms. However, detecting and debugging errors on these platforms is a difficult endeavour due to the limited observability, and in turn the low verification capabilities, they provide. Additionally, with the inherent incompleteness of design-time validation efforts, the potential of design bugs escaping into the interconnect of a released product is also a concern, as these bugs can threaten the viability of the entire system. This dissertation provides solutions to enable the development of functionally correct interconnect designs. We first address the challenges encountered during design-time verification efforts, by providing two complementary mechanisms that allow emulation and post-silicon verification frameworks to capture a detailed overview of the functional behaviour of the interconnect. Our first solution re-purposes the contents of in-flight traffic to log debug data from the interconnect's execution. This approach enables the validation of the interconnect using synthetic traffic workloads, while attaining over 80% observability of the routes followed by packets and capturing valuable debugging information. We also develop an alternative mechanism that boosts observability by taking periodic snapshots of execution, thus extending the verification capabilities to run both synthetic traffic and real-application workloads. The collected snapshots enhance detection and debugging support, and they provide observability of over 50% of packets and reconstructs at least half of each of their routes. Moreover, we also develop error detection and recovery solutions to address the threat of design bugs escaping into the interconnect's runtime operation. Our runtime techniques can overcome communication errors without needing to store replicate copies of all in-flight packets, thereby achieving correctness at minimal area costsPhDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/116741/1/rawanak_1.pd

Radiation Tolerant Electronics, Volume II

Research on radiation tolerant electronics has increased rapidly over the last few years, resulting in many interesting approaches to model radiation effects and design radiation hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation hardened electronics for space applications, high-energy physics experiments such as those on the large hadron collider at CERN, and many terrestrial nuclear applications, including nuclear energy and safety management. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their ionizing radiation susceptibility has raised many exciting challenges, which are expected to drive research in the coming decade.After the success of the first Special Issue on Radiation Tolerant Electronics, the current Special Issue features thirteen articles highlighting recent breakthroughs in radiation tolerant integrated circuit design, fault tolerance in FPGAs, radiation effects in semiconductor materials and advanced IC technologies and modelling of radiation effects