35 research outputs found
Steppes, savannahs, forests and phytodiversity reservoirs during the Pleistocene in the Iberian Peninsula
A palaeobotanical analysis of the Pleistocene floras and vegetation in the Iberian Peninsula shows the existence of patched landscapes with Pinus woodlands, deciduous and mixed forests, parklands (savannah-like), shrublands, steppes and grasslands. Extinctions of Arctotertiary woody taxa are recorded during the Early and Middle Pleistocene, but glacial refugia facilitated the survival of a number of temperate, Mediterranean and Ibero-North African woody angiosperms. The responses of Iberian vegetation to climatic changes during the Pleistocene have been spatially and temporarily complex, including rapid changes of vegetation in parallel to orbital and suborbital variability, and situations of multi-centennial resilience or accommodation to climatic changes. Regional characteristics emerged as soon as for the Middle Pleistocene, if not earlier: Ericaceae in the Atlantic coast indicating wetter climate, thermo-mediterranean elements in the south as currently, and broad-leaf trees in the northeastern. Overall, steppe landscapes and open Pinus woodlands prevailed over many continental regions during the cold spells of the Late Pleistocene. The maintenance of a high phytodiversity during the glacials was linked to several refuge zones in the coastal shelves of the Mediterranean and intramountainous valleys. Northern Iberia, especially on coastal areas, was also patched with populations of tree species, and this is not only documented by palaeobotanical data (pollen, charcoal) but also postulated by phylogeographical models
Solar supergranulation revealed by granule tracking
Context: Supergranulation is a pattern of the velocity field at the surface
of the Sun, which has been known about for more than fifty years, however, no
satisfactory explanation of its origin has been proposed. Aims: New
observational constraints are therefore needed to guide theoretical approaches
which hesitate between scenarios that either invoke a large-scale instability
of the surface turbulent convection or a direct forcing by buoyancy. Method:
Using the 14-Mpixel CALAS camera at the Pic-du-Midi observatory, we obtained a
7.5h-long sequence of high resolution images with unprecedented field size.
Tracking granules, we have determined the velocity field at the Sun's surface
in great detail from a scale of 2.5Mm up to 250Mm.
Results: The kinetic energy density spectrum shows that supergranulation
peaks at 36Mm and spans on scales ranging between 20Mm and 75Mm. The decrease
of supergranular flows in the small scales is close to a -power law,
steeper than the equipartition Kolmogorov one. The probability distribution
function of the divergence field shows the signature of intermittency of the
supergranulation and thus its turbulent nature.Comment: 4 pages, accepted in Astronomy and Astrophysics (Letters
Detector Technologies for CLIC
The Compact Linear Collider (CLIC) is a high-energy high-luminosity linear
electron-positron collider under development. It is foreseen to be built and
operated in three stages, at centre-of-mass energies of 380 GeV, 1.5 TeV and 3
TeV, respectively. It offers a rich physics program including direct searches
as well as the probing of new physics through a broad set of precision
measurements of Standard Model processes, particularly in the Higgs-boson and
top-quark sectors. The precision required for such measurements and the
specific conditions imposed by the beam dimensions and time structure put
strict requirements on the detector design and technology. This includes
low-mass vertexing and tracking systems with small cells, highly granular
imaging calorimeters, as well as a precise hit-time resolution and power-pulsed
operation for all subsystems. A conceptual design for the CLIC detector system
was published in 2012. Since then, ambitious R&D programmes for silicon vertex
and tracking detectors, as well as for calorimeters have been pursued within
the CLICdp, CALICE and FCAL collaborations, addressing the challenging detector
requirements with innovative technologies. This report introduces the
experimental environment and detector requirements at CLIC and reviews the
current status and future plans for detector technology R&D.Comment: 152 pages, 116 figures; published as CERN Yellow Report Monograph
Vol. 1/2019; corresponding editors: Dominik Dannheim, Katja Kr\"uger, Aharon
Levy, Andreas N\"urnberg, Eva Sickin
Synergies between the constitutive relation error concept and PGD model reduction for simplified V&V procedures
Influence des lymphocytes T activés sur la transition épithélio-mésenchymateuse de l’épithélium bronchique dans un modèle in vitro de bronchiolite oblitérante
Influence des lymphocytes T activés sur la transition épithélio-mésenchymateuse de l’épithélium bronchique dans un modèle in vitro de bronchiolite oblitérante
Assessment and Characterization of Stress Induced by Via-First TSV Technology
Through silicon via (TSV) is a key enabling technology for 3D stacking. One of the main concerns regarding the TSV introduction inside the IC fabrication is the resulting stress buildup in the silicon substrate that may induce warpage or expansion at the wafer level, strain and crystalline defects in the neighboring silicon of the TSV, and finally can impact the performance and reliability of the CMOS devices as well. Polysilicon, tungsten, and copper are the three main conductors that are currently considered for TSV fabrication. In the first part of this paper, the different factors that contribute to the stress in these three TSV types, including the geometry, the materials, and the process, will be reviewed.
After bonding on a temporary carrier and thinning of the substrate to expose the via, the stress built up during the fabrication of the TSV can be also revealed by the expansion of the silicon membrane.
We present thermomechanical FEM simulations and compare them with the experimental findings. We also present some characterizations of silicon defects by chemical revelation around the TSV structures. For characterization of the stress in TSV structures, different techniques as EBSD, microRaman, and XRD are presented. Finally, we conclude that with the optimization of some key processing steps, the stress induced in via-first technology may be acceptable for IC integration.</jats:p
Bridging Data Models and Terminologies to Support Adverse Drug Event Reporting Using EHR Data
The supercam instrument on the NASA Mars 2020 mission: optical design and performance
International audienc
