8 research outputs found

    Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost

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    Cost Comparison of Fan-out Wafer-Level Packaging to Embedded Die Packaging

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    Advances in Wire Bonding Technology for Different Bonding Wire Material

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    A Wirebonding Instrument for Insulated and Coaxial Wires

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    A Wirebonding Instrument for Insulated and Coaxial Wires

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    Commercialization and application-driven economic viability of sensor technology

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    Sensor technology often provides cost-effective solutions for a large range of applications. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This chapter introduces the key topics that engineers need to understand during the development of sensor technologies for commercially successful products
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