Strong light-matter coupling in bulk GaN-microcavities with double dielectric mirrors fabricated by two different methods

Two routes for the fabrication of bulk GaN microcavities embedded between two dielectric mirrors are described, and the optical properties of the microcavities thus obtained are compared. In both cases, the GaN active layer is grown by molecular beam epitaxy on (111) Si, allowing use of selective etching to remove the substrate. In the first case, a three period Al0.2Ga0.8N / AlN Bragg mirror followed by a lambda/2 GaN cavity are grown directly on the Si. In the second case, a crack-free 2,mu m thick GaN layer is grown, and progressively thinned to a final thickness of lambda. Both devices work in the strong coupling regime at low temperature, as evidenced by angle-dependent reflectivity or transmission experiments. However, strong light-matter coupling in emission at room temperature is observed only for the second one. This is related to the poor optoelectronic quality of the active layer of the first device, due to its growth only 250 nm above the Si substrate and its related high defect density. The reflectivity spectra of the microcavities are well accounted for by using transfer matrix calculations. (C) 2010 American Institute of Physics. [doi:10.1063/1.3477450

Patterned silicon substrates: a common platform for room temperature GaN and ZnO polariton lasers

A new platform for fabricating polariton lasers operating at room temperature is introduced: nitride-based distributed Bragg reflectors epitaxially grown on patterned silicon substrates. The patterning allows for an enhanced strain relaxation thereby enabling to stack a large number of crack-free AlN/AlGaN pairs and achieve cavity quality factors of several thousands with a large spatial homogeneity. GaN and ZnO active regions are epitaxially grown thereon and the cavities are completed with top dielectric Bragg reflectors. The two structures display strong-coupling and polariton lasing at room temperature and constitute an intermediate step in the way towards integrated polariton devices

Micro-Auger Electron Spectroscopy Studies of Chemical and Electronic Effects at GaN-Sapphire Interfaces

We have used cross-sectional micro-Auger electron spectroscopy (AES), coupled with micro-cathodoluminescence (CLS) spectroscopy, in a UHV scanning electron microscope to probe the chemical and related electronic features of hydride vapor phase epitaxy GaN/sapphire interfaces on a nanometer scale. AES images reveal dramatic evidence for micron-scale diffusion of O from Al2O3 into GaN. Conversely, plateau concentrations of N can extend microns into the sapphire, corresponding spatially to a 3.8 eV defect emission and Auger chemical shifts attributed to Al-N-O complexes. Interface Al Auger signals extending into GaN indicates AlGaN alloy formation, consistent with a blue-shifted CLS local interface emission. The widths of such interface transition regions range from ≪100 nm to ∼1 μm, depending on surface pretreatment and growth conditions. Secondary ion mass spectroscopy depth profiles confirm the elemental character and spatial extent of diffusion revealed by micro-AES, showing that cross-sectional AES is a useful approach to probe interdiffusion and electronic properties at buried interfaces

Analysis of the characteristic temperatures of (Ga,In)(N,As)/GaAs laser diodes

The characteristic temperatures of the threshold current density, T0, and external differential quantum efficiency, T1, of a series of (Ga,In)(N,As)/GaAs quantum well (QW) laser diodes are measured in the wavelength range from 1 to 1.5μm. It is found that both T0 and T1 strongly decrease with increasing lasing wavelength. The origin of this degradation is shown to be, in the case of T0, mostly dominated by a decrease in the transparency current density characteristic temperature, an increase in the optical losses and a decrease in the modal gain. The degradation of T1 is mainly due to the increase in the optical losses. The effective carrier recombination lifetime in the QW is shown to decrease from 1.2 to 0.2 ns with N content up to 2%, in good agreement with previous reports that link this low lifetime to non-radiative monomolecular recombination through defects in the QW. Carrier leakage is ruled out as the dominant process degrading T0 and T1 on the basis of the temperature dependence of the effective carrier recombination lifetime

Low loss GaN waveguides for visible light on Si substrates

In this work, we present the fabrication and the characterization of an optical waveguide made of AlN and GaN layers grown by MBE on a Si(111) substrate. For the fundamental mode at 633 nm, the propagation losses are in the order of 2 dB/cm, which is a good number for SC waveguides at this wavelength. The propagation losses dramatically increase with the mode order. A careful comparison of measurements and modeling of the complete structure allows identifying the part of the losses due to absorption in the Si substrate, and showing that propagation losses could be further reduced by using well chosen SOI substrates

Ballistic Electron Emission Microscopy on CoSi2{}_2/Si(111) interfaces: band structure induced atomic-scale resolution and role of localized surface states

Applying a Keldysh Green`s function method it is shown that hot electrons injected from a STM-tip into a CoSi${}_2$/Si(111) system form a highly focused beam due to the silicide band structure. This explains the atomic resolution obtained in recent Ballistic Electron Emission Microscopy (BEEM) experiments. Localized surface states in the $(2 \times 1)$-reconstruction are found to be responsible for the also reported anticorrugation of the BEEM current. These results clearly demonstrate the importance of bulk and surface band structure effects for a detailed understanding of BEEM data.Comment: 5 pages, RevTex, 4 postscript figures, http://www.icmm.csic.es/Pandres/pedro.ht

Cleaved-facet violet laser diodes with lattice-matched Al0.82In0.18N/GaN multilayers as n-cladding

Electrically injected, edge-emitting cleaved-facet violet laser diodes were realized using a 480 nm thick lattice matched Si doped Al0.82In0.18N/GaN multilayer as the cladding on the n-side of the waveguide. Far-field measurements verify strong mode confinement to the waveguide. An extra voltage is measured and investigated using separate mesa structures with a single AlInN insertion. This showed that the electron current has a small thermally activated shunt resistance with a barrier of 0.135 eV and a current which scales according to V-n, where n similar to 3 at current densities appropriate to laser operation. (C) 2011 American Institute of Physics. (doi:10.1063/1.3589974

The 2020 UV emitter roadmap

Solid state UV emitters have many advantages over conventional UV sources. The (Al,In,Ga)N material system is best suited to produce LEDs and laser diodes from 400 nm down to 210 nm—due to its large and tuneable direct band gap, n- and p-doping capability up to the largest bandgap material AlN and a growth and fabrication technology compatible with the current visible InGaN-based LED production. However AlGaN based UV-emitters still suffer from numerous challenges compared to their visible counterparts that become most obvious by consideration of their light output power, operation voltage and long term stability. Most of these challenges are related to the large bandgap of the materials. However, the development since the first realization of UV electroluminescence in the 1970s shows that an improvement in understanding and technology allows the performance of UV emitters to be pushed far beyond the current state. One example is the very recent realization of edge emitting laser diodes emitting in the UVC at 271.8 nm and in the UVB spectral range at 298 nm. This roadmap summarizes the current state of the art for the most important aspects of UV emitters, their challenges and provides an outlook for future developments