A review of advances in pixel detectors for experiments with high rate and radiation

The Large Hadron Collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the High Luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. This paper reviews the world-wide effort on these developments.Comment: 84 pages with 46 figures. Review article.For submission to Rep. Prog. Phy

Skybridge-3D-CMOS: A Fine-Grained Vertical 3D-CMOS Technology Paving New Direction for 3D IC

2D CMOS integrated circuit (IC) technology scaling faces severe challenges that result from device scaling limitations, interconnect bottleneck that dominates power and performance, etc. 3D ICs with die-die and layer-layer stacking using Through Silicon Vias (TSVs) and Monolithic Inter-layer Vias (MIVs) have been explored in recent years to generate circuits with considerable interconnect saving for continuing technology scaling. However, these 3D IC technologies still rely on conventional 2D CMOS’s device, circuit and interconnect mindset showing only incremental benefits while adding new challenges reliability issues, robustness of power delivery network design and short-channel effects as technology node scaling. Skybridge-3D-CMOS (S3DC) is a fine-grained 3D IC fabric that uses vertically-stacked gates and 3D interconnections composed on vertical nanowires to yield orders of magnitude benefits over 2D ICs. This 3D fabric fully uses the vertical dimension instead of relying on a multi-layered 2D mindset. Its core fabric aspects including device, circuit-style, interconnect and heat-extraction components are co-architected considering the major challenges in 3D IC technology. In S3DC, the 3D interconnections provide greater routing capacity in both vertical and horizontal directions compared to conventional 3D ICs, which eliminates the routability issue in conventional 3D IC technology while enabling ultra-high density design and significant benefits over 2D. Also, the improved vertical routing capacity in S3DC is beneficial for achieving robust and high-density power delivery network (PDN) design while conventional 3D IC has design issues in PDN design due to limited routing resource in vertical direction. Additionally, the 3D gate-all-around transistor incorporating with 3D interconnect in S3DC enables significant SRAM design benefits and good tolerance of process variation compared to conventional 3D IC technology as well as 2D CMOS. The transistor-level (TR-L) monolithic 3D IC (M3D) is the state-of-the-art monolithic 3D technology which shows better benefits than other M3D approaches as well as the TSV-based 3D IC approach. The S3DC is evaluated in large-scale benchmark circuits with comparison to TR-L M3D as well as 2D CMOS. Skybridge yields up to 3x lower power against 2D with no routing congestion in benchmark circuits while TR-L M3D only has up-to 22% power saving with severe routing congestions in the design. The PDN design in S3DC show

Feasibility of Geiger-mode avalanche photodiodes in CMOS standard technologies for tracker detectors

The next generation of particle colliders will be characterized by linear lepton colliders, where the collisions between electrons and positrons will allow to study in great detail the new particle discovered at CERN in 2012 (presumably the Higgs boson). At present time, there are two alternative projects underway, namely the ILC (International Linear Collider) and CLIC (Compact LInear Collider). From the detector point of view, the physics aims at these particle colliders impose such extreme requirements, that there is no sensor technology available in the market that can fulfill all of them. As a result, several new detector systems are being developed in parallel with the accelerator. This thesis presents the development of a GAPD (Geiger-mode Avalanche PhotoDiode) pixel detector aimed mostly at particle tracking at future linear colliders. GAPDs offer outstanding qualities to meet the challenging requirements of ILC and CLIC, such as an extraordinary high sensitivity, virtually infinite gain and ultra-fast response time, apart from compatibility with standard CMOS technologies. In particular, GAPD detectors enable the direct conversion of a single particle event onto a CMOS digital pulse in the sub-nanosecond time scale without the utilization of either preamplifiers or pulse shapers. As a result, GAPDs can be read out after each single bunch crossing, a unique quality that none of its competitors can offer at the moment. In spite of all these advantages, GAPD detectors suffer from two main problems. On the one side, there exist noise phenomena inherent to the sensor, which induce noise pulses that cannot be distinguished from real particle events and also worsen the detector occupancy to unacceptable levels. On the other side, the fill-factor is too low and gives rise to a reduced detection efficiency. Solutions to the two problems commented that are compliant with the severe specifications of the next generation of particle colliders have been thoroughly investigated. The design and characterization of several single pixels and small arrays that incorporate some elements to reduce the intrinsic noise generated by the sensor are presented. The sensors and the readout circuits have been monolithically integrated in a conventional HV-CMOS 0.35 μm process. Concerning the readout circuits, both voltage-mode and current-mode options have been considered. Moreover, the time-gated operation has also been explored as an alternative to reduce the detected sensor noise. The design and thorough characterization of a prototype GAPD array, also monolithically integrated in a conventional 0.35 μm HV-CMOS process, is presented in the thesis as well. The detector consists of 10 rows x 43 columns of pixels, with a total sensitive area of 1 mm x 1 mm. The array is operated in a time-gated mode and read out sequentially by rows. The efficiency of the proposed technique to reduce the detected noise is shown with a wide variety of measurements. Further improved results are obtained with the reduction of the working temperature. Finally, the suitability of the proposed detector array for particle detection is shown with the results of a beam-test campaign conducted at CERN-SPS (European Organization for Nuclear Research-Super Proton Synchrotron). Apart from that, a series of additional approaches to improve the performance of the GAPD technology are proposed. The benefits of integrating a GAPD pixel array in a 3D process in terms of overcoming the fill-factor limitation are examined first. The design of a GAPD detector in the Global Foundries 130 nm/Tezzaron 3D process is also presented. Moreover, the possibility to obtain better results in light detection applications by means of the time-gated operation or correction techniques is analyzed too.Aquesta tesi presenta el desenvolupament d’un detector de píxels de GAPDs (Geiger-mode Avalanche PhotoDiodes) dedicat principalment a rastrejar partícules en futurs col•lisionadors lineals. Els GAPDs ofereixen unes qualitats extraordinàries per satisfer els requisits extremadament exigents d’ILC (International Linear Collider) i CLIC (Compact LInear Collider), els dos projectes per la propera generació de col•lisionadors que s’han proposat fins a dia d’avui. Entre aquestes qualitats es troben una sensibilitat extremadament elevada, un guany virtualment infinit i una resposta molt ràpida, a part de ser compatibles amb les tecnologies CMOS estàndard. En concret, els detectors de GAPDs fan possible la conversió directa d’un esdeveniment generat per una sola partícula en un senyal CMOS digital amb un temps inferior al nanosegon. Com a resultat d’aquest fet, els GAPDs poden ser llegits després de cada bunch crossing (la col•lisió de les partícules), una qualitat única que cap dels seus competidors pot oferir en el moment actual. Malgrat tots aquests avantatges, els detectors de GAPDs pateixen dos grans problemes. D’una banda, existeixen fenòmens de soroll inherents al sensor, els quals indueixen polsos de soroll que no poden ser distingits dels esdeveniments reals generats per partícules i que a més empitjoren l’ocupació del detector a nivells inacceptables. D’altra banda, el fill-factor (és a dir, l’àrea sensible respecte l’àrea total) és molt baix i redueix l’eficiència detectora. En aquesta tesi s’han investigat solucions als dos problemes comentats i que a més compleixen amb les especificacions altament severes dels futurs col•lisionadors lineals. El detector de píxels de GAPDs, el qual ha estat monolíticament integrat en un procés HV-CMOS estàndard de 0.35 μm, incorpora circuits de lectura en mode voltatge que permeten operar el sensor en l’anomenat mode time-gated per tal de reduir el soroll detectat. L’eficiència de la tècnica proposada queda demostrada amb la gran varietat d’experiments que s’han dut a terme. Els resultats del beam-test dut a terme al CERN indiquen la capacitat del detector de píxels de GAPDs per detectar partícules altament energètiques. A banda d’això, també s’han estudiat els beneficis d’integrar un detector de píxels de GAPDs en un procés 3D per tal d’incrementar el fill-factor. L’anàlisi realitzat conclou que es poden assolir fill-factors superiors al 90%

Towards Single-Chip Nano-Systems

Important scientific discoveries are being propelled by the advent of nano-scale sensors that capture weak signals from their environment and pass them to complex instrumentation interface circuits for signal detection and processing. The highlight of this research is to investigate fabrication technologies to integrate such precision equipment with nano-sensors on a single complementary metal oxide semiconductor (CMOS) chip. In this context, several demonstration vehicles are proposed. First, an integration technology suitable for a fully integrated flexible microelectrode array has been proposed. A microelectrode array containing a single temperature sensor has been characterized and the versatility under dry/wet, and relaxed/strained conditions has been verified. On-chip instrumentation amplifier has been utilized to improve the temperature sensitivity of the device. While the flexibility of the array has been confirmed by laminating it on a fixed single cell, future experiments are necessary to confirm application of this device for live cell and tissue measurements. The proposed array can potentially attach itself to the pulsating surface of a single living cell or a network of cells to detect their vital signs

Characterization of a Monolithic Pixel Sensor Prototype in HV-CMOS Technology for the High-Luminosity LHC

The Large Hadron Collider (LHC) is planned to undergo a major upgrade, called the High-Luminosity LHC (HL-LHC), to fully exploit its physics potential until the end of its operation with an instantaneous luminosity of 5 to 7.5 times the design value (1*10^34 cm^(-2)s^(−1)). Consequently, the LHC experiments have to be upgraded as well (Phase-II upgrade) to be able to cope with the resulting increase in pile-up, data rates, and radiation doses. Therefore, the tracking detector of the ATLAS experiment, the Inner Detector, will be fully replaced by a new all-silicon tracking detector, the Inner Tracker (ITk). While it has been decided that only the baseline design of the pixel part of the ITk will be pursued, which foresees the use of hybrid pixel detectors, it has been worthwhile to study monolithic pixel sensor options as well, whose production is comparatively cost-efficient. Monolithic pixel sensors have recently made their way into particle physics experiments and they were considered as an alternative sensor option for the outermost pixel layer of the ITk. Within the scope of this thesis, a high voltage monolithic active pixel sensor (HV-MAPS) prototype, called ATLASPix_Simple, was characterized and studied regarding its suitability for the use in the ITk

Sampled charge reuse for power reduction in switched capacitor data converters

Advances in semiconductor fabrication have enabled the shrinking of digital systems dramatically over the years. Although digital circuitry benefits tremendously from the constant shrinking of the device sizes, the benefits for analog circuits are not quite so dramatic. Low power is of critical importance in all mobile devices. Any reduction in power in the embedded analog-to-digital converters (ADCs) in such devices can help prolong the battery life. A technique is proposed that can be used to reduce power dissipation in ADCs that use switched-capacitor gain stages. It is shown for a pipeline ADC that the signal charge stored across the feedback capacitor from the first stage can be reused in the second stage at the end of the first stage\u27s amplify phase. The extra overhead of an extra capacitor is justified by the power savings of the proposed scheme;A well known approach for reducing the power dissipation in pipelined ADCs is the scaling down of capacitors progressively down the pipeline stream. The proposed technique combines the scaling of the capacitors with charge reuse. This combination inherits the power saving benefits of capacitor scaling and adds to the power saving by sharing the capacitor in two consecutive stages. Due to the highest power budget allocated to the first two stages, the sharing 2 is limited to the first two stages. Additionally, it is shown that the charge reuse results in reducing the total capacitive load driven by a stage\u27s opamp, potentially reducing the current requirements of the opamp;The proposed technique has been adapted for use in cyclic ADCs. The proposed technique reuses the charge from the first cycle in the next. This approach helps to reduce the die area of the capacitors in the switched capacitor network by up to 50%. Consequently, the power consumption requirement of the operational amplifier can be reduced. This is achieved while maintaining the thermal noise performance and conversion rate of the conventional structure. A 10-bit, 2.3MHz cyclic ADC using the new structure is implemented in 0.5mum CMOS. Spectre simulation results show a THD of -76dB and SFDR of -74.95dB