1,606 research outputs found

    Doctor of Philosophy

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    dissertationIn order to ensure high production yield of semiconductor devices, it is desirable to characterize intermediate progress towards the final product by using metrology tools to acquire relevant measurements after each sequential processing step. The metrology data are commonly used in feedback and feed-forward loops of Run-to-Run (R2R) controllers to improve process capability and optimize recipes from lot-to-lot or batch-to-batch. In this dissertation, we focus on two related issues. First, we propose a novel non-threaded R2R controller that utilizes all available metrology measurements, even when the data were acquired during prior runs that differed in their contexts from the current fabrication thread. The developed controller is the first known implementation of a non-threaded R2R control strategy that was successfully deployed in the high-volume production semiconductor fab. Its introduction improved the process capability by 8% compared with the traditional threaded R2R control and significantly reduced out of control (OOC) events at one of the most critical steps in NAND memory manufacturing. The second contribution demonstrates the value of developing virtual metrology (VM) estimators using the insight gained from multiphysics models. Unlike the traditional statistical regression techniques, which lead to linear models that depend on a linear combination of the available measurements, we develop VM models, the structure of which and the functional interdependence between their input and output variables are determined from the insight provided by the multiphysics describing the operation of the processing step for which the VM system is being developed. We demonstrate this approach for three different processes, and describe the superior performance of the developed VM systems after their first-of-a-kind deployment in a high-volume semiconductor manufacturing environment

    Calibration and evaluation of optical systems for full-field strain measurement

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    The design and testing of a reference material for the calibration of optical systems for strain measurement is described, together with the design and testing of a standardized test material that allows the evaluation and assessment of fitness for purpose of the most sophisticated optical system for strain measurement. A classification system for the steps in the measurement process is also proposed and allows the development of a unified approach to diagnostic testing of components or sub-systems in an optical system for strain measurement based on any optical technique. The results described arise from a European study known as SPOTS whose objectives were to begin to fill the gap caused by a lack of standards

    Statistical Methods for Semiconductor Manufacturing

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    In this thesis techniques for non-parametric modeling, machine learning, filtering and prediction and run-to-run control for semiconductor manufacturing are described. In particular, algorithms have been developed for two major applications area: - Virtual Metrology (VM) systems; - Predictive Maintenance (PdM) systems. Both technologies have proliferated in the past recent years in the semiconductor industries, called fabs, in order to increment productivity and decrease costs. VM systems aim of predicting quantities on the wafer, the main and basic product of the semiconductor industry, that may be physically measurable or not. These quantities are usually ’costly’ to be measured in economic or temporal terms: the prediction is based on process variables and/or logistic information on the production that, instead, are always available and that can be used for modeling without further costs. PdM systems, on the other hand, aim at predicting when a maintenance action has to be performed. This approach to maintenance management, based like VM on statistical methods and on the availability of process/logistic data, is in contrast with other classical approaches: - Run-to-Failure (R2F), where there are no interventions performed on the machine/process until a new breaking or specification violation happens in the production; - Preventive Maintenance (PvM), where the maintenances are scheduled in advance based on temporal intervals or on production iterations. Both aforementioned approaches are not optimal, because they do not assure that breakings and wasting of wafers will not happen and, in the case of PvM, they may lead to unnecessary maintenances without completely exploiting the lifetime of the machine or of the process. The main goal of this thesis is to prove through several applications and feasibility studies that the use of statistical modeling algorithms and control systems can improve the efficiency, yield and profits of a manufacturing environment like the semiconductor one, where lots of data are recorded and can be employed to build mathematical models. We present several original contributions, both in the form of applications and methods. The introduction of this thesis will be an overview on the semiconductor fabrication process: the most common practices on Advanced Process Control (APC) systems and the major issues for engineers and statisticians working in this area will be presented. Furthermore we will illustrate the methods and mathematical models used in the applications. We will then discuss in details the following applications: - A VM system for the estimation of the thickness deposited on the wafer by the Chemical Vapor Deposition (CVD) process, that exploits Fault Detection and Classification (FDC) data is presented. In this tool a new clustering algorithm based on Information Theory (IT) elements have been proposed. In addition, the Least Angle Regression (LARS) algorithm has been applied for the first time to VM problems. - A new VM module for multi-step (CVD, Etching and Litography) line is proposed, where Multi-Task Learning techniques have been employed. - A new Machine Learning algorithm based on Kernel Methods for the estimation of scalar outputs from time series inputs is illustrated. - Run-to-Run control algorithms that employ both the presence of physical measures and statistical ones (coming from a VM system) is shown; this tool is based on IT elements. - A PdM module based on filtering and prediction techniques (Kalman Filter, Monte Carlo methods) is developed for the prediction of maintenance interventions in the Epitaxy process. - A PdM system based on Elastic Nets for the maintenance predictions in Ion Implantation tool is described. Several of the aforementioned works have been developed in collaborations with major European semiconductor companies in the framework of the European project UE FP7 IMPROVE (Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab pErformance); such collaborations will be specified during the thesis, underlying the practical aspects of the implementation of the proposed technologies in a real industrial environment

    Thermal effects compensation and associated uncertainty for large magnet assembly precision alignment

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    Big science and ambitious industrial projects continually push technical requirements forward beyond the grasp of conventional engineering techniques. An example of these are the extremely tight micrometric assembly and alignment tolerances required in the field of celestial telescopes, particle accelerators, and the aerospace industry. Achieving such extreme requirements for large assemblies is limited, largely by the capability of the metrology used, namely, its uncertainty in relation to the alignment tolerance required. The current work described here was done as part of Maria Curie European research project held at CERN, Geneva. This related to future accelerators requiring the spatial alignment of several thousand, metre-plus large assemblies to a common datum within a targeted combined standard uncertainty (uctg(y)) of 12â€ŻÎŒm. The current work has found several gaps in knowledge limiting such a capability. Among these was the lack of uncertainty statements for the thermal error compensation applied to correct for the assembly's dimensional instability, post metrology and during assembly and alignment. A novel methodology was developed by which a mixture of probabilistic modelling and high precision traceable reference measurements were used to quantify the uncertainty of the various thermal expansion models used namely: Empirical, Finite Element Method (FEM) models and FEM metamodels. Results have shown that the suggested methodology can accurately predict the uncertainty of the thermal deformation predictions made and thus compensations. The analysis of the results further showed how using this method a ‘digital twin’ of the engineering structure can be calibrated with known uncertainty of the thermal deformation behaviour predictions in the micrometric range. Namely, the Empirical, FEM and FEM metamodels combined standard uncertainties ( uc(y) ) of prediction were validated to be of maximum: 8.7â€ŻÎŒm, 11.28â€ŻÎŒm and 12.24â€ŻÎŒm for the studied magnet assemblies

    Global and Local Virtual Metrology Models for a Plasma Etch Process

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    Virtual metrology (VM) is the estimation of metrology variables that may be expensive or difficult to measure using readily available process information. This paper investigates the application of global and local VM schemes to a data set recorded from an industrial plasma etch chamber. Windowed VM models are shown to be the most accurate local VM scheme, capable of producing useful estimates of plasma etch rates over multiple chamber maintenance events and many thousands of wafers. Partial least-squares regression, artificial neural networks, and Gaussian process regression are investigated as candidate modeling techniques, with windowed Gaussian process regression models providing the most accurate results for the data set investigated

    Comparison of the measurement performance of high precision multi-axis metal cutting machine tools

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    High precision manufacturers continuously seek out disruptive technologies to improve the quality, cost, and delivery of their products. With the advancement of machine tool and measurement technology many companies are ready to capitalise on the opportunity of on-machine measurement (OMM). Coupled with business case, manufacturing engineers are now questioning whether OMM can soon eliminate the need for post-process inspection systems. Metrologists will however argue that the machining environment is too hostile and that there are numerous process variables which need consideration before traceable measurement on-the-machine can be achieved. In this paper we test the measurement capability of five new multi-axis machine tools enabled as OMM systems via on-machine probing. All systems are tested under various operating conditions in order to better understand the effects of potentially significant variables. This investigation has found that key process variables such as machine tool warm-up and tool-change cycles can have an effect on machine tool measurement repeatability. New data presented here is important to many manufacturers whom are considering utilising their high precision multi-axis machine tools for both the creation and verification of their products
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