A sub-1 V, 26 μw, low-output-impedance CMOS bandgap reference with a low dropout or source follower mode

We present a low-power bandgap reference (BGR), functional from sub-1 V to 5 V supply voltage with either a low dropout (LDO) regulator or source follower (SF) output stage, denoted as the LDO or SF mode, in a 0.5-μm standard digital CMOS process with V tn≈ 0.6 V and |V tp| ≈ 0.7 V at 27 °C. Both modes operate at sub-1 V under zero load with a power consumption of around 26 μW. At 1 V (1.1 V) supply, the LDO (SF) mode provides an output current up to 1.1 mA (0.35 mA), a load regulation of ±8.5 mV/mA (±33 mV/mA) with approximately 10 μ s transient, a line regulation of ±4.2 mV/V (±50μV/V), and a temperature compensated reference voltage of 0.228 V (0.235 V) with a temperature coefficient around 34 ppm/° C from -20°C to 120 °C. At 1.5 V supply, the LDO (SF) mode can further drive up to 9.6 mA (3.2 mA) before the reference voltage falls to 90% of its nominal value. Such low-supply-voltage and high-current-driving BGR in standard digital CMOS processes is highly useful in portable and switching applications. © 2010 IEEE.published_or_final_versio

Integrated Circuits for Programming Flash Memories in Portable Applications

Smart devices such as smart grids, smart home devices, etc. are infrastructure systems that connect the world around us more than before. These devices can communicate with each other and help us manage our environment. This concept is called the Internet of Things (IoT). Not many smart nodes exist that are both low-power and programmable. Floating-gate (FG) transistors could be used to create adaptive sensor nodes by providing programmable bias currents. FG transistors are mostly used in digital applications like Flash memories. However, FG transistors can be used in analog applications, too. Unfortunately, due to the expensive infrastructure required for programming these transistors, they have not been economical to be used in portable applications. In this work, we present low-power approaches to programming FG transistors which make them a good candidate to be employed in future wireless sensor nodes and portable systems. First, we focus on the design of low-power circuits which can be used in programming the FG transistors such as high-voltage charge pumps, low-drop-out regulators, and voltage reference cells. Then, to achieve the goal of reducing the power consumption in programmable sensor nodes and reducing the programming infrastructure, we present a method to program FG transistors using negative voltages. We also present charge-pump structures to generate the necessary negative voltages for programming in this new configuration

A simple sub-1V voltage reference

A traditional bandgap reference voltage has a value approximately equal to 1.2V. This is an inconvenient value to obtain in short-channel CMOS circuits where the nominal power supply voltage is 1.2V or lower. Here, a simple circuit is presented to generate a reference voltage between 600mV and 800mV, based on the threshold voltage of a MOS device, which will be suitable for biasing transistors in strong inversion as well as for use in 6-bit data converters needed for high speed data communication systems. The circuit uses a novel, but simple, method for generating the temperature coefficients needed for generating a stable voltage reference across temperature. The core circuit produces a PTAT current that when passed through a diode-connected device, with a CTAT threshold voltage, will produce a voltage that is stable across temperature. The measured results demonstrate an average voltage variation of 4.62mV across five chips, each containing eight voltage reference circuits, and a minimum voltage variation of 1.1mV from 0°C to 80°C. A variation of the proposed circuit replaces the BJTs with MOSFETs to achieve smaller area, and simulation results indicate even less voltage variation across temperature.Electrical and Computer Engineerin

Fully Integrated Voltage Reference Circuits

(Doktora) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 2014(PhD) -- İstanbul Technical University, Institute of Science and Technology, 2014Gerilim referans devreleri, elektriksel sistemlerde diğer alt blokların çalışmaları için kararlı bir çalışma noktası üretmeleri sebebiyle veri dönüştürücüler (ADC - DAC), frekans sentezleyiciler, DC-DC ve AC-DC dönüştürücüler ve lineer regülatörler gibi pek çok elektriksel sistemin en temel yapı bloklarındandır. İdeal olarak, üretilen bu referans noktası, sıcaklık, üretim süreçleri, besleme gerilim degişimleri ve yükleme etkileri gibi çalışma koşullarından etkilenmemelidir. Bir referans devresinin doğruluğu bahsedilen çalışma koşullarının etkisiyle mutlak değerinden ne kadar saptığı olarak tanımlanır. Modern haberleşme sistemleri ve tüketici ürünlerindeki gelişmeler ile birlikte yüksek entegrasyon ve doğruluklu sistemlere olan talep artmıştır. Tümdevre sistemlerinde, alt blokların çalışma noktalarını belirlemesi nedeniyle özellikle referans devrelerinin performansları bütün sistemin performansının belirlenmesinde önemli rol oynamaktadır. Dolayısıyla yüksek performanslı sistemlere olan talep, bu performansların elde edilmesi için kullanılan düşük geometrili üretim teknolojilerine uygun, yani giderek azalan besleme gerilimleri ile çalışabilecek yüksek doğruluklu referans devrelerine olan talebi de arttırmıştır. Bu nedenle bu çalışmada gerilim referans devre topolojilerine odaklanılmıştır. Bu doğrultuda, öncelikle yüksek doğruluklu, düşük gürültülü gerilim refereans devre topolojileri üzerinde çalışılarak 0.35 um CMOS teknoljisinde farklı tasarımlar yapılmıştır. Bu aşamada temel hedef, yüksek dogrulukluk olarak belirenmiş ve yapılan tasarımlarda, üretim sonrası ayarlamalardan sonra sıcaklık katsayısı 3 ppm/C olabilecek devreler tasarlanmıştır. Ancak, 0.35 um CMOS üretim teknolojisi kullanılması ve kullanılan topolojiler dolayısıyla, devrelerin çalışabileceği minimum besleme gerilim seviyesi 1.8 V ile sınırlı kalmıştır. Devrelerin çektikleri akımlar ise 20-30 uA seviyesindedir. Bu tasarımlar sırasında (triple-well üretim teknlojileri için), önerilen blok gövde izolasyon stratejisi, tasarımı yapılan devrenin gövdesinin tümdevrenin geri kalan kısmından ters kutuplanmış bir jonksiyon diyodu sayesinde izole edilmesine dayanmaktadır ve devrenin gövde gürültüsünden etkilenmesini önemli ölçüde azaltmaktadır. Son olarak, çoğunlukla osilatör devrelerinde uygulanan anahtarlamalı kutuplama tekniği uygulanarak devrelerin düşük frekans gürültü performansının iyileştirilmesi amaçlanmıştır. Çalışmanın geri kalan kısmında, düşük besleme gerilimleriyle çalışabilecek mikron-altı üretim teknolojilerine uygun gerilim referans devre topolojileri üzerine odaklanılmıştır. Bu doğrultuda, iki yeni düşük besleme gerilimli ve düşük güç tüketimli gerilim referans devre topolojisi önerilmiştir. Önerilen topolojiler, 0.18 um CMOS üretim teknolojisinde gerçeklenmiştir. Ölçüm sonuçları, tasarlanan gerilim refarans devrelerinin 0.65 V besleme gerilimi ile çalışabildiğini göstermiştir. Önerilen devre topolojileri ile 0-120 C sıcaklık aralığında, sıcaklık katsayısı 50 ppm/C olan 193 mV seviyesinde referans gerilimleri elde edilmiştir. Devrelerin güç tüketimleri sırasıyla 0.3 uW ve 0.4 uW iken kapladıkları alan 0.2 mm^2 ve 0.08 mm^2 dir. Sonuç olarak, önerilen devre topolojileri ile literatürde yer alan diğer 1V-altı referans devreleri ile karşılatrılabilir seviyede sıcaklık katsayısı olan referans gerilimleri çok daha düşük güç harcamasıyla elde edilmiştir.Voltage references are one of the basic building blocks of many SoCs and mixed-signal ICs such as data converters, voltage regulators and operational amplifiers as they constitute a stable reference voltage for other sub-circuits to generate predictable and repeatable results. Ideally, this reference point should not change with external influences or operating conditions such as temperature, fabrication process variations, power supply variations and transient loading effects. Along with the rapid development of modern communication systems and consumer products, which constitutes the main market for semiconductor industry, the market demand for these System on Chip (SoC) or Mixed Signal ICs to have lower power consumption, higher accuracy and lower cost, and thus, higher integration. Since the performance of the whole system depends strongly to the performance of the reference circuit, this work is focused on fully integrated voltage reference architectures. With this motivation, firstly, different kinds of high precision low noise voltage reference circuits are designed in standard 0.35 um CMOS technology that we have more experience and knowledge of. The essential goal of these studies was high precision and temperature coefficient of the designed voltage reference circuits are on the order of 3 ppm/C with trimming after production. However, since 0.35 um CMOS technology is used in these designs and also due to the chosen topologies their minimum supply voltage can be down to 1.8 V and while current consumption is on the order of 20-30 uA. In the design of the this voltage reference block bulk isolation technique is proposed (for triple-well CMOS processes), in which system blocks are bulk isolated by a reverse biased junction diode from the rest of the die to drastically reduce substrate noise coupling. This is especially important if a very low power voltage reference is designed in a very noisy SoC. Moreover, the switched biasing technique, which is mostly applied to the oscillators, is also implemented to the designed BGR in order to improve the low noise performance of the circuit. The rest of the thesis is focused on new voltage reference topologies that are appropriate for sub-micron technologies operating with low supply voltages. With this motivation two new low voltage and low power voltage reference topologies are proposed. The proposed voltage reference topologies are implemented and fabricated in 0.18 um CMOS technology. Measurement results show that the proposed voltage reference circuits are working properly down to 0.65 V and achieve an output voltage of 193 mV with a temperature coefficient on the order of 50 ppm/C in the temperature range of 0-120C. The total power consumption of the two designed voltage references are 0.3 uW and 0.4 uW at 27 C, while occupying the area of 0.2 mm^2 and 0.08 mm^2, respectively. As a result, the proposed voltage reference topologies generate a reference voltage with comparable level of temperature coefficient and quite low power consumption with respect to the other sub-1V voltage reference circuits reported in the literature.DoktoraPh

Design of Analog CMOS Circuits for Batteryless Implantable Telemetry Systems

A wireless biomedical telemetry system is a device that collects biomedical signal measurements and transmits data through wireless RF communication. Testing medical treatments often involves experimentation on small laboratory animals, such as genetically modified mice and rats. Using batteries as a power source results in many practical issues, such as increased size of the implant and limited operating lifetime. Wireless power harvesting for implantable biomedical devices removes the need for batteries integrated into the implant. This will reduce device size and remove the need for surgical replacement due to battery depletion. Resonant inductive coupling achieves wireless power transfer in a manner modelled by a step down transformer. With this methodology, power harvesting for an implantable device is realized with the use of a large primary coil external to the subject, and a smaller secondary coil integrated into the implant. The signal received from the secondary coil must be regulated to provide a stable direct current (DC) power supply, which will be used to power the electronics in the implantable device. The focus of this work is on development of an electronic front-end for wireless powering of an implantable biomedical device. The energy harvesting front-end circuit is comprised of a rectifier, LDO regulator, and a temperature insensitive voltage reference. Physical design of the front-end circuit is developed in 0.13um CMOS technology with careful attention to analog layout issues. Post-layout simulation results are presented for each sub-block as well as the full front-end structure. The LDO regulator operates with supply voltages in the range of 1V to 1.5V with quiescent current of 10.5uA The complete power receiver front-end has a power conversion efficiency of up to 29%

Ultra-low power mixed-signal frontend for wearable EEGs

Electronics circuits are ubiquitous in daily life, aided by advancements in the chip design industry, leading to miniaturised solutions for typical day to day problems. One of the critical healthcare areas helped by this advancement in technology is electroencephalography (EEG). EEG is a non-invasive method of tracking a person's brain waves, and a crucial tool in several healthcare contexts, including epilepsy and sleep disorders. Current ambulatory EEG systems still suffer from limitations that affect their usability. Furthermore, many patients admitted to emergency departments (ED) for a neurological disorder like altered mental status or seizures, would remain undiagnosed hours to days after admission, which leads to an elevated rate of death compared to other conditions. Conducting a thorough EEG monitoring in early-stage could prevent further damage to the brain and avoid high mortality. But lack of portability and ease of access results in a long wait time for the prescribed patients. All real signals are analogue in nature, including brainwaves sensed by EEG systems. For converting the EEG signal into digital for further processing, a truly wearable EEG has to have an analogue mixed-signal front-end (AFE). This research aims to define the specifications for building a custom AFE for the EEG recording and use that to review the suitability of the architectures available in the literature. Another critical task is to provide new architectures that can meet the developed specifications for EEG monitoring and can be used in epilepsy diagnosis, sleep monitoring, drowsiness detection and depression study. The thesis starts with a preview on EEG technology and available methods of brainwaves recording. It further expands to design requirements for the AFE, with a discussion about critical issues that need resolving. Three new continuous-time capacitive feedback chopped amplifier designs are proposed. A novel calibration loop for setting the accurate value for a pseudo-resistor, which is a crucial block in the proposed topology, is also discussed. This pseudoresistor calibration loop achieved the resistor variation of under 8.25%. The thesis also presents a new design of a curvature corrected bandgap, as well as a novel DDA based fourth-order Sallen-Key filter. A modified sensor frontend architecture is then proposed, along with a detailed analysis of its implementation. Measurement results of the AFE are finally presented. The AFE consumed a total power of 3.2A (including ADC, amplifier, filter, and current generation circuitry) with the overall integrated input-referred noise of 0.87V-rms in the frequency band of 0.5-50Hz. Measurement results confirmed that only the proposed AFE achieved all defined specifications for the wearable EEG system with the smallest power consumption than state-of-art architectures that meet few but not all specifications. The AFE also achieved a CMRR of 131.62dB, which is higher than any studied architectures.Open Acces

An accurate, trimless, high PSRR, low-voltage, CMOS bandgap reference IC

Bandgap reference circuits are used in a host of analog, digital, and mixed-signal systems to establish an accurate voltage standard for the entire IC. The accuracy of the bandgap reference voltage under steady-state (dc) and transient (ac) conditions is critical to obtain high system performance. In this work, the impact of process, power-supply, load, and temperature variations and package stresses on the dc and ac accuracy of bandgap reference circuits has been analyzed. Based on this analysis, the a bandgap reference that 1. has high dc accuracy despite process and temperature variations and package stresses, without resorting to expensive trimming or noisy switching schemes, 2. has high dc and ac accuracy despite power-supply variations, without using large off-chip capacitors that increase bill-of-material costs, 3. has high dc and ac accuracy despite load variations, without resorting to error-inducing buffers, 4. is capable of producing a sub-bandgap reference voltage with a low power-supply, to enable it to operate in modern, battery-operated portable applications, 5. utilizes a standard CMOS process, to lower manufacturing costs, and 6. is integrated, to consume less board space has been proposed. The functionality of critical components of the system has been verified through prototypes after which the performance of the complete system has been evaluated by integrating all the individual components on an IC. The proposed CMOS bandgap reference can withstand 5mA of load variations while generating a reference voltage of 890mV that is accurate with respect to temperature to the first order. It exhibits a trimless, dc 3-sigma accuracy performance of 0.84% over a temperature range of -40°C to 125°C and has a worst case ac power-supply ripple rejection (PSRR) performance of 30dB up to 50MHz using 60pF of on-chip capacitance. All the proposed techniques lead to the development of a CMOS bandgap reference that meets the low-cost, high-accuracy demands of state-of-the-art System-on-Chip environments.Ph.D.Committee Chair: Rincon-Mora, Gabriel; Committee Member: Ayazi, Farrokh; Committee Member: Bhatti, Pamela; Committee Member: Leach, W. Marshall; Committee Member: Morley, Thoma

A low-voltage band-gap reference circuit with second-order analyses

SUMMARY A new band-gap reference (BGR) circuit employing sub-threshold current is proposed for low-voltage operations. By employing the fraction of V BE and the sub-threshold current source, the proposed BGR circuit with chip area of 0.029 mm 2 was fabricated in the standard 0.18 m CMOS triple-well technology. It generates reference voltage of 170 mV with power consumption of 2.4 W at supply voltage of 1 V. The agreement between simulation and measurement shows that the variations of reference voltage are 1.3 mV for temperatures from −20 to 100 • C, and 1.1 mV per volt for supply voltage from 0.95 to 2.5 V, respectively

A 0.82V supply and 23.4 ppm/0C current mirror assisted bandgap reference

Traditional BGR circuits require a 1.05V supply due to the VBE of the BJT. Deep submicron CMOS technologies are limiting the supply voltage to less than 940mV. Hence there is a strong motivation to design them at lower supply voltages. The supply voltage limitation in conventional BGR is described qualitatively in this paper. Further, a current mirror-assisted technique has been proposed to enable BGR operational at 0.82V supply. A prototype was developed in 65nm TSMC CMOS technology and post-layout simulation results were performed. A self-bias opamp has been exploited to minimize the systematic offset. Proposed BGR targeted at 450mV works from 0.82-1.05V supply without having any degradation in the performance while keeping the integrated noise of 15.2µV and accuracy of 23.4ppm/0C. Further, the circuit consumes 21µW of power and occupies 73*32µm2 silicon area