3D Integration: Another Dimension Toward Hardware Security

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it also requires thoughtful use of the options provided by the umbrella term of 3D integration. Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and "all around" shielding for 3D ICs.Comment: IEEE IOLTS 201

Barriers for implementing reverse logistics in the construction sectors

Purpose: This paper aims to identify the barriers to implementing Reverse Logistics in the construction sector and rank the barriers between the stakeholder, the phase in the project life cycle, and the strategic factors on the emergence of obstacles in implementing reverse logistics. Design/methodology/approach: This research began by identifying barriers re- verse logistics through a systematic literature review. The method used in the systematic literature review was the PRISMA method. Next, the identification of barriers was assessed for their influence on successful reverse logistics implementation by the expert using a questionnaire instrument. The rating scale used was a Likert scale of 1 (greatly hinder the implementation of reverse logistics) to 5 (not significantly hinder the implementation of reverse logistics). Finally, the results of the expert assessment were used to rank barriers using TOPSIS. Findings: There are 38 barriers in this study, classified as market and competitor factors, policy factors, supply chain factors, economic factors, knowledge-related factors, government support factors, and operational factors. The classification of barriers based on the project life cycle aims to increase stakeholder collaboration on reverse logistics performance issues. The results of this study indicate that the lack of government support for the implementation of RL (GS1) is the obstacle with the highest rank. These barriers are related to government support factors and arise in the green initiation phase of the project life cycle approach. The government’s role as regulator and project owner will overcome GS1 barriers. Research limitations/implications: The limitation in the scope of this research is specific to the construction sector in developing countries, particularly Indonesia. The object of construction in this study is the case of the Penjagaan-Losari highway project. Further research that examines barriers based on the project life cycle by entering the company scale or studying the relationship between barriers can also be done. Practical implications: This study provides an analysis to stakeholders about the barriers in implementing reverse logistics. The ranking results become a reference for relevant stakeholders in developing a successful strategy for implementing reverse logistics and the PLC approach phases as a guideline for implementing the established strategy. Social implications: The stakeholder of the construction project has to learn with reverse logistics barriers to improve reverse logistics performance. Originality/value: This study analyzed reverse logistics implementation barriers in the construction sector in developing countries. The majority of research on reverse logistics implementation barriers examined the manufacturing sector in developed countries. This study also identifies barriers that show the relationship between barrier emergence in the project life cycle approach and stakeholders responsible for addressing barriers and associated problems. Previous research only identified obstacles based on stakeholder points of view and strategic factors in the implementation of reverse logistics. The drawback from the point of view of previous research is the difficulty of determining appropriate improvement efforts. Identifying barriers using a process-based approach such as the project life cycle will improve previous research weaknessesPeer Reviewe

A survey on 3D CAD model quality assurance and testing

[EN] A new taxonomy of issues related to CAD model quality is presented, which distinguishes between explicit and procedural models. For each type of model, morphologic, syntactic, and semantic errors are characterized. The taxonomy was validated successfully when used to classify quality testing tools, which are aimed at detecting and repairing data errors that may affect the simplification, interoperability, and reusability of CAD models. The study shows that low semantic level errors that hamper simplification are reasonably covered in explicit representations, although many CAD quality testers are still unaffordable for Small and Medium Enterprises, both in terms of cost and training time. Interoperability has been reasonably solved by standards like STEP AP 203 and AP214, but model reusability is not feasible in explicit representations. Procedural representations are promising, as interactive modeling editors automatically prevent most morphologic errors derived from unsuitable modeling strategies. Interoperability problems between procedural representations are expected to decrease dramatically with STEP AP242. Higher semantic aspects of quality such as assurance of design intent, however, are hardly supported by current CAD quality testers. (C) 2016 Elsevier Ltd. All rights reserved.This work was supported by the Spanish Ministry of Economy and Competitiveness and the European Regional Development Fund, through the ANNOTA project (Ref. TIN2013-46036-C3-1-R).González-Lluch, C.; Company, P.; Contero, M.; Camba, J.; Plumed, R. (2017). A survey on 3D CAD model quality assurance and testing. Computer-Aided Design. 83:64-79. https://doi.org/10.1016/j.cad.2016.10.003S64798

US Microelectronics Packaging Ecosystem: Challenges and Opportunities

The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.Comment: 22 pages, 8 figure

The Role Of System of Systems in Additive Manufacturing

The rapid growth in additive manufacturing technologies have brought various optimization techniques and methodologies to improve each phase that needs to be integrated and analyzed on system level to optimize the system performance. The challenges and limitations of each phase affect the system when integrated as a whole - creating a complex manufacturing environment that needs to be critically examined and managed. To have a better management of complex, emergent, and uncertain manufacturing system from design to recycling phase, a new way of thinking based on more holistic approach is necessary. In this paper, the system of systems paradigm (SoS) is introduced to treat additive manufacturing system as a whole and to present some SoS approaches that are based on holistic thinking. This paper provides a conceptual knowledge of SoS approach using systems principles, laws and approach emphasizing the characteristics and attributes of complex manufacturing system to the AM domain

The Role Of System of Systems in Additive Manufacturing

The rapid growth in additive manufacturing technologies have brought various optimization techniques and methodologies to improve each phase that needs to be integrated and analyzed on system level to optimize the system performance. The challenges and limitations of each phase affect the system when integrated as a whole - creating a complex manufacturing environment that needs to be critically examined and managed. To have a better management of complex, emergent, and uncertain manufacturing system from design to recycling phase, a new way of thinking based on more holistic approach is necessary. In this paper, the system of systems paradigm (SoS) is introduced to treat additive manufacturing system as a whole and to present some SoS approaches that are based on holistic thinking. This paper provides a conceptual knowledge of SoS approach using systems principles, laws and approach emphasizing the characteristics and attributes of complex manufacturing system to the AM domain

Effectiveness of CAD-CAM Application for the Development design and implementation of maintenance tools

This study aims to evaluate the effectiveness of using Computer-Aided Design and Computer-Aided Manufacturing (CAD-CAM) applications in developing the design and implementation of maintenance tools. The use of CAD-CAM has become a major trend in the modern manufacturing industry because it provides various advantages such as time efficiency, high precision and increased productivity. However, it is important to assess the true effectiveness of this technology in the context of maintenance tool development to fully understand its potential benefits. The literature review analysis method was used to compile an in-depth review of the latest research and publications related to the use of CAD-CAM in the design development and implementation of maintenance tools. A number of case studies and field experiments were also included in the analysis to provide further insight into the application of this technology in various industrial environments. The results of the analysis show that the use of CAD-CAM in the development of maintenance tool designs has brought significant positive changes. This application is able to reduce development cycle time, enable model-based engineering, and improve modeling accuracy. Apart from that, CAD-CAM also facilitates better collaboration between design teams, engineers and other stakeholders, which contributes to improving the quality of the final product. However, despite the many benefits offered by CAD-CAM, there are also challenges that need to be overcome to increase the effectiveness of its use. Some of these are high initial investment costs, the need for higher technical skills, and complex integration with existing infrastructure. In conclusion, CAD-CAM has proven effective in developing the design and implementation of maintenance tools. With this technology, companies can increase operational efficiency, improve product quality, and gain a competitive advantage in the market. By understanding the benefits and challenges of its use, professionals can more effectively adopt CAD-CAM and fully exploit its potential in the modern manufacturing industry