Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi.Postprint (published version

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi

Improved Physical Design for Manufacturing Awareness and Advanced VLSI

Increasing challenges arise with each new semiconductor technology node, especially in advanced nodes, where the industry tries to extract every ounce of benefit as it approaches the limits of physics, through manufacturing-aware design technology co-optimization and design-based equivalent scaling. The increasing complexity of design and process technologies, and ever-more complex design rules, also become hurdles for academic researchers, separating academic researchers from the most up-to-date technical issues.This thesis presents innovative methodologies and optimizations to address the above challenges. There are three directions in this thesis: (i) manufacturing-aware design technology co-optimization; (ii) advanced node design-based equivalent scaling; and (iii) an open source academic detailed routing flow.To realize manufacturing-aware design technology co-optimization, this thesis presents two works: (i) a multi-row detailed placement optimization for neighbor diffusion effect mitigation between neighboring standard cells; and (ii) a post-routing optimization to generate 2D block mask layout for dummy segment removal in self-aligned multiple patterning.To achieve advanced node design-based equivalent scaling, this thesis presents two improved physical design methodologies: (i) a post-placement flop tray generation approach for clock power reduction; and (ii) a detailed placement approach to exploit inter-row M1 routing for congestion and wirelength reduction.To address the increasing gap between academia and industry, this thesis presents two works toward an open source academic detailed routing flow: (i) a complete, robust, scalable and design ruleaware dynamic programming-based pin access analysis framework; and (ii) TritonRoute – the open source detailed router that is capable of delivering DRC-clean detailed routing solutions in advanced nodes.This thesis concludes with a summary of its contributions and open directions for future research

Floorplan-guided placement for large-scale mixed-size designs

In the nanometer scale era, placement has become an extremely challenging stage in modern Very-Large-Scale Integration (VLSI) designs. Millions of objects need to be placed legally within a chip region, while both the interconnection and object distribution have to be optimized simultaneously. Due to the extensive use of Intellectual Property (IP) and embedded memory blocks, a design usually contains tens or even hundreds of big macros. A design with big movable macros and numerous standard cells is known as mixed-size design. Due to the big size difference between big macros and standard cells, the placement of mixed-size designs is much more difficult than the standard-cell placement. This work presents an efficient and high-quality placement tool to handle modern large-scale mixed-size designs. This tool is developed based on a new placement algorithm flow. The main idea is to use the fixed-outline floorplanning algorithm to guide the state-of-the-art analytical placer. This new flow consists of four steps: 1) The objects in the original netlist are clustered into blocks; 2) Floorplanning is performed on the blocks; 3) The blocks are shifted within the chip region to further optimize the wirelength; 4) With big macro locations fixed, incremental placement is applied to place the remaining objects. Several key techniques are proposed to be used in the first two steps. These techniques are mainly focused on the following two aspects: 1) Hypergraph clustering algorithm that can cut down the original problem size without loss of placement Quality of Results (QoR); 2) Fixed-outline floorplanning algorithm that can provide a good guidance to the analytical placer at the global level. The effectiveness of each key technique is demonstrated by promising experimental results compared with the state-of-the-art algorithms. Moreover, using the industrial mixed-size designs, the new placement tool shows better performance than other existing approaches

Custom Cell Placement Automation for Asynchronous VLSI

Asynchronous Very-Large-Scale-Integration (VLSI) integrated circuits have demonstrated many advantages over their synchronous counterparts, including low power consumption, elastic pipelining, robustness against manufacturing and temperature variations, etc. However, the lack of dedicated electronic design automation (EDA) tools, especially physical layout automation tools, largely limits the adoption of asynchronous circuits. Existing commercial placement tools are optimized for synchronous circuits, and require a standard cell library provided by semiconductor foundries to complete the physical design. The physical layouts of cells in this library have the same height to simplify the placement problem and the power distribution network. Although the standard cell methodology also works for asynchronous designs, the performance is inferior compared with counterparts designed using the full-custom design methodology. To tackle this challenge, we propose a gridded cell layout methodology for asynchronous circuits, in which the cell height and cell width can be any integer multiple of two grid values. The gridded cell approach combines the shape regularity of standard cells with the size flexibility of full-custom layouts. Therefore, this approach can achieve a better space utilization ratio and lower wire length for asynchronous designs. Experiments have shown that the gridded cell placement approach reduces area without impacting the routability. We have also used this placer to tape out a chip in a 65nm process technology, demonstrating that our placer generates design-rule clean results

Timing-Driven Macro Placement

Placement is an important step in the process of finding physical layouts for electronic computer chips. The basic task during placement is to arrange the building blocks of the chip, the circuits, disjointly within a given chip area. Furthermore, such positions should result in short circuit interconnections which can be routed easily and which ensure all signals arrive in time. This dissertation mostly focuses on macros, the largest circuits on a chip. In order to optimize timing characteristics during macro placement, we propose a new optimistic timing model based on geometric distance constraints. This model can be computed and evaluated efficiently in order to predict timing traits accurately in practice. Packing rectangles disjointly remains strongly NP-hard under slack maximization in our timing model. Despite of this we develop an exact, linear time algorithm for special cases. The proposed timing model is incorporated into BonnMacro, the macro placement component of the BonnTools physical design optimization suite developed at the Research Institute for Discrete Mathematics. Using efficient formulations as mixed-integer programs we can legalize macros locally while optimizing timing. This results in the first timing-aware macro placement tool. In addition, we provide multiple enhancements for the partitioning-based standard circuit placement algorithm BonnPlace. We find a model of partitioning as minimum-cost flow problem that is provably as small as possible using which we can avoid running time intensive instances. Moreover we propose the new global placement flow Self-Stabilizing BonnPlace. This approach combines BonnPlace with a force-directed placement framework. It provides the flexibility to optimize the two involved objectives, routability and timing, directly during placement. The performance of our placement tools is confirmed on a large variety of academic benchmarks as well as real-world designs provided by our industrial partner IBM. We reduce running time of partitioning significantly and demonstrate that Self-Stabilizing BonnPlace finds easily routable placements for challenging designs – even when simultaneously optimizing timing objectives. BonnMacro and Self-Stabilizing BonnPlace can be combined to the first timing-driven mixed-size placement flow. This combination often finds placements with competitive timing traits and even outperforms solutions that have been determined manually by experienced designers

Standard cell optimization and physical design in advanced technology nodes

Integrated circuits (ICs) are at the heart of modern electronics, which rely heavily on the state-of-the-art semiconductor manufacturing technology. The key to pushing forward semiconductor technology is IC feature-size miniaturization. However, this brings ever-increasing design complexities and manufacturing challenges to the $340 billion semiconductor industry. The manufacturing of two-dimensional layout on high-density metal layers depends on complex design-for-manufacturing techniques and sophisticated empirical optimizations, which introduces huge amounts of turnaround time and yield loss in advanced technology nodes. Our study reveals that unidirectional layout design can significantly reduce the manufacturing complexities and improve the yield, which is becoming increasingly adopted in semiconductor industry [61, 89]. The lithography printing of unidirectional layout can be tightly controlled using advanced patterning techniques, such as self-aligned double and quadruple patterning. Despite the manufacturing benefits, unidirectional layout leads to more restrictive solution space and brings significant impacts on the IC design automation ow for routing closure. Notably, unidirectional routing limits the standard cell pin accessibility, which further exacerbates the resource competitions during routing. Moreover, for post-routing optimization, traditional redundant-via insertion has become obsolete under unidirectional routing style, which makes the yield enhancement task extremely challenging. Regardless of complex multiple patterning and design-for-manufacturing approaches, mask optimization through resolution enhancement techniques remains as the key strategy to improve the yield of the semiconductor manufacturing processes. Among them, Sub-Resolution Assist Feature (SRAF) generation is a very important method to improve lithographic process windows. Model-based SRAF generation has been widely used to achieve high accuracy but it is time-consuming and hard to obtain consistent SRAFs. This dissertation proposes novel CAD algorithms and methodologies for standard cell optimization and physical design in advanced technology nodes, which ultimately reduces the design cycle and manufacturing cost of IC design. First, a standard cell pin access optimization engine is proposed to evaluate the pin accessibility of a given standard cell library. We further propose novel pin access planning techniques and concurrent pin access optimizations to efficiently resolve the routing resource competitions, which generates much better routing solutions than state-of-the-art, manufacturing-friendly routers. To systematically improve the manufacturing yield in the post-routing stage, a global optimization engine has been introduced for redundant local-loop insertion considering advanced manufacturing constraints. Finally, we propose the first machine learning-based framework for fast yet consistent SRAF generation with the high quality of results.Electrical and Computer Engineerin

Data integrity for on-chip interconnects

With shrinking feature size and growing integration density in the Deep Sub- Micron (DSM) technologies, the global buses are fast becoming the "weakest-links" in VLSI design. They have large delays and are error-prone. Especially, in system-onchip (SoC) designs, where parallel interconnects run over large distances, they pose difficult research and design problems. This work presents an approach for evaluating the data carrying capacity of such wires. The method treats the delay and reliability in interconnects from an information theoretic perspective. The results point to an optimal frequency of operation for a given bus dimension for maximum data transfer rate. Moreover, this optimal frequency is higher than that achieved by present day designs which accommodate the worst case delays. This work also proposes several novel ways to approach this optimal data transfer rate in practical designs.From the analysis of signal propagation delay in long wires, it is seen that the signal delay distribution has a long tail, meaning that most signals arrive at the output much faster than the worst case delay. Using communication theory, these "good" signals arriving early can be used to predict/correct the "few" signals that arrive late. In addition to this correction based on prediction, the approaches use coding techniques to eliminate high delay cases to generate a higher transmission rate. The work also extends communication theoretic approaches to other areas of VLSI design. Parity groups are generated based on low output delay correlation to add redundancy in combinatorial circuits. This redundancy is used to increase the frequency of operation and/or reduce the energy consumption while improving the overall reliability of the circuit

Design Automation and Application for Emerging Reconfigurable Nanotechnologies

In the last few decades, two major phenomena have revolutionized the electronic industry – the ever-increasing dependence on electronic circuits and the Complementary Metal Oxide Semiconductor (CMOS) downscaling. These two phenomena have been complementing each other in a way that while electronics, in general, have demanded more computations per functional unit, CMOS downscaling has aptly supported such needs. However, while the computational demand is still rising exponentially, CMOS downscaling is reaching its physical limits. Hence, the need to explore viable emerging nanotechnologies is more imperative than ever. This thesis focuses on streamlining the existing design automation techniques for a class of emerging reconfigurable nanotechnologies. Transistors based on this technology exhibit duality in conduction, i.e. they can be configured dynamically either as a p-type or an n-type device on the application of an external bias. Owing to this dynamic reconfiguration, these transistors are also referred to as Reconfigurable Field-Effect Transistors (RFETs). Exploring and developing new technologies just like CMOS, require tackling two main challenges – first, design automation flow has to be modified to enable tailor- made circuit designs. Second, possible application opportunities should be explored where such technologies can outsmart the existing CMOS technologies. This thesis targets the above two objectives for emerging reconfigurable nanotechnologies by proposing approaches for enabling an Electronic Design Automation (EDA) flow for circuits based on RFETs and exploring hardware security as an application that exploits the transistor-level dynamic reconfiguration offered by this technology. This thesis explains the bottom-up approach adopted to propose a logic synthesis flow by identifying new logic gates and circuit design paradigms that can particularly exploit the dynamic reconfiguration offered by these novel nanotechnologies. This led to the subsequent need of finding natural Boolean logic abstraction for emerging reconfigurable nanotechnologies as it is shown that the existing abstraction of negative unate logic for CMOS technologies is sub-optimal for RFETs-based circuits. In this direction, it has been shown that duality in Boolean logic is a natural abstraction for this technology and can truly represent the duality in conduction offered by individual transistors. Finding this abstraction paved the way for defining suitable primitives and proposing various algorithms for logic synthesis and technology mapping. The following step is to explore compatible physical synthesis flow for emerging reconfigurable nanotechnologies. Using silicon nanowire-based RFETs, .lef and .lib files have been provided which can provide an end-to-end flow to generate .GDSII file for circuits exclusively based on RFETs. Additionally, new approaches have been explored to improve placement and routing for circuits based on reconfigurable nanotechnologies. It has been demonstrated how these approaches led to superior results as compared to the native flow meant for CMOS. Lastly, the unique property of transistor-level reconfiguration offered by RFETs is utilized to implement efficient Intellectual Property (IP) protection schemes against adversarial attacks. The ability to control the conduction of individual transistors can be argued as one of the impactful features of this technology and suitably fits into the paradigm of security measures. Prior security schemes based on CMOS technology often come with large overheads in terms of area, power, and delay. In contrast, RFETs-based hardware security measures such as logic locking, split manufacturing, etc. proposed in this thesis, demonstrate affordable security solutions with low overheads. Overall, this thesis lays a strong foundation for the two main objectives – design automation, and hardware security as an application, to push emerging reconfigurable nanotechnologies for commercial integration. Additionally, contributions done in this thesis are made available under open-source licenses so as to foster new research directions and collaborations.:Abstract List of Figures List of Tables 1 Introduction 1.1 What are emerging reconfigurable nanotechnologies? 1.2 Why does this technology look so promising? 1.3 Electronics Design Automation 1.4 The game of see-saw: key challenges vs benefits for emerging reconfigurable nanotechnologies 1.4.1 Abstracting ambipolarity in logic gate designs 1.4.2 Enabling electronic design automation for RFETs 1.4.3 Enhanced functionality: a suitable fit for hardware security applications 1.5 Research questions 1.6 Entire RFET-centric EDA Flow 1.7 Key Contributions and Thesis Organization 2 Preliminaries 2.1 Reconfigurable Nanotechnology 2.1.1 1D devices 2.1.2 2D devices 2.1.3 Factors favoring circuit-flexibility 2.2 Feasibility aspects of RFET technology 2.3 Logic Synthesis Preliminaries 2.3.1 Circuit Model 2.3.2 Boolean Algebra 2.3.3 Monotone Function and the property of Unateness 2.3.4 Logic Representations 3 Exploring Circuit Design Topologies for RFETs 3.1 Contributions 3.2 Organization 3.3 Related Works 3.4 Exploring design topologies for combinational circuits: functionality-enhanced logic gates 3.4.1 List of Combinational Functionality-Enhanced Logic Gates based on RFETs 3.4.2 Estimation of gate delay using the logical effort theory 3.5 Invariable design of Inverters 3.6 Sequential Circuits 3.6.1 Dual edge-triggered TSPC-based D-flip flop 3.6.2 Exploiting RFET’s ambipolarity for metastability 3.7 Evaluations 3.7.1 Evaluation of combinational logic gates 3.7.2 Novel design of 1-bit ALU 3.7.3 Comparison of the sequential circuit with an equivalent CMOS-based design 3.8 Concluding remarks 4 Standard Cells and Technology Mapping 4.1 Contributions 4.2 Organization 4.3 Related Work 4.4 Standard cells based on RFETs 4.4.1 Interchangeable Pull-Up and Pull-Down Networks 4.4.2 Reconfigurable Truth-Table 4.5 Distilling standard cells 4.6 HOF-based Technology Mapping Flow for RFETs-based circuits 4.6.1 Area adjustments through inverter sharings 4.6.2 Technology Mapping Flow 4.6.3 Realizing Parameters For The Generic Library 4.6.4 Defining RFETs-based Genlib for HOF-based mapping 4.7 Experiments 4.7.1 Experiment 1: Distilling standard-cells from a benchmark suite 4.7.2 Experiment 2A: HOF-based mapping . 4.7.3 Experiment 2B: Using the distilled standard-cells during mapping 4.8 Concluding Remarks 5 Logic Synthesis with XOR-Majority Graphs 5.1 Contributions 5.2 Organization 5.3 Motivation 5.4 Background and Preliminaries 5.4.1 Terminologies 5.4.2 Self-duality in NPN classes 5.4.3 Majority logic synthesis 5.4.4 Earlier work on XMG 5.4.5 Classification of Boolean functions 5.5 Preserving Self-Duality 5.5.1 During logic synthesis 5.5.2 During versatile technology mapping 5.6 Advanced Logic synthesis techniques 5.6.1 XMG resubstitution 5.6.2 Exact XMG rewriting 5.7 Logic representation-agnostic Mapping 5.7.1 Versatile Mapper 5.7.2 Support of supergates 5.8 Creating Self-dual Benchmarks 5.9 Experiments 5.9.1 XMG-based Flow 5.9.2 Experimental Setup 5.9.3 Synthetic self-dual benchmarks 5.9.4 Cryptographic benchmark suite 5.10 Concluding remarks and future research directions 6 Physical synthesis flow and liberty generation 6.1 Contributions 6.2 Organization 6.3 Background and Related Work 6.3.1 Related Works 6.3.2 Motivation 6.4 Silicon Nanowire Reconfigurable Transistors 6.5 Layouts for Logic Gates 6.5.1 Layouts for Static Functional Logic Gates 6.5.2 Layout for Reconfigurable Logic Gate 6.6 Table Model for Silicon Nanowire RFETs 6.7 Exploring Approaches for Physical Synthesis 6.7.1 Using the Standard Place & Route Flow 6.7.2 Open-source Flow 6.7.3 Concept of Driver Cells 6.7.4 Native Approach 6.7.5 Island-based Approach 6.7.6 Utilization Factor 6.7.7 Placement of the Island on the Chip 6.8 Experiments 6.8.1 Preliminary comparison with CMOS technology 6.8.2 Evaluating different physical synthesis approaches 6.9 Results and discussions 6.9.1 Parameters Which Affect The Area 6.9.2 Use of Germanium Nanowires Channels 6.10 Concluding Remarks 7 Polymporphic Primitives for Hardware Security 7.1 Contributions 7.2 Organization 7.3 The Shift To Explore Emerging Technologies For Security 7.4 Background 7.4.1 IP protection schemes 7.4.2 Preliminaries 7.5 Security Promises 7.5.1 RFETs for logic locking (transistor-level locking) 7.5.2 RFETs for split manufacturing 7.6 Security Vulnerabilities 7.6.1 Realization of short-circuit and open-circuit scenarios in an RFET-based inverter 7.6.2 Circuit evaluation on sub-circuits 7.6.3 Reliability concerns: A consequence of short-circuit scenario 7.6.4 Implication of the proposed security vulnerability 7.7 Analytical Evaluation 7.7.1 Investigating the security promises 7.7.2 Investigating the security vulnerabilities 7.8 Concluding remarks and future research directions 8 Conclusion 8.1 Concluding Remarks 8.2 Directions for Future Work Appendices A Distilling standard-cells B RFETs-based Genlib C Layout Extraction File (.lef) for Silicon Nanowire-based RFET D Liberty (.lib) file for Silicon Nanowire-based RFET