55,174 research outputs found

    Genome-Wide Survey of MicroRNA - Transcription Factor Feed-Forward Regulatory Circuits in Human

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    In this work, we describe a computational framework for the genome-wide identification and characterization of mixed transcriptional/post-transcriptional regulatory circuits in humans. We concentrated in particular on feed-forward loops (FFL), in which a master transcription factor regulates a microRNA, and together with it, a set of joint target protein coding genes. The circuits were assembled with a two step procedure. We first constructed separately the transcriptional and post-transcriptional components of the human regulatory network by looking for conserved over-represented motifs in human and mouse promoters, and 3'-UTRs. Then, we combined the two subnetworks looking for mixed feed-forward regulatory interactions, finding a total of 638 putative (merged) FFLs. In order to investigate their biological relevance, we filtered these circuits using three selection criteria: (I) GeneOntology enrichment among the joint targets of the FFL, (II) independent computational evidence for the regulatory interactions of the FFL, extracted from external databases, and (III) relevance of the FFL in cancer. Most of the selected FFLs seem to be involved in various aspects of organism development and differentiation. We finally discuss a few of the most interesting cases in detail.Comment: 51 pages, 5 figures, 4 tables. Supporting information included. Accepted for publication in Molecular BioSystem

    Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses

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    This paper presents an embedded chip integration technology that incorporates silicon housings and flexible Parylene-based microelectromechanical systems (MEMS) devices. Accelerated-lifetime soak testing is performed in saline at elevated temperatures to study the packaging performance of Parylene C thin films. Experimental results show that the silicon chip under test is well protected by Parylene, and the lifetime of Parylenecoated metal at body temperature (37°C) is more than 60 years, indicating that Parylene C is an excellent structural and packaging material for biomedical applications. To demonstrate the proposed packaging technology, a flexible MEMS radio-frequency (RF) coil has been integrated with an RF identification (RFID) circuit die. The coil has an inductance of 16 μH with two layers of metal completely encapsulated in Parylene C, which is microfabricated using a Parylene–metal–Parylene thin-film technology. The chip is a commercially available read-only RFID chip with a typical operating frequency of 125 kHz. The functionality of the embedded chip has been tested using an RFID reader module in both air and saline, demonstrating successful power and data transmission through the MEMS coil

    Automatic programming methodologies for electronic hardware fault monitoring

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    This paper presents three variants of Genetic Programming (GP) approaches for intelligent online performance monitoring of electronic circuits and systems. Reliability modeling of electronic circuits can be best performed by the Stressor - susceptibility interaction model. A circuit or a system is considered to be failed once the stressor has exceeded the susceptibility limits. For on-line prediction, validated stressor vectors may be obtained by direct measurements or sensors, which after pre-processing and standardization are fed into the GP models. Empirical results are compared with artificial neural networks trained using backpropagation algorithm and classification and regression trees. The performance of the proposed method is evaluated by comparing the experiment results with the actual failure model values. The developed model reveals that GP could play an important role for future fault monitoring systems.This research was supported by the International Joint Research Grant of the IITA (Institute of Information Technology Assessment) foreign professor invitation program of the MIC (Ministry of Information and Communication), Korea

    Fabrication And Thermoelectric Characterization Of Stretchable Conductive Latex-Based Composites

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    Miniaturized stretchable electronic devices that can be bent and strained elastically without breaking, have drawn considerable research interest in recent years for wearable computers and integrated bio-sensor applications. Portable electrical power harvesting remains a critical challenge in flexible electronics materials. One proposed solution has been to convert waste heat from the human body into electricity using thermoelectric materials. Traditionally, however, these materials are brittle ceramic semiconductors with limited fracture resistance under deformation. The primary objective of this thesis is to address this challenge by fabricating and studying the mechanical, thermal and electrical performance of stretchable composites combining natural latex polymer with either metallic (Ni) or thermoelectric (InSb) powders. Ni-based and InSb-based latex specimens were synthesized with different powder concentrations up to 36 vol.%. The effects of the powder concentration on tensile elongation, electrical conductivity, and thermal conductivity of the composites were measured at ambient temperature. Strong dependences of mechanical and electrical properties on powder concentration were found. By contrast, thermal conductivity was observed to remain low at all concentrations, suggesting that the predominant heat transport process is through the low-conductivity latex matrix rather than the conductive particles. This thesis was conducted with the support of a Vermont Space Grant Consortium graduate research assistantship

    A spacecraft digital stabilization and control system study

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    Digital techniques to increase reliability and accuracy of spacecraft control and stabilization system

    Predicting Cost/Reliability/Maintainability of Advanced General Aviation Avionics Equipment

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    A methodology is provided for assisting NASA in estimating the cost, reliability, and maintenance (CRM) requirements for general avionics equipment operating in the 1980's. Practical problems of predicting these factors are examined. The usefulness and short comings of different approaches for modeling coast and reliability estimates are discussed together with special problems caused by the lack of historical data on the cost of maintaining general aviation avionics. Suggestions are offered on how NASA might proceed in assessing cost reliability CRM implications in the absence of reliable generalized predictive models

    Thermosonic flip chip interconnection using electroplated copper column arrays

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