'Institute of Electrical and Electronics Engineers (IEEE)'
Doi
Abstract
This paper presents an embedded chip integration
technology that incorporates silicon housings and flexible
Parylene-based microelectromechanical systems (MEMS) devices.
Accelerated-lifetime soak testing is performed in saline at elevated
temperatures to study the packaging performance of Parylene C
thin films. Experimental results show that the silicon chip under
test is well protected by Parylene, and the lifetime of Parylenecoated
metal at body temperature (37°C) is more than 60 years,
indicating that Parylene C is an excellent structural and packaging
material for biomedical applications. To demonstrate the proposed
packaging technology, a flexible MEMS radio-frequency (RF) coil
has been integrated with an RF identification (RFID) circuit die.
The coil has an inductance of 16 μH with two layers of metal
completely encapsulated in Parylene C, which is microfabricated
using a Parylene–metal–Parylene thin-film technology. The chip
is a commercially available read-only RFID chip with a typical
operating frequency of 125 kHz. The functionality of the embedded
chip has been tested using an RFID reader module in both air
and saline, demonstrating successful power and data transmission
through the MEMS coil