153 research outputs found

    Circuit design in complementary organic technologies

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    Circuit design for low-cost smart sensing applications based on printed flexible electronics

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    An Integrated 13.56-MHz RFID Tag in a Printed Organic Complementary TFT Technology on Flexible Substrate

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    Realization and training of an inverter-based printed neuromorphic computing system

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    Emerging applications in soft robotics, wearables, smart consumer products or IoT-devices benefit from soft materials, flexible substrates in conjunction with electronic functionality. Due to high production costs and conformity restrictions, rigid silicon technologies do not meet application requirements in these new domains. However, whenever signal processing becomes too comprehensive, silicon technology must be used for the high-performance computing unit. At the same time, designing everything in flexible or printed electronics using conventional digital logic is not feasible yet due to the limitations of printed technologies in terms of performance, power and integration density. We propose to rather use the strengths of neuromorphic computing architectures consisting in their homogeneous topologies, few building blocks and analog signal processing to be mapped to an inkjet-printed hardware architecture. It has remained a challenge to demonstrate non-linear elements besides weighted aggregation. We demonstrate in this work printed hardware building blocks such as inverter-based comprehensive weight representation and resistive crossbars as well as printed transistor-based activation functions. In addition, we present a learning algorithm developed to train the proposed printed NCS architecture based on specific requirements and constraints of the technology

    Technology aware circuit design for smart sensors on plastic foils

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    Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

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    Why printed electronics? Why should NASA use printed electronics to make a spacecraft? Three words provide the answer: universal, impactful, progressive. The technology is universal because the applications it can affect are broad and diverse from simple sensors to fully functional spacecraft. The impact of flexible, printed electronics range from straightforward mass, volume and cost savings all the way to enabling new mission concepts. The benefits of the technology will become progressively larger from what is achievable today so that investments will pay dividends tomorrow, next year and next decade. We started off three years ago asking the question can you build an entire spacecraft out of printed electronics? In other words, can you design and fabricate a fully integrated, electronic system that performs the same end-to-end functions of a spacecraft - take scientific measurements, perform data processing, provide data storage, transmit the data, powers itself, orients and propels itself - all out of thin flexible sheets of printed electronics? This "Printable Spacecraft" pushes the limits of printed flexible electronics performance. So the answer is yes, more or less. In our studies for the NIAC (NASA Innovative Advanced Concepts) program, we have explored this question further, to explain more completely what "more or less" means and to outline what is needed to make the answer a definitive "yes". Despite its appealing "Flat Stanley"-like (a book series by Jeff Brown) qualities, making a Printable Spacecraft is not as easy as flattening the Cassini spacecraft with a bulletin board, as was Stanley Lamchop's fate. But, if NASA invests in the design challenges, the materials challenges, the performance challenges of printed electronics, it might find itself with a spacecraft that can enable as many adventures and advantages as Flat Stanley including putting it in an envelope and mailing it to the planet of your choice. You just have to let your imagination take over. In this report we document the work of the Phase 2 Printable Spacecraft task conducted under the guidance and leadership of the NIAC program. In Phase One of the NIAC task entitled "Printable Spacecraft", we investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. In Phase 2 we tried to answer the more practical questions such as can you really build a multi-functional printed electronic spacecraft system? If you do, can it survive the space environment? Even if it can, what benefit does a printable system provide over a traditional implementation of a spacecraft

    Shifting the Frontiers of Analog and Mixed-Signal Electronics

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    Electronics for Sensors

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    The aim of this Special Issue is to explore new advanced solutions in electronic systems and interfaces to be employed in sensors, describing best practices, implementations, and applications. The selected papers in particular concern photomultiplier tubes (PMTs) and silicon photomultipliers (SiPMs) interfaces and applications, techniques for monitoring radiation levels, electronics for biomedical applications, design and applications of time-to-digital converters, interfaces for image sensors, and general-purpose theory and topologies for electronic interfaces

    Vertical InAs Nanowire Devices and RF Circuits

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    Recent decades have seen an exponential increase in the functionality of electronic circuits, allowing for continuous innovation, which benefits society. This increase in functionality has been facilitated by scaling down the dimensions of the most important electronic component in modern electronics: the Si-based MOSFET. By reducing the size of the device, more transistors per chip area is possible. Smaller MOSFETs are also faster and more energy-efficient. In state of the art MOSFETs, the key dimensions are only few nanometers, rapidly approaching a point where the current scaling scheme may not be maintained. Research is ongoing to improve the device performance, mainly focusing on material and structural improvements to the existing MOSFET architecture. In this thesis, MOSFETs based on nanowires, are investigated. Taking advantage of the nanowire geometry, the gate can be wrapped all-around the nanowires for excellent control of the channel. The nanowires are made in a high-mobility III-V semiconductor, InAs, allowing for faster electrons and higher currents than Si. This device type is a potential candidate to either replace or complement Si-based MOSFETs in digital and analogue applications. Single balanced down-conversion mixer circuits were fabricated, consisting of three vertically aligned InAs nanowire MOSFETs and two nanowire resistors. These circuits are shown to operate with voltage gain in the GHz-regime. Individual transistors demonstrated operation with gain at several tens of GHz. A method to characterise the resistivity and metal-semiconductor contact quality has been developed, using the transmission line method adapted for vertical nanowires. This method has successfully been applied to InAs nanowires and shown that low-resistance contacts to these nanowires are possible. To optimise the performance of the device and reach as close to intrinsic operation as possible, parasitic capacitances and resistances in the device structure need to be minimised. A novel self-aligned gate-last fabrication method for vertical InAs nanowire transistors has been developed, that allows for an optimum design of the channel and the contact regions. Transistors fabricated using this method exhibit the best DC performance, in terms of a compromise between the normalised transconductance and sub-threshold swing, of any previously reported vertical nanowire MOSFET
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