Upstream and downstream implementation arrangements in two-level games. A focus on administrative simplification in the Italian National Recovery and Resilience Plan

The onset of the European NGEU program represented for European member states a formidable opportunity for post-pandemic recovery and yet a significant challenge at the same time: to receive and retain EU funds, each state had to promptly draw up a National Recovery and Resilience Plan-NRRP) and commit to a pressing timetable for its implementation. Regarding this challenge, the Italian government's response is a case in point: first, Italy is by far the largest beneficiary of NGEU funds; second, it has long had a reputation for being laggard in both the implementation of European directives and the spending of cohesion policy structural funds; and the formulation of the NRRP, the design of the governance in charge of its implementation, and implementation itself, occurred at a particular moment in the country's political life. Based on these premises, the article examines the upstream process by which the Italian government designed the implementation arrangements for the adoption of simplification policies under the NRRP and their downstream recalibration in the first two years, taking the implementation arrangements as the dependent variable. Analytically, the focus is on the interplay between the pressures of EU timetables and internal political dynamics, be they the legacy or strategic political considerations on the part of national policymakers, in determining the design and eventual re-design of implementation arrangements as the plan unfolds

Performance studies of the Belle II Silicon Vertex Detector with data taken at the DESY test beam in April 2016

Belle II is a multipurpose detector currently under construction which will be operated at the next generation B-factory SuberKEKB in Japan. Its main devices for the vertex reconstruction are the Silicon Vertex Detector (SVD) and the Pixel Detector (PXD). In April 2016 a sector of the Belle II SVD and PXD have been tested in a beam of high energetic electrons at the test beam facility at DESY Hamburg (Germany). We report here the results for the hit efficiency estimation and the measurement of the resolution for the Belle II silicon vertex etector. We find that the hit efficiencies are on average above 99.5% and that the measured resolution is within the expectations

Bonding of the Inner Tracker Silicon Microstrip Modules

Microbonding of the CMS Tracker Inner Barrel (TIB) and Tracker Inner Disks (TID) modules was shared among six different Italian Institutes. The organization devised and the infrastructure deployed to handle this task is illustrated. Microbonding specifications and procedures for the different types of TIB and TID modules are given. The tooling specially designed and developed for these types of modules is described. Experience of production is presented. Attained production rates are given. An analysis of the microbonding quality achieved is presented, based on bond strengths measured in sample bond pull tests as well as on rates of bonding failures. Italian Bonding Centers routinely performed well above minimum specifications and a very low global introduced failure rate, at the strip level, of only $\sim$0.015 \% is observed

Performance studies of the Belle II Silicon Vertex Detector with data taken at the DESY test beam in April 2016

Belle II is a multipurpose detector currently under construction which will be operated at the next generation B-factory SuberKEKB in Japan. Its main devices for the vertex reconstruction are the Silicon Vertex Detector (SVD) and the Pixel Detector (PXD). In April 2016 a sector of the Belle II SVD and PXD have been tested in a beam of high energetic electrons at the test beam facility at DESY Hamburg (Germany). We report here the results for the hit efficiency estimation and the measurement of the resolution for the Belle II silicon vertex etector. We find that the hit efficiencies are on average above 99.5% and that the measured resolution is within the expectations

The Belle II SVD detector

The Silicon Vertex Detector (SVD) is one of the main detectors in the Belle II experiment at KEK, Japan. In combination with a pixel detector, the SVD determines precise decay vertex and low-momentum track reconstruction. The SVD ladders are being developed at several institutes. For the development of the tracking algorithm as well as the performance estimation of the ladders, beam tests for the ladders were performed. We report an overview of the SVD development, its performance measured in the beam test, and the prospect of its assembly and commissioning until installation

The new ALEPH Silicon Vertex Detector

The ALEPH collaboration, in view of the importance of effective vertex detection for the Higgs boson search at LEP 2, decided to upgrade the previous vertex detector. Main changes were an increased length (±20 cm), a higher granularity for rφ view (50 µm), a new preamplifier (MX7 rad hard chip), a polymide (upilex) fan-out on z side to carry the signals from the strips to the front-end electronics outside the fiducial region reducing consequently the passive material in the central region by a factor of two. The detector, the running experience and its performance will be described

Test beam performance measurements for the Phase I upgrade of the CMS pixel detector

A new pixel detector for the CMS experiment was built in order to cope with the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking with a reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and allows operation at low comparator thresholds. In this paper, comprehensive test beam studies are presented, which have been conducted to verify the design and to quantify the performance of the new detector assemblies in terms of tracking efficiency and spatial resolution. Under optimal conditions, the tracking efficiency is (99.95 ± 0.05) %, while the intrinsic spatial resolutions are (4.80 ± 0.25) μm and (7.99 ± 0.21) μm along the 100 μm and 150 μm pixel pitch, respectively. The findings are compared to a detailed Monte Carlo simulation of the pixel detector and good agreement is found.Peer reviewe

Performance studies of the CMS strip tracker before installation

Peer reviewe

XPOL-III: a New-Generation VLSI CMOS ASIC for High-Throughput X-ray Polarimetry

While the successful launch and operation in space of the Gas Pixel Detectors onboard the PolarLight cubesat and the Imaging X-ray Polarimetry Explorer demonstrate the viability and the technical soundness of this class of detectors for astronomical X-ray polarimetry, it is clear that the current state of the art is not ready to meet the challenges of the next generation of experiments, such as the enhanced X-ray Timing and Polarimetry mission, designed to allow for a significantly larger data throughput. In this paper we describe the design and test of a new custom, self-triggering readout ASIC, dubbed XPOL-III, specifically conceived to address and overcome these limitations. While building upon the overall architecture of the previous generations, the new chip improves over its predecessors in several, different key areas: the sensitivity of the trigger electronics, the flexibility in the definition of the readout window, as well as the maximum speed for the serial event readout. These design improvements, when combined, allow for almost an order of magnitude smaller dead time per event with no measurable degradation of the polarimetric, spectral, imaging or timing capability of the detector, providing a good match for the next generation of X-ray missions.Comment: accepted for publication at Nuclear Inst. and Methods in Physics Research Section