Atomic layer deposition (ALD) for tin whisker mitigation on Pb-free surfaces

Atomic layer deposition (ALD) for tin whisker mitigation on Pb-free surface

Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

This paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process variables on the ability of the coating to mitigate whisker growth were evaluated. Scanning electron microscopy and optical microscopy were used to evaluate both the size and distribution of tin whiskers and the coating/whisker interactions. Results show that the ALD process can achieve significant reductions in whisker growth and thus offers considerable potential as a reworkable whisker mitigation strategy. The effect of ALD layer thickness on whisker formation was also investigated. Studies indicate that thermal exposure during ALD processing may contribute significantly to the observed whisker mitigation

Gravure-offset printing in the manufacture of ultra-fine-line thick-films for electronics

Abstract In gravure offset printing, ink is transferred with the help of an offset material from a patterned gravure plate to a substrate. This thesis is concerned with the study and further development of this printing process for electronics; on alumina, glass and polymers. The work has been divided into five parts. In the first section, the printing process is described. The second section describes the composition of the inks for gravure offset printing and the resulting ink properties. It also presents the ink transfer mechanism; the model that explains how the ink is transferred between an offset material and a substrate. The third chapter details the printing process explained by a solvent absorption mechanism. The forth chapter describes the firing/curing of printed samples and their properties. The last chapter describes applications of the method. The inks used to produce conductors on ceramics (ceramic inks) and conductors on polymers (polymer inks) contain silver particles, and were under development for gravure offset printing. The major achieved properties were the high ink pickup to the offset blanket and high transfer percentage to the substrate. 100% ink transfer from blanket to substrate for ceramic inks and almost 100% ink transfer for polymer inks was obtained. The printing of ceramic inks was able to produce 8 μm of relatively thick, 300 μm wide lines with < 10 mΩ/sq. resistance. The minimum line width for conducting lines was 35 μm, with one printing. Multi printing was applied producing as many as 10 times wet-on-wet multiprinted lines with 100 % ink transfer from blanket to substrate resulting in a square resistance of 1mΩ/sq. Polymer inks were able produce a square resistance of 20 mΩ/sq. for 300 μm wide lines after curing at 140 °C for about 15 min, and the minimum width was down to 70 μm. In the optimised manufacturing process, the delay time on the blanket was reduced to 3 s. In addition to ultra-fine-line manufacturing of conductors, the method enables the manufacture of special structures e.g. laser-solder contact pads with 28/28 μm lines/spaces resolution. With industrial printing equipment it is possible to produce 100 m2/h with the demonstrated printing properties

Low-emittance copper-coating system using atomic-layer-deposited aluminum oxide

ABSTRACT Copper, due to its unique properties, has a huge technological importance to our society. However, the oxidation of copper remains an issue in numerous application areas. This is especially the case in visible and IR-band optics, where even minuscule oxide layers degrade the thermo-optical properties of copper surfaces. A solution possibly resides in the application of protective coatings, which can simultaneously impair the low thermal emittance of bare copper surfaces. The present paper examines the use of thin Al2O3 layers as a protective coating for copper. Al2O3 layers with thickness of 4.5, 9.1, 18.5 or 28.3 nm were deposited on polished copper discs using atomic layer deposition (ALD). The total hemispherical emissivity and absorptivity of these coated copper discs were measured from 20 K up to room temperature. The emissivity and absorptivity of the copper with ALD-deposited Al2O3 layers increased with rising temperature and layer thickness. Nonetheless, the observed values stayed below 1.8%,allowing the use of the coated copper in systems where low emission or absorption of thermal radiation is needed. Alongside the experiments, we present a computer-based analysis and interpretation, which may be generally applied for prediction of temperature-dependent emittance of metallic surfaces coated with a thin polar dielectric layer.Peer reviewe

Constructing Spacecraft Components Using Additive Manufacturing and Atomic Layer Deposition : First Steps for Integrated Electric Circuitry

Funding Information: We thank the European Space Agency (ESA), who has supported parts of this research as part of the HighPEEK project (ESA Contract No. 4000127834/19/UK/AB). In particular, Ugo Lafont and Paul Greenway (ESA) have our gratitude. We also deeply appreciate the help given by Daniel Leese (exchange student at Aalto University), Kirsi Kukko, Ashish Mohite and Olli Knuuttila (Aalto University), Lorenz Schmuckli and Pekka Rummukainen (Aalto University, retired), and Katja Väyrynen and Marko Vehkamäki (University of Helsinki). Publisher Copyright: © 2021 American Society of Civil Engineers.Many fields, including the aerospace industry, have shown increased interest in the use of plastics to lower the mass of systems. However, the use of plastics in space can be challenging for a number of reasons. Ultraviolet radiation, atomic oxygen, and other phenomena specifically associated with space cause the degradation of polymers. Here we show a path toward creation of space-grade components by combining additive manufacturing (AM) and atomic layer deposition (ALD). Our method produced ALD Al2O3 coated thermoplastic parts suitable for space applications. The highlight of this work is a significant reduction in outgassing, demonstrated using residual gas analyzer (RGA) sampling. Compared to uncoated parts, the ALD Al2O3 coating decreased the outgassing of polyether ether ketone (PEEK), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), and nanodiamond-doped polylactide (ND-PLA) by 46%, 49%, 58%, and 65%, respectively. The manufacturing method used in this work enables the use of topology optimization already in the early concept creation phase. The method is ideally suited for spacecraft applications, in which the volume and mass of parts is critical, and could also be adapted for in-space manufacturing. (c) 2021 American Society of Civil Engineers.Peer reviewe

A miniature bio-inspired optic flow sensor based on low temperature co-fired ceramics (LTCC) technology

International audienceLow temperature co-fired ceramics (LTCC) technology is classically used in the field of radio frequencies to make items such as miniature transceivers for handheld devices. Here we harness the LTCC technology to autonomous micro-aerial vehicles (MAVs), a field in which small size and low mass are at a premium. Designing autonomous MAVs will be a highly challenging issue during the next few decades. Bio-inspired optic flow sensors, also known as elementary motion detector (EMD) circuits, have proved to be efficient means of providing animals and robots with visual guidance ability. The LTCC technology gives a good trade-off between the need for reliable optic flow sensors and the need for small-sized multiple electronic components. Comparisons with other technologies (PCB, analogue VLSI) show that LTCC technology is one of the most reliable solutions to the problem of obtaining reliable electronic EMDs that are small enough (area 7 mm x 7 mm) and light enough (mass 0.2 g) to be accommodated on-board a MAV. The output from our LTCC based optic flow sensors is largely invariant with respect to both contrast and spatial frequency. (c) 2006 Elsevier B.V. All rights reserved

Atomic layer deposition (ALD) for environmental protection and whisker mitigation of electronic assemblies

Funding Information: The majority of the work was financed by ESA project "Atomic Layer Deposition for Tin Whiskers Mitigation and Cure on Space Electronics Manufacturing" 4000122745/18/NL/LvH/gp. The authors also acknowledge use of facilities within the Loughborough Materials Characterisation Centre, UK. CS acknowledges the support from the Academy of Finland Flagship Program (Grant No.: 320167, PREIN) and support from Aalto Seed funding scheme. The authors wish to thank Adrian Tighe and Abel Brieva from ESA/ESTEC for providing information about the bake-out measurements. Publisher Copyright: © 2021, The Author(s).In this study, we demonstrate how metal-oxide thin-film conformal coatings grown by atomic layer deposition (ALD) can be exploited as an effective approach to mitigate tin whisker growth on printed circuit boards. First, we study the effect of different ALD coatings and process parameters on Sn–Cu-electroplated test coupons, by combining optical imaging and scanning electron microscopy and evaluating whisker distribution on the surface. On these samples, we found that one important parameter in mitigating whisker growth is the time interval between electroplating and the ALD coating process (pre-coat time), which should be kept of the order of few days (2, based on our results). Atomic layer-deposited coatings were also found to be effective toward whisker formation in different storage conditions. Furthermore, we show that ALD coating is also effective in limiting the need for outgassing of electronic assemblies (PCBAs), which is an additional stringent requirement for applications in space industry. Our experimental results thus demonstrated that atomic layer deposition is a suitable technique for aerospace applications, both in terms of degassing and whisker mitigation.Peer reviewe

Fabrication of ultrathin multilayered superomniphobic nanocoatings by liquid flame spray, atomic layer deposition, and silanization

Superomniphobic, i.e. liquid-repellent, surfaces have been an interesting area of research during recent years due to their various potential applications. However, producing such surfaces, especially on hard and resilient substrates like stainless steel, still remains challenging. We present a stepwise fabrication process of a multilayered nanocoating on a stainless steel substrate, consisting of a nanoparticle layer, a nanofilm, and a layer of silane molecules. Liquid flame spray was used to deposit a TiO2 nanoparticle layer as the bottom layer for producing a suitable surface structure. The interstitial Al2O3 nanofilm, fabricated by atomic layer deposition (ALD), stabilized the nanoparticle layer, and the topmost fluorosilane layer lowered the surface energy of the coating for enhanced omniphobicity. The coating was characterized with field emission scanning electron microscopy, focused ion beam scanning electron microscopy, x-ray photoelectron spectroscopy, contact angle (CA) and sliding angle (SA) measurements, and microscratch testing. The widely recognized requirements for superrepellency, i.e. CA > 150° and SA < 10°, were achieved for deioinized water, diiodomethane, and ethylene glycol. The mechanical stability of the coating could be varied by tuning the thickness of the ALD layer at the expense of repellency. To our knowledge, this is the thinnest superomniphobic coating reported so far, with the average thickness of about 70 nm.acceptedVersionPeer reviewe