Recommended reading list of early publications on atomic layer deposition-Outcome of the "Virtual Project on the History of ALD"

Atomic layer deposition (ALD), a gas-phase thin film deposition technique based on repeated, self-terminating gas-solid reactions, has become the method of choice in semiconductor manufacturing and many other technological areas for depositing thin conformal inorganic material layers for various applications. ALD has been discovered and developed independently, at least twice, under different names: atomic layer epitaxy (ALE) and molecular layering. ALE, dating back to 1974 in Finland, has been commonly known as the origin of ALD, while work done since the 1960s in the Soviet Union under the name "molecular layering" (and sometimes other names) has remained much less known. The virtual project on the history of ALD (VPHA) is a volunteer-based effort with open participation, set up to make the early days of ALD more transparent. In VPHA, started in July 2013, the target is to list, read and comment on all early ALD academic and patent literature up to 1986. VPHA has resulted in two essays and several presentations at international conferences. This paper, based on a poster presentation at the 16th International Conference on Atomic Layer Deposition in Dublin, Ireland, 2016, presents a recommended reading list of early ALD publications, created collectively by the VPHA participants through voting. The list contains 22 publications from Finland, Japan, Soviet Union, United Kingdom, and United States. Up to now, a balanced overview regarding the early history of ALD has been missing; the current list is an attempt to remedy this deficiency. (C) 2016 Author(s).Peer reviewe

Dépôt chimique (CVD/ALD) assisté par plasma et intégration de Ti(Al)N et Ta(Al)N pour les métaux de grille sub-20nm

For the sub-20 nm technological nodes metal conformity requirements are beyond the possibilities of the currently used PVD deposition technique. CVD techniques, more specifically MOCVD and ALD, are identified as the best techniques for metal deposition. For metal-gate application, titanium and tantalum carbo-nitrides alloys are considered as the most promising. In this work, a detailed review of MOCVD and ALD deposition mechanisms and plasma influence on the deposited material is carried out. First, process windows for successful tuning of the metal properties are examined. Plasma impact on the metal and the inherent reaction mechanisms are also highlighted with the help of plasma characterisation. Then great importance is given to the integration of these metals, by careful study of the interactions taking place at the interfaces. Correlations between physico-chemical properties and electrical behavior of the metal/high-k dielectric stack are introduced thanks to XPS characterisation. Finally, aluminium doping of MOCVD TiN and TaN is considered for n-mos and p-mos gate characteristics achievement. By comparison of the properties and behaviours of Al doped metals deposited by PVD and MOCVD, diffusion mechanisms are proposed to explain the role of Al in the observed changes.L'intégration du métal dans les nœuds technologiques sub-20 nm requiert une conformité supérieure à celle permise par la PVD. Les techniques de CVD, plus spécifiquement la MOCVD et l'ALD, ont été identifiées comme les meilleures solutions pour le dépôt de métal. Pour une application de métal de grille, les alliages carbo-nitrurés de titane et tantale sont considérés comme les plus prometteurs. Dans ce travail une revue détaillée des mécanismes de dépôt par MOCVD et ALD, ainsi que sur l'influence du plasma sur les matériaux déposés est réalisée. Dans un premier temps, les fenêtres de procédés possibles pour un ajustement des propriétés des métaux sont inspectées attentivement. L'accent est mis sur l'impact du plasma sur le métal et sur les mécanismes réactionnels inhérents grâce à une caractérisation poussée du plasma. Par la suite, l'intégration de ces métaux est étudiée avec une analyse précise des interactions se déroulant aux interfaces. La corrélation entre les propriétés physico-chimiques et le comportement électrique des empilements métal/diélectrique à forte permittivité est soutenue par une analyse XPS. Finalement, le dopage aluminium de dépôts de TiN et TaN MOCVD est étudié pour l'obtention de grilles n-mos et p-mos. Par comparaison des propriétés et comportements du dopage aluminium de métaux déposés par PVD et MOCVD, des mécanismes de diffusion sont proposés afin d'expliquer le rôle de l'aluminium sur les variations observées

Dépôt chimique (CVD/ALD) assisté par plasma et intégration de Ti(Al)N et Ta(Al)N pour les métaux de grille sub-20nm

For the sub-20 nm technological nodes metal conformity requirements are beyond the possibilities of the currently used PVD deposition technique. CVD techniques, more specifically MOCVD and ALD, are identified as the best techniques for metal deposition. For metal-gate application, titanium and tantalum carbo-nitrides alloys are considered as the most promising. In this work, a detailed review of MOCVD and ALD deposition mechanisms and plasma influence on the deposited material is carried out. First, process windows for successful tuning of the metal properties are examined. Plasma impact on the metal and the inherent reaction mechanisms are also highlighted with the help of plasma characterisation. Then great importance is given to the integration of these metals, by careful study of the interactions taking place at the interfaces. Correlations between physico-chemical properties and electrical behavior of the metal/high-k dielectric stack are introduced thanks to XPS characterisation. Finally, aluminium doping of MOCVD TiN and TaN is considered for n-mos and p-mos gate characteristics achievement. By comparison of the properties and behaviours of Al doped metals deposited by PVD and MOCVD, diffusion mechanisms are proposed to explain the role of Al in the observed changes.L'intégration du métal dans les nœuds technologiques sub-20 nm requiert une conformité supérieure à celle permise par la PVD. Les techniques de CVD, plus spécifiquement la MOCVD et l'ALD, ont été identifiées comme les meilleures solutions pour le dépôt de métal. Pour une application de métal de grille, les alliages carbo-nitrurés de titane et tantale sont considérés comme les plus prometteurs. Dans ce travail une revue détaillée des mécanismes de dépôt par MOCVD et ALD, ainsi que sur l'influence du plasma sur les matériaux déposés est réalisée. Dans un premier temps, les fenêtres de procédés possibles pour un ajustement des propriétés des métaux sont inspectées attentivement. L'accent est mis sur l'impact du plasma sur le métal et sur les mécanismes réactionnels inhérents grâce à une caractérisation poussée du plasma. Par la suite, l'intégration de ces métaux est étudiée avec une analyse précise des interactions se déroulant aux interfaces. La corrélation entre les propriétés physico-chimiques et le comportement électrique des empilements métal/diélectrique à forte permittivité est soutenue par une analyse XPS. Finalement, le dopage aluminium de dépôts de TiN et TaN MOCVD est étudié pour l'obtention de grilles n-mos et p-mos. Par comparaison des propriétés et comportements du dopage aluminium de métaux déposés par PVD et MOCVD, des mécanismes de diffusion sont proposés afin d'expliquer le rôle de l'aluminium sur les variations observées

Evaluation of plasma parameters on PEALD deposited TaCN

International audienc

On the early history of atomic layer deposition: most significant works and applications

Atomic layer deposition (ALD) is a technique that has been instrumental in enabling the semiconductor industry to maintain its adherence to Moore’s Law, and is becoming a gamechanger in several other fields. A worldwide voluntary effort called “Virtual Project on the History of ALD” (VPHA), open for everyone with an ALD background to participate, was launched in summer 2013 to explore how the ALD concept was developed; which were the first ALD experiments; when, where, why and by whom they were made. Earlier VPHA outcomes were published at ALD 2014 (accessed through VPHA’s website http://vphald.com); VPHA has made steady progress since then. Here we will present a conclusive recommended reading list of the most significant early ALD publications and briefly review the most important individual works and applications. Acknowledgements: We are grateful for Dr. Tuomo Suntola’s general support during the VPHA and for Dr. Aziz Abdulagatov’s and Annina Titoff’s assistance in initiating it. The VPHA would not have been possible without the recent advances in professional social networking and cloud computing. RLP acknowledges partial funding from the Finnish Centre of Excellence in Atomic Layer Deposition. The author list is intentionally in alphabetical order

Review Article: Recommended reading list of early publications on atomic layer deposition—Outcome of the “Virtual Project on the History of ALD”

Atomic layer deposition (ALD), a gas-phase thin film deposition technique based on repeated, self-terminating gas–solid reactions, has become the method of choice in semiconductor manufacturing and many other technological areas for depositing thin conformal inorganic material layers for various applications. ALD has been discovered and developed independently, at least twice, under different names: atomic layer epitaxy (ALE) and molecular layering. ALE, dating back to 1974 in Finland, has been commonly known as the origin of ALD, while work done since the 1960s in the Soviet Union under the name “molecular layering” (and sometimes other names) has remained much less known. The virtual project on the history of ALD (VPHA) is a volunteer-based effort with open participation, set up to make the early days of ALD more transparent. In VPHA, started in July 2013, the target is to list, read and comment on all early ALD academic and patent literature up to 1986. VPHA has resulted in two essays and several presentations at international conferences. This paper, based on a poster presentation at the 16th International Conference on Atomic Layer Deposition in Dublin, Ireland, 2016, presents a recommended reading list of early ALD publications, created collectively by the VPHA participants through voting. The list contains 22 publications from Finland, Japan, Soviet Union, United Kingdom, and United States. Up to now, a balanced overview regarding the early history of ALD has been missing; the current list is an attempt to remedy this deficiency