초고용량 솔리드 스테이드 드라이브를 위한 신뢰성 향상 및 성능 최적화 기술

학위논문(박사) -- 서울대학교대학원 : 공과대학 컴퓨터공학부, 2021.8. 김지홍.The development of ultra-large NAND flash storage devices (SSDs) is recently made possible by NAND flash memory semiconductor process scaling and multi-leveling techniques, and NAND package technology, which enables continuous increasing of storage capacity by mounting many NAND flash memory dies in an SSD. As the capacity of an SSD increases, the total cost of ownership of the storage system can be reduced very effectively, however due to limitations of ultra-large SSDs in reliability and performance, there exists some obstacles for ultra-large SSDs to be widely adopted. In order to take advantage of an ultra-large SSD, it is necessary to develop new techniques to improve these reliability and performance issues. In this dissertation, we propose various optimization techniques to solve the reliability and performance issues of ultra-large SSDs. In order to overcome the optimization limitations of the existing approaches, our techniques were designed based on various characteristic evaluation results of NAND flash devices and field failure characteristics analysis results of real SSDs. We first propose a low-stress erase technique for the purpose of reducing the characteristic deviation between wordlines (WLs) in a NAND flash block. By reducing the erase stress on weak WLs, it effectively slows down NAND degradation and improves NAND endurance. From the NAND evaluation results, the conditions that can most effectively guard the weak WLs are defined as the gerase mode. In addition, considering the user workload characteristics, we propose a technique to dynamically select the optimal gerase mode that can maximize the lifetime of the SSD. Secondly, we propose an integrated approach that maximizes the efficiency of copyback operations to improve performance while not compromising data reliability. Based on characterization using real 3D TLC flash chips, we propose a novel per-block error propagation model under consecutive copyback operations. Our model significantly increases the number of successive copybacks by exploiting the aging characteristics of NAND blocks. Furthermore, we devise a resource-efficient error management scheme that can handle successive copybacks where pages move around multiple blocks with different reliability. By utilizing proposed copyback operation for internal data movement, SSD performance can be effectively improved without any reliability issues. Finally, we propose a new recovery scheme, called reparo, for a RAID storage system with ultra-large SSDs. Unlike the existing RAID recovery schemes, reparo repairs a failed SSD at the NAND die granularity without replacing it with a new SSD, thus avoiding most of the inter-SSD data copies during a RAID recovery step. When a NAND die of an SSD fails, reparo exploits a multi-core processor of the SSD controller to identify failed LBAs from the failed NAND die and to recover data from the failed LBAs. Furthermore, reparo ensures no negative post-recovery impact on the performance and lifetime of the repaired SSD. In order to evaluate the effectiveness of the proposed techniques, we implemented them in a storage device prototype, an open NAND flash storage device development environment, and a real SSD environment. And their usefulness was verified using various benchmarks and I/O traces collected the from real-world applications. The experiment results show that the reliability and performance of the ultra-large SSD can be effectively improved through the proposed techniques.반도체 공정의 미세화, 다치화 기술에 의해서 지속적으로 용량이 증가하고 있는 단위 낸드 플래쉬 메모리와 하나의 낸드 플래쉬 기반 스토리지 시스템 내에 수 많은 낸드 플래쉬 메모리 다이를 실장할 수 있게하는 낸드 패키지 기술로 인해 하드디스크보다 훨씬 더 큰 초고용량의 낸드 플래쉬 저장장치의 개발을 가능하게 했다. 플래쉬 저장장치의 용량이 증가할 수록 스토리지 시스템의 총 소유비용을 줄이는데 매우 효과적인 장점을 가지고 있으나, 신뢰성 및 성능의 측면에서의 한계로 인해서 초고용량 낸드 플래쉬 저장장치가 널리 사용되는데 있어서 장애물로 작용하고 있다. 초고용량 저장장치의 장점을 활용하기 위해서는 이러한 신뢰성 및 성능을 개선하기 위한 새로운 기법의 개발이 필요하다. 본 논문에서는 초고용량 낸드기반 저장장치(SSD)의 문제점인 성능 및 신뢰성을 개선하기 위한 다양한 최적화 기술을 제안한다. 기존 기법들의 최적화 한계를 극복하기 위해서, 우리의 기술은 실제 낸드 플래쉬 소자에 대한 다양한 특성 평가 결과와 SSD의 현장 불량 특성 분석결과를 기반으로 고안되었다. 이를 통해서 낸드의 플래쉬 특성과 SSD, 그리고 호스트 시스템의 동작 특성을 고려한 성능 및 신뢰성을 향상시키는 최적화 방법론을 제시한다. 첫째로, 본 논문에서는 낸드 플래쉬 불록내의 페이지들간의 특성편차를 줄이기 위해서 동적인 소거 스트레스 경감 기법을 제안한다. 제안된 기법은 낸드 블록의 내구성을 늘리기 위해서 특성이 약한 페이지들에 대해서 더 적은 소거 스트레스가 인가할 수 있도록 낸드 평가 결과로 부터 소거 스트레스 경감 모델을 구축한다. 또한 사용자 워크로드 특성을 고려하여, 소거 스트레스 경감 기법의 효과가 최대화 될 수 있는 최적의 경감 수준을 동적으로 판단할 수 있도록 한다. 이를 통해서 낸드 블록을 열화시키는 주요 원인인 소거 동작을 효율적으로 제어함으로써 저장장치의 수명을 효과적으로 향상시킨다. 둘째로, 본 논문에서는 고용량 SSD에서의 내부 데이터 이동으로 인한 성능 저하문제를 개선하기 위해서 낸드 플래쉬의 제한된 카피백(copyback) 명령을 활용하는 적응형 기법인 rCPB을 제안한다. rCPB은 Copyback 명령의 효율성을 극대화 하면서도 데이터 신뢰성에 문제가 없도록 낸드의 블럭의 노화특성을 반영한 새로운 copyback 오류 전파 모델을 기반으로한다. 이에더해, 신뢰성이 다른 블럭간의 copyback 명령을 활용한 데이터 이동을 문제없이 관리하기 위해서 자원 효율적인 오류 관리 체계를 제안한다. 이를 통해서 신뢰성에 문제를 주지 않는 수준에서 copyback을 최대한 활용하여 내부 데이터 이동을 최적화 함으로써 SSD의 성능향상을 달성할 수 있다. 마지막으로, 본 논문에서는 초고용량 SSD에서 낸드 플래쉬의 다이(die) 불량으로 인한 레이드(redundant array of independent disks, RAID) 리빌드 오버헤드를 최소화 하기위한 새로운 RAID 복구 기법인 reparo를 제안한다. Reparo는 SSD에 대한 교체없이 SSD의 불량 die에 대해서만 복구를 수행함으로써 복구 오버헤드를 최소화한다. 불량이 발생한 die의 데이터만 선별적으로 복구함으로써 복구 과정의 리빌드 트래픽을 최소화하며, SSD 내부의 병렬구조를 활용하여 불량 die 복구 시간을 효과적으로 단축한다. 또한 die 불량으로 인한 물리적 공간감소의 부작용을 최소화 함으로써 복구 이후의 성능 저하 및 수명의 감소 문제가 없도록 한다. 본 논문에서 제안한 기법들은 저장장치 프로토타입 및 공개 낸드 플래쉬 저장장치 개발환경, 그리고 실장 SSD환경에 구현되었으며, 실제 응용 프로그램을 모사한 다양한 벤트마크 및 실제 I/O 트레이스들을 이용하여 그 유용성을 검증하였다. 실험 결과, 제안된 기법들을 통해서 초고용량 SSD의 신뢰성 및 성능을 효과적으로 개선할 수 있음을 확인하였다.I Introduction 1 1.1 Motivation 1 1.2 Dissertation Goals 3 1.3 Contributions 5 1.4 Dissertation Structure 8 II Background 11 2.1 Overview of 3D NAND Flash Memory 11 2.2 Reliability Management in NAND Flash Memory 14 2.3 UL SSD architecture 15 2.4 Related Work 17 2.4.1 NAND endurance optimization by utilizing page characteristics difference 17 2.4.2 Performance optimizations using copyback operation 18 2.4.3 Optimizations for RAID Rebuild 19 2.4.4 Reliability improvement using internal RAID 20 III GuardedErase: Extending SSD Lifetimes by Protecting Weak Wordlines 22 3.1 Reliability Characterization of a 3D NAND Flash Block 22 3.1.1 Large Reliability Variations Among WLs 22 3.1.2 Erase Stress on Flash Reliability 26 3.2 GuardedErase: Design Overview and its Endurance Model 28 3.2.1 Basic Idea 28 3.2.2 Per-WL Low-Stress Erase Mode 31 3.2.3 Per-Block Erase Modes 35 3.3 Design and Implementation of LongFTL 39 3.3.1 Overview 39 3.3.2 Weak WL Detector 40 3.3.3 WAF Monitor 42 3.3.4 GErase Mode Selector 43 3.4 Experimental Results 46 3.4.1 Experimental Settings 46 3.4.2 Lifetime Improvement 47 3.4.3 Performance Overhead 49 3.4.4 Effectiveness of Lowest Erase Relief Ratio 50 IV Improving SSD Performance Using Adaptive Restricted- Copyback Operations 52 4.1 Motivations 52 4.1.1 Data Migration in Modern SSD 52 4.1.2 Need for Block Aging-Aware Copyback 53 4.2 RCPB: Copyback with a Limit 55 4.2.1 Error-Propagation Characteristics 55 4.2.2 RCPB Operation Model 58 4.3 Design and Implementation of rcFTL 59 4.3.1 EPM module 60 4.3.2 Data Migration Mode Selection 64 4.4 Experimental Results 65 4.4.1 Experimental Setup 65 4.4.2 Evaluation Results 66 V Reparo: A Fast RAID Recovery Scheme for Ultra- Large SSDs 70 5.1 SSD Failures: Causes and Characteristics 70 5.1.1 SSD Failure Types 70 5.1.2 SSD Failure Characteristics 72 5.2 Impact of UL SSDs on RAID Reliability 74 5.3 RAID Recovery using Reparo 77 5.3.1 Overview of Reparo 77 5.4 Cooperative Die Recovery 82 5.4.1 Identifier: Parallel Search of Failed LBAs 82 5.4.2 Handler: Per-Core Space Utilization Adjustment 83 5.5 Identifier Acceleration Using P2L Mapping Information 89 5.5.1 Page-level P2L Entrustment to Neighboring Die 90 5.5.2 Block-level P2L Entrustment to Neighboring Die 92 5.5.3 Additional Considerations for P2L Entrustment 94 5.6 Experimental Results 95 5.6.1 Experimental Settings 95 5.6.2 Experimental Results 97 VI Conclusions 109 6.1 Summary 109 6.2 Future Work 111 6.2.1 Optimization with Accurate WAF Prediction 111 6.2.2 Maximizing Copyback Threshold 111 6.2.3 Pre-failure Detection 112박

Reliable Low-Power High Performance Spintronic Memories

Moores Gesetz folgend, ist es der Chipindustrie in den letzten fünf Jahrzehnten gelungen, ein explosionsartiges Wachstum zu erreichen. Dies hatte ebenso einen exponentiellen Anstieg der Nachfrage von Speicherkomponenten zur Folge, was wiederum zu speicherlastigen Chips in den heutigen Computersystemen führt. Allerdings stellen traditionelle on-Chip Speichertech- nologien wie Static Random Access Memories (SRAMs), Dynamic Random Access Memories (DRAMs) und Flip-Flops eine Herausforderung in Bezug auf Skalierbarkeit, Verlustleistung und Zuverlässigkeit dar. Eben jene Herausforderungen und die überwältigende Nachfrage nach höherer Performanz und Integrationsdichte des on-Chip Speichers motivieren Forscher, nach neuen nichtflüchtigen Speichertechnologien zu suchen. Aufkommende spintronische Spe- ichertechnologien wie Spin Orbit Torque (SOT) und Spin Transfer Torque (STT) erhielten in den letzten Jahren eine hohe Aufmerksamkeit, da sie eine Reihe an Vorteilen bieten. Dazu gehören Nichtflüchtigkeit, Skalierbarkeit, hohe Beständigkeit, CMOS Kompatibilität und Unan- fälligkeit gegenüber Soft-Errors. In der Spintronik repräsentiert der Spin eines Elektrons dessen Information. Das Datum wird durch die Höhe des Widerstandes gespeichert, welche sich durch das Anlegen eines polarisierten Stroms an das Speichermedium verändern lässt. Das Prob- lem der statischen Leistung gehen die Speichergeräte sowohl durch deren verlustleistungsfreie Eigenschaft, als auch durch ihr Standard- Aus/Sofort-Ein Verhalten an. Nichtsdestotrotz sind noch andere Probleme, wie die hohe Zugriffslatenz und die Energieaufnahme zu lösen, bevor sie eine verbreitete Anwendung finden können. Um diesen Problemen gerecht zu werden, sind neue Computerparadigmen, -architekturen und -entwurfsphilosophien notwendig. Die hohe Zugriffslatenz der Spintroniktechnologie ist auf eine vergleichsweise lange Schalt- dauer zurückzuführen, welche die von konventionellem SRAM übersteigt. Des Weiteren ist auf Grund des stochastischen Schaltvorgangs der Speicherzelle und des Einflusses der Prozessvari- ation ein nicht zu vernachlässigender Zeitraum dafür erforderlich. In diesem Zeitraum wird ein konstanter Schreibstrom durch die Bitzelle geleitet, um den Schaltvorgang zu gewährleisten. Dieser Vorgang verursacht eine hohe Energieaufnahme. Für die Leseoperation wird gleicher- maßen ein beachtliches Zeitfenster benötigt, ebenfalls bedingt durch den Einfluss der Prozess- variation. Dem gegenüber stehen diverse Zuverlässigkeitsprobleme. Dazu gehören unter An- derem die Leseintereferenz und andere Degenerationspobleme, wie das des Time Dependent Di- electric Breakdowns (TDDB). Diese Zuverlässigkeitsprobleme sind wiederum auf die benötigten längeren Schaltzeiten zurückzuführen, welche in der Folge auch einen über längere Zeit an- liegenden Lese- bzw. Schreibstrom implizieren. Es ist daher notwendig, sowohl die Energie, als auch die Latenz zur Steigerung der Zuverlässigkeit zu reduzieren, um daraus einen potenziellen Kandidaten für ein on-Chip Speichersystem zu machen. In dieser Dissertation werden wir Entwurfsstrategien vorstellen, welche das Ziel verfolgen, die Herausforderungen des Cache-, Register- und Flip-Flop-Entwurfs anzugehen. Dies erre- ichen wir unter Zuhilfenahme eines Cross-Layer Ansatzes. Für Caches entwickelten wir ver- schiedene Ansätze auf Schaltkreisebene, welche sowohl auf der Speicherarchitekturebene, als auch auf der Systemebene in Bezug auf Energieaufnahme, Performanzsteigerung und Zuver- lässigkeitverbesserung evaluiert werden. Wir entwickeln eine Selbstabschalttechnik, sowohl für die Lese-, als auch die Schreiboperation von Caches. Diese ist in der Lage, den Abschluss der entsprechenden Operation dynamisch zu ermitteln. Nachdem der Abschluss erkannt wurde, wird die Lese- bzw. Schreiboperation sofort gestoppt, um Energie zu sparen. Zusätzlich limitiert die Selbstabschalttechnik die Dauer des Stromflusses durch die Speicherzelle, was wiederum das Auftreten von TDDB und Leseinterferenz bei Schreib- bzw. Leseoperationen re- duziert. Zur Verbesserung der Schreiblatenz heben wir den Schreibstrom an der Bitzelle an, um den magnetischen Schaltprozess zu beschleunigen. Um registerbankspezifische Anforderungen zu berücksichtigen, haben wir zusätzlich eine Multiport-Speicherarchitektur entworfen, welche eine einzigartige Eigenschaft der SOT-Zelle ausnutzt, um simultan Lese- und Schreiboperatio- nen auszuführen. Es ist daher möglich Lese/Schreib- Konfilkte auf Bitzellen-Ebene zu lösen, was sich wiederum in einer sehr viel einfacheren Multiport- Registerbankarchitektur nieder- schlägt. Zusätzlich zu den Speicheransätzen haben wir ebenfalls zwei Flip-Flop-Architekturen vorgestellt. Die erste ist eine nichtflüchtige non-Shadow Flip-Flop-Architektur, welche die Speicherzelle als aktive Komponente nutzt. Dies ermöglicht das sofortige An- und Ausschalten der Versorgungss- pannung und ist daher besonders gut für aggressives Powergating geeignet. Alles in Allem zeigt der vorgestellte Flip-Flop-Entwurf eine ähnliche Timing-Charakteristik wie die konventioneller CMOS Flip-Flops auf. Jedoch erlaubt er zur selben Zeit eine signifikante Reduktion der statis- chen Leistungsaufnahme im Vergleich zu nichtflüchtigen Shadow- Flip-Flops. Die zweite ist eine fehlertolerante Flip-Flop-Architektur, welche sich unanfällig gegenüber diversen Defekten und Fehlern verhält. Die Leistungsfähigkeit aller vorgestellten Techniken wird durch ausführliche Simulationen auf Schaltkreisebene verdeutlicht, welche weiter durch detaillierte Evaluationen auf Systemebene untermauert werden. Im Allgemeinen konnten wir verschiedene Techniken en- twickeln, die erhebliche Verbesserungen in Bezug auf Performanz, Energie und Zuverlässigkeit von spintronischen on-Chip Speichern, wie Caches, Register und Flip-Flops erreichen

Investigating ferroelectric and metal-insulator phase transition devices for neuromorphic computing

Neuromorphic computing has been proposed to accelerate the computation for deep neural networks (DNNs). The objective of this thesis work is to investigate the ferroelectric and metal-insulator phase transition devices for neuromorphic computing. This thesis proposed and experimentally demonstrated the drain erase scheme in FeFET to enable the individual cell program/erase/inhibition for in-situ training in 3D NAND-like FeFET array. To achieve multi-level states for analog in-memory computing, the ferroelectric thin film needs to be partially switched. This thesis identified a new challenge of ferroelectric partial switching, namely “history effect” in minor loop dynamics. The experimental characterization of both FeCap and FeFET validated the history effect, suggesting that the intermediate states programming condition depends on the prior states that the device has gone through. A phase-field model was constructed to understand the origin. Such history effect was then modelled into the FeFET based neural network simulation and analyze its negative impact on the training accuracy and then propose a possible mitigation strategy. Apart from using FeFET as synaptic devices, using metal-insulator phase transition device, as neuron was also explored experimentally. A NbOx metal-insulator phase transition threshold switch was integrated at the edge of the crossbar array as an oscillation neuron. One promising application for FeFET+NbOx neuromorphic system is to implement quantum error correction (QEC) circuitry at 4K. Cryo-NeuroSim, a device-to-system modeling framework that calibrates data at cryogenic temperature was developed to benchmark the performance of the FeFET+NbOx neuromorphic system.Ph.D

Flash Memory Devices

Flash memory devices have represented a breakthrough in storage since their inception in the mid-1980s, and innovation is still ongoing. The peculiarity of such technology is an inherent flexibility in terms of performance and integration density according to the architecture devised for integration. The NOR Flash technology is still the workhorse of many code storage applications in the embedded world, ranging from microcontrollers for automotive environment to IoT smart devices. Their usage is also forecasted to be fundamental in emerging AI edge scenario. On the contrary, when massive data storage is required, NAND Flash memories are necessary to have in a system. You can find NAND Flash in USB sticks, cards, but most of all in Solid-State Drives (SSDs). Since SSDs are extremely demanding in terms of storage capacity, they fueled a new wave of innovation, namely the 3D architecture. Today “3D” means that multiple layers of memory cells are manufactured within the same piece of silicon, easily reaching a terabit capacity. So far, Flash architectures have always been based on "floating gate," where the information is stored by injecting electrons in a piece of polysilicon surrounded by oxide. On the contrary, emerging concepts are based on "charge trap" cells. In summary, flash memory devices represent the largest landscape of storage devices, and we expect more advancements in the coming years. This will require a lot of innovation in process technology, materials, circuit design, flash management algorithms, Error Correction Code and, finally, system co-design for new applications such as AI and security enforcement

High-Density Solid-State Memory Devices and Technologies

This Special Issue aims to examine high-density solid-state memory devices and technologies from various standpoints in an attempt to foster their continuous success in the future. Considering that broadening of the range of applications will likely offer different types of solid-state memories their chance in the spotlight, the Special Issue is not focused on a specific storage solution but rather embraces all the most relevant solid-state memory devices and technologies currently on stage. Even the subjects dealt with in this Special Issue are widespread, ranging from process and design issues/innovations to the experimental and theoretical analysis of the operation and from the performance and reliability of memory devices and arrays to the exploitation of solid-state memories to pursue new computing paradigms

Semiconductor Memory Applications in Radiation Environment, Hardware Security and Machine Learning System

abstract: Semiconductor memory is a key component of the computing systems. Beyond the conventional memory and data storage applications, in this dissertation, both mainstream and eNVM memory technologies are explored for radiation environment, hardware security system and machine learning applications. In the radiation environment, e.g. aerospace, the memory devices face different energetic particles. The strike of these energetic particles can generate electron-hole pairs (directly or indirectly) as they pass through the semiconductor device, resulting in photo-induced current, and may change the memory state. First, the trend of radiation effects of the mainstream memory technologies with technology node scaling is reviewed. Then, single event effects of the oxide based resistive switching random memory (RRAM), one of eNVM technologies, is investigated from the circuit-level to the system level. Physical Unclonable Function (PUF) has been widely investigated as a promising hardware security primitive, which employs the inherent randomness in a physical system (e.g. the intrinsic semiconductor manufacturing variability). In the dissertation, two RRAM-based PUF implementations are proposed for cryptographic key generation (weak PUF) and device authentication (strong PUF), respectively. The performance of the RRAM PUFs are evaluated with experiment and simulation. The impact of non-ideal circuit effects on the performance of the PUFs is also investigated and optimization strategies are proposed to solve the non-ideal effects. Besides, the security resistance against modeling and machine learning attacks is analyzed as well. Deep neural networks (DNNs) have shown remarkable improvements in various intelligent applications such as image classification, speech classification and object localization and detection. Increasing efforts have been devoted to develop hardware accelerators. In this dissertation, two types of compute-in-memory (CIM) based hardware accelerator designs with SRAM and eNVM technologies are proposed for two binary neural networks, i.e. hybrid BNN (HBNN) and XNOR-BNN, respectively, which are explored for the hardware resource-limited platforms, e.g. edge devices.. These designs feature with high the throughput, scalability, low latency and high energy efficiency. Finally, we have successfully taped-out and validated the proposed designs with SRAM technology in TSMC 65 nm. Overall, this dissertation paves the paths for memory technologies’ new applications towards the secure and energy-efficient artificial intelligence system.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Error Characterization and Correction Techniques for Reliable STT-RAM Designs

The concerns on the continuous scaling of mainstream memory technologies have motivated tremendous investment to emerging memories. Being a promising candidate, spin-transfer torque random access memory (STT-RAM) offers nanosecond access time comparable to SRAM, high integration density close to DRAM, non-volatility as Flash memory, and good scalability. It is well positioned as the replacement of SRAM and DRAM for on-chip cache and main memory applications. However, reliability issue continues being one of the major challenges in STT-RAM memory designs due to the process variations and unique thermal fluctuations, i.e., the stochastic resistance switching property of magnetic devices. In this dissertation, I decoupled the reliability issues as following three-folds: First, the characterization of STT-RAM operation errors often require expensive Monte-Carlo runs with hybrid magnetic-CMOS simulation steps, making it impracticable for architects and system designs; Second, the state of the art does not have sufficiently understanding on the unique reliability issue of STT-RAM, and conventional error correction codes (ECCs) cannot efficiently handle such errors; Third, while the information density of STT-RAM can be boosted by multi-level cell (MLC) design, the more prominent reliability concerns and the complicated access mechanism greatly limit its applications in memory subsystems. Thus, I present a novel through solution set to both characterize and tackle the above reliability challenges in STT-RAM designs. In the first part of the dissertation, I introduce a new characterization method that can accurately and efficiently capture the multi-variable design metrics of STT-RAM cells; Second, a novel ECC scheme, namely, content-dependent ECC (CD-ECC), is developed to combat the characterized asymmetric errors of STT-RAM at 0->1 and 1->0 bit flipping's; Third, I present a circuit-architecture design, namely state-restricted multi-level cell (SR-MLC) STT-RAM design, which simultaneously achieves high information density, good storage reliability and fast write speed, making MLC STT-RAM accessible for system designers under current technology node. Finally, I conclude that efficient robust (or ECC) designs for STT-RAM require a deep holistic understanding on three different levels-device, circuit and architecture. Innovative ECC schemes and their architectural applications, still deserve serious research and investigation in the near future

A Statistical STT-RAM Design View and Robust Designs at Scaled Technologies

Rapidly increased demands for memory in electronic industry and the significant technical scaling challenges of all conventional memory technologies motivated the researches on the next generation memory technology. As one promising candidate, spin-transfer torque random access memory (STT-RAM) features fast access time, high density, non-volatility, and good CMOS process compatibility. In recent years, many researches have been conducted to improve the storage density and enhance the scalability of STT-RAM, such as reducing the write current and switching time of magnetic tunneling junction (MTJ) devices. In parallel with these efforts, the continuous increasing of tunnel magneto-resistance(TMR) ratio of the MTJ inspires the development of multi-level cell (MLC) STT-RAM, which allows multiple data bits be stored in a single memory cell. Two types of MLC STT-RAM cells, namely, parallel MLC and series MLC, were also proposed. However, like all other nanoscale devices, the performance and reliability of STT-RAM cells are severely affected by process variations, intrinsic device operating uncertainties and environmental fluctuations. The storage margin of a MLC STT-RAM cell, i.e., the distinction between the lowest and highest resistance states, is partitioned into multiple segments for multi-level data representation. As a result, the performance and reliability of MLC STT-RAM cells become more sensitive to the MOS and MTJ device variations and the thermal-induced randomness of MTJ switching. In this work, we systematically analyze the impacts of CMOS and MTJ process variations, MTJ resistance switching randomness that induced by intrinsic thermal fluctuations, and working temperature changes on STT-RAM cell designs. The STT-RAM cell reliability issues in both read and write operations are first investigated. A combined circuit and magnetic simulation platform is then established to quantitatively study the persistent and non-persistent errors in STT-RAM cell operations. Then, we analyzed the extension of STT-RAM cell behaviors from SLC (single-level- cell) to MLC (multi-level- cell). On top of that, we also discuss the optimal device parameters of the MLC MTJ for the minimization of the operation error rate of the MLC STT-RAM cells from statistical design perspective. Our simulation results show that under the current available technology, series MLC STT-RAM demonstrates overwhelming benefits in the read and write reliability compared to parallel MLC STT-RAM and could potentially satisfy the requirement of commercial practices. Finally, with the detail analysis study of STT-RAM cells, we proposed several error reduction design, such as ADAMS structure, and FA-STT structure

Designs for increasing reliability while reducing energy and increasing lifetime

In the last decades, the computing technology experienced tremendous developments. For instance, transistors' feature size shrank to half at every two years as consistently from the first time Moore stated his law. Consequently, number of transistors and core count per chip doubles at each generation. Similarly, petascale systems that have the capability of processing more than one billion calculation per second have been developed. As a matter of fact, exascale systems are predicted to be available at year 2020. However, these developments in computer systems face a reliability wall. For instance, transistor feature sizes are getting so small that it becomes easier for high-energy particles to temporarily flip the state of a memory cell from 1-to-0 or 0-to-1. Also, even if we assume that fault-rate per transistor stays constant with scaling, the increase in total transistor and core count per chip will significantly increase the number of faults for future desktop and exascale systems. Moreover, circuit ageing is exacerbated due to increased manufacturing variability and thermal stresses, therefore, lifetime of processor structures are becoming shorter. On the other side, due to the limited power budget of the computer systems such that mobile devices, it is attractive to scale down the voltage. However, when the voltage level scales to beyond the safe margin especially to the ultra-low level, the error rate increases drastically. Nevertheless, new memory technologies such as NAND flashes present only limited amount of nominal lifetime, and when they exceed this lifetime, they can not guarantee storing of the data correctly leading to data retention problems. Due to these issues, reliability became a first-class design constraint for contemporary computing in addition to power and performance. Moreover, reliability even plays increasingly important role when computer systems process sensitive and life-critical information such as health records, financial information, power regulation, transportation, etc. In this thesis, we present several different reliability designs for detecting and correcting errors occurring in processor pipelines, L1 caches and non-volatile NAND flash memories due to various reasons. We design reliability solutions in order to serve three main purposes. Our first goal is to improve the reliability of computer systems by detecting and correcting random and non-predictable errors such as bit flips or ageing errors. Second, we aim to reduce the energy consumption of the computer systems by allowing them to operate reliably at ultra-low voltage level. Third, we target to increase the lifetime of new memory technologies by implementing efficient and low-cost reliability schemes