Thermal Characterization of Next-Generation Workloads on Heterogeneous MPSoCs

Next-generation High-Performance Computing (HPC) applications need to tackle outstanding computational complexity while meeting latency and Quality-of-Service constraints. Heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), equipped with a mix of general-purpose cores and reconfigurable fabric for custom acceleration of computational blocks, are key in providing the flexibility to meet the requirements of next-generation HPC. However, heterogeneity brings new challenges to efficient chip thermal management. In this context, accurate and fast thermal simulators are becoming crucial to understand and exploit the trade-offs brought by heterogeneous MPSoCs. In this paper, we first thermally characterize a next-generation HPC workload, the online video transcoding application, using a highly-accurate Infra-Red (IR) microscope. Second, we extend the 3D-ICE thermal simulation tool with a new generic heat spreader model capable of accurately reproducing package surface temperature, with an average error of 6.8% for the hot spots of the chip. Our model is used to characterize the thermal behaviour of the online transcoding application when running on a heterogeneous MPSoC. Moreover, by using our detailed thermal system characterization we are able to explore different application mappings as well as the thermal limits of such heterogeneous platforms

Caracterización y optimización térmica de sistemas en chip mediante emulación con FPGAs

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 15/06/2012Tablets and smartphones are some of the many intelligent devices that dominate the consumer electronics market. These systems are complex to design as they must execute multiple applications (e.g.: real-time video processing, 3D games, or wireless communications), while meeting additional design constraints, such as low energy consumption, reduced implementation size and, of course, a short time-to-market. Internally, they rely on Multi-processor Systems on Chip (MPSoCs) as their main processing cores, to meet the tight design constraints: performance, size, power consumption, etc. In a bad design, the high logic density may generate hotspots that compromise the chip reliability. This thesis introduces a FPGA-based emulation framework for easy exploration of SoC design alternatives. It provides fast and accurate estimations of performance, power, temperature, and reliability in one unified flow, to help designers tune their system architecture before going to silicon.El estado del arte, en lo que a diseño de chips para empotrados se refiere, se encuentra dominado por los multi-procesadores en chip, o MPSoCs. Son complejos de diseñar y presentan problemas de disipación de potencia, de temperatura, y de fiabilidad. En este contexto, esta tesis propone una nueva plataforma de emulación para facilitar la exploración del enorme espacio de diseño. La plataforma utiliza una FPGA de propósito general para acelerar la emulación, lo cual le da una ventaja competitiva frente a los simuladores arquitectónicos software, que son mucho más lentos. Los datos obtenidos de la ejecución en la FPGA son enviados a un PC que contiene bibliotecas (modelos) SW para calcular el comportamiento (e.g.: la temperatura, el rendimiento, etc...) que tendría el chip final. La parte experimental está enfocada a dos puntos: por un lado, a verificar que el sistema funciona correctamente y, por otro, a demostrar la utilidad del entorno para realizar exploraciones que muestren los efectos a largo plazo que suceden dentro del chip, como puede ser la evolución de la temperatura, que es un fenómeno lento que normalmente requiere de costosas simulaciones software.Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Self-adaptivity of applications on network on chip multiprocessors: the case of fault-tolerant Kahn process networks

Technology scaling accompanied with higher operating frequencies and the ability to integrate more functionality in the same chip has been the driving force behind delivering higher performance computing systems at lower costs. Embedded computing systems, which have been riding the same wave of success, have evolved into complex architectures encompassing a high number of cores interconnected by an on-chip network (usually identified as Multiprocessor System-on-Chip). However these trends are hindered by issues that arise as technology scaling continues towards deep submicron scales. Firstly, growing complexity of these systems and the variability introduced by process technologies make it ever harder to perform a thorough optimization of the system at design time. Secondly, designers are faced with a reliability wall that emerges as age-related degradation reduces the lifetime of transistors, and as the probability of defects escaping post-manufacturing testing is increased. In this thesis, we take on these challenges within the context of streaming applications running in network-on-chip based parallel (not necessarily homogeneous) systems-on-chip that adopt the no-remote memory access model. In particular, this thesis tackles two main problems: (1) fault-aware online task remapping, (2) application-level self-adaptation for quality management. For the former, by viewing fault tolerance as a self-adaptation aspect, we adopt a cross-layer approach that aims at graceful performance degradation by addressing permanent faults in processing elements mostly at system-level, in particular by exploiting redundancy available in multi-core platforms. We propose an optimal solution based on an integer linear programming formulation (suitable for design time adoption) as well as heuristic-based solutions to be used at run-time. We assess the impact of our approach on the lifetime reliability. We propose two recovery schemes based on a checkpoint-and-rollback and a rollforward technique. For the latter, we propose two variants of a monitor-controller- adapter loop that adapts application-level parameters to meet performance goals. We demonstrate not only that fault tolerance and self-adaptivity can be achieved in embedded platforms, but also that it can be done without incurring large overheads. In addressing these problems, we present techniques which have been realized (depending on their characteristics) in the form of a design tool, a run-time library or a hardware core to be added to the basic architecture

Side-Channel Protected MPSoC through Secure Real-Time Networks-on-Chip

The integration of Multi-Processors System-on-Chip (MPSoCs) into the Internet -of -Things (IoT) context brings new opportunities, but also represent risks. Tight real-time constraints and security requirements should be considered simultaneously when designing MPSoCs. Network-on-Chip (NoCs) are specially critical when meeting these two conflicting characteristics. For instance the NoC design has a huge influence in the security of the system. A vital threat to system security are so-called side-channel attacks based on the NoC communication observations. To this end, we propose a NoC security mechanism suitable for hard real-time systems, in which schedulability is a vital design requirement. We present three contributions. First, we show the impact of the NoC routing in the security of the system. Second, we propose a packet route randomisation mechanism to increase NoC resilience against side-channel attacks. Third, using an evolutionary optimisation approach, we effectively apply route randomisation while controlling its impact on hard real-time performance guarantees. Extensive experimental evidence based on analytical and simulation models supports our findings

Proceedings of the 5th International Workshop on Reconfigurable Communication-centric Systems on Chip 2010 - ReCoSoC\u2710 - May 17-19, 2010 Karlsruhe, Germany. (KIT Scientific Reports ; 7551)

ReCoSoC is intended to be a periodic annual meeting to expose and discuss gathered expertise as well as state of the art research around SoC related topics through plenary invited papers and posters. The workshop aims to provide a prospective view of tomorrow\u27s challenges in the multibillion transistor era, taking into account the emerging techniques and architectures exploring the synergy between flexible on-chip communication and system reconfigurability

Fuse-N: Framework for unified simulation environment for network-on-chip

Steady advancements in semiconductor technology over the past few decades have marked incipience of Multi-Processor System-on-Chip (MPSoCs). Owing to the inability of traditional bus-based communication system to scale well with improving microchip technologies, researchers have proposed Network-on-Chip (NoC) as the on-chip communication model. Current uni-processor centric modeling methodology does not address the new design challenges introduced by MPSoCs, thus calling for efficient simulation frameworks capable of capturing the interplay between the application, the architecture, and the network. Addressing these new challenges requires a framework that assists the designer at different abstraction levels of system design; This thesis concentrates on developing a framework for unified simulation environment for NoCs (fuse-N) which simplifies the design space exploration for NoCs by offering a comprehensive simulation support. The framework synthesizes the network infrastructure and the communication model and optimizes application mapping for design constraints. The proposed framework is a hardware-software co-design implementation using SystemC 2.1 and C++. Simulation results show the architectural, network and resource allocation behavior and highlight the quantitative relationships between various design choices; Also, a novel off-line non-preemptive static Traffic Aware Scheduling (TAS) policy is proposed for hard NoC platforms. The proposed scheduling policy maps the application onto the NoC architecture keeping track of the network traffic, which is generated with every resource and communication path allocation. TAS has been evaluated for various design metrics such as application completion time, resource utilization and task throughput. Simulation results show significant improvements over traditional approaches

Lifetime reliability of multi-core systems: modeling and applications.

Huang, Lin.Thesis (M.Phil.)--Chinese University of Hong Kong, 2011.Includes bibliographical references (leaves 218-232).Abstracts in English and Chinese.Abstract --- p.iAcknowledgement --- p.ivChapter 1 --- Introduction --- p.1Chapter 1.1 --- Preface --- p.1Chapter 1.2 --- Background --- p.5Chapter 1.3 --- Contributions --- p.6Chapter 1.3.1 --- Lifetime Reliability Modeling --- p.6Chapter 1.3.2 --- Simulation Framework --- p.7Chapter 1.3.3 --- Applications --- p.9Chapter 1.4 --- Thesis Outline --- p.10Chapter I --- Modeling --- p.12Chapter 2 --- Lifetime Reliability Modeling --- p.13Chapter 2.1 --- Notation --- p.13Chapter 2.2 --- Assumption --- p.16Chapter 2.3 --- Introduction --- p.16Chapter 2.4 --- Related Work --- p.19Chapter 2.5 --- System Model --- p.21Chapter 2.5.1 --- Reliability of A Surviving Component --- p.22Chapter 2.5.2 --- Reliability of a Hybrid k-out-of-n:G System --- p.26Chapter 2.6 --- Special Cases --- p.31Chapter 2.6.1 --- Case I: Gracefully Degrading System --- p.31Chapter 2.6.2 --- Case II: Standby Redundant System --- p.33Chapter 2.6.3 --- Case III: l-out-of-3:G System with --- p.34Chapter 2.7 --- Numerical Results --- p.37Chapter 2.7.1 --- Experimental Setup --- p.37Chapter 2.7.2 --- Experimental Results and Discussion --- p.40Chapter 2.8 --- Conclusion --- p.43Chapter 2.9 --- Appendix --- p.44Chapter II --- Simulation Framework --- p.47Chapter 3 --- AgeSim: A Simulation Framework --- p.48Chapter 3.1 --- Introduction --- p.48Chapter 3.2 --- Preliminaries and Motivation --- p.51Chapter 3.2.1 --- Prior Work on Lifetime Reliability Analysis of Processor- Based Systems --- p.51Chapter 3.2.2 --- Motivation of This Work --- p.53Chapter 3.3 --- The Proposed Framework --- p.54Chapter 3.4 --- Aging Rate Calculation --- p.57Chapter 3.4.1 --- Lifetime Reliability Calculation --- p.58Chapter 3.4.2 --- Aging Rate Extraction --- p.60Chapter 3.4.3 --- Discussion on Representative Workload --- p.63Chapter 3.4.4 --- Numerical Validation --- p.65Chapter 3.4.5 --- Miscellaneous --- p.66Chapter 3.5 --- Lifetime Reliability Model for MPSoCs with Redundancy --- p.68Chapter 3.6 --- Case Studies --- p.70Chapter 3.6.1 --- Dynamic Voltage and Frequency Scaling --- p.71Chapter 3.6.2 --- Burst Task Arrival --- p.75Chapter 3.6.3 --- Task Allocation on Multi-Core Processors --- p.77Chapter 3.6.4 --- Timeout Policy on Multi-Core Processors with Gracefully Degrading Redundancy --- p.78Chapter 3.7 --- Conclusion --- p.79Chapter 4 --- Evaluating Redundancy Schemes --- p.83Chapter 4.1 --- Introduction --- p.83Chapter 4.2 --- Preliminaries and Motivation --- p.85Chapter 4.2.1 --- Failure Mechanisms --- p.85Chapter 4.2.2 --- Related Work and Motivation --- p.86Chapter 4.3 --- Proposed Analytical Model for the Lifetime Reliability of Proces- sor Cores --- p.88Chapter 4.3.1 --- "Impact of Temperature, Voltage, and Frequency" --- p.88Chapter 4.3.2 --- Impact of Workloads --- p.92Chapter 4.4 --- Lifetime Reliability Analysis for Multi-core Processors with Vari- ous Redundancy Schemes --- p.95Chapter 4.4.1 --- Gracefully Degrading System (GDS) --- p.95Chapter 4.4.2 --- Processor Rotation System (PRS) --- p.97Chapter 4.4.3 --- Standby Redundant System (SRS) --- p.98Chapter 4.4.4 --- Extension to Heterogeneous System --- p.99Chapter 4.5 --- Experimental Methodology --- p.101Chapter 4.5.1 --- Workload Description --- p.102Chapter 4.5.2 --- Temperature Distribution Extraction --- p.102Chapter 4.5.3 --- Reliability Factors --- p.103Chapter 4.6 --- Results and Discussions --- p.103Chapter 4.6.1 --- Wear-out Rate Computation --- p.103Chapter 4.6.2 --- Comparison on Lifetime Reliability --- p.105Chapter 4.6.3 --- Comparison on Performance --- p.110Chapter 4.6.4 --- Comparison on Expected Computation Amount --- p.112Chapter 4.7 --- Conclusion --- p.118Chapter III --- Applications --- p.119Chapter 5 --- Task Allocation and Scheduling for MPSoCs --- p.120Chapter 5.1 --- Introduction --- p.120Chapter 5.2 --- Prior Work and Motivation --- p.122Chapter 5.2.1 --- IC Lifetime Reliability --- p.122Chapter 5.2.2 --- Task Allocation and Scheduling for MPSoC Designs --- p.124Chapter 5.3 --- Proposed Task Allocation and Scheduling Strategy --- p.126Chapter 5.3.1 --- Problem Definition --- p.126Chapter 5.3.2 --- Solution Representation --- p.128Chapter 5.3.3 --- Cost Function --- p.129Chapter 5.3.4 --- Simulated Annealing Process --- p.130Chapter 5.4 --- Lifetime Reliability Computation for MPSoC Embedded Systems --- p.133Chapter 5.5 --- Efficient MPSoC Lifetime Approximation --- p.138Chapter 5.5.1 --- Speedup Technique I - Multiple Periods --- p.139Chapter 5.5.2 --- Speedup Technique II - Steady Temperature --- p.139Chapter 5.5.3 --- Speedup Technique III - Temperature Pre- calculation --- p.140Chapter 5.5.4 --- Speedup Technique IV - Time Slot Quantity Control --- p.144Chapter 5.6 --- Experimental Results --- p.144Chapter 5.6.1 --- Experimental Setup --- p.144Chapter 5.6.2 --- Results and Discussion --- p.146Chapter 5.7 --- Conclusion and Future Work --- p.152Chapter 6 --- Energy-Efficient Task Allocation and Scheduling --- p.154Chapter 6.1 --- Introduction --- p.154Chapter 6.2 --- Preliminaries and Problem Formulation --- p.157Chapter 6.2.1 --- Related Work --- p.157Chapter 6.2.2 --- Problem Formulation --- p.159Chapter 6.3 --- Analytical Models --- p.160Chapter 6.3.1 --- Performance and Energy Models for DVS-Enabled Pro- cessors --- p.160Chapter 6.3.2 --- Lifetime Reliability Model --- p.163Chapter 6.4 --- Proposed Algorithm for Single-Mode Embedded Systems --- p.165Chapter 6.4.1 --- Task Allocation and Scheduling --- p.165Chapter 6.4.2 --- Voltage Assignment for DVS-Enabled Processors --- p.168Chapter 6.5 --- Proposed Algorithm for Multi-Mode Embedded Systems --- p.169Chapter 6.5.1 --- Feasible Solution Set --- p.169Chapter 6.5.2 --- Searching Procedure for a Single Mode --- p.171Chapter 6.5.3 --- Feasible Solution Set Identification --- p.171Chapter 6.5.4 --- Multi-Mode Combination --- p.177Chapter 6.6 --- Experimental Results --- p.178Chapter 6.6.1 --- Experimental Setup --- p.178Chapter 6.6.2 --- Case Study --- p.180Chapter 6.6.3 --- Sensitivity Analysis --- p.181Chapter 6.6.4 --- Extensive Results --- p.183Chapter 6.7 --- Conclusion --- p.185Chapter 7 --- Customer-Aware Task Allocation and Scheduling --- p.186Chapter 7.1 --- Introduction --- p.186Chapter 7.2 --- Prior Work and Problem Formulation --- p.188Chapter 7.2.1 --- Related Work and Motivation --- p.188Chapter 7.2.2 --- Problem Formulation --- p.191Chapter 7.3 --- Proposed Design-Stage Task Allocation and Scheduling --- p.192Chapter 7.3.1 --- Solution Representation and Moves --- p.193Chapter 7.3.2 --- Cost Function --- p.196Chapter 7.3.3 --- Impact of DVFS --- p.198Chapter 7.4 --- Proposed Algorithm for Online Adjustment --- p.200Chapter 7.4.1 --- Reliability Requirement for Online Adjustment --- p.201Chapter 7.4.2 --- Analytical Model --- p.203Chapter 7.4.3 --- Overall Flow --- p.204Chapter 7.5 --- Experimental Results --- p.205Chapter 7.5.1 --- Experimental Setup --- p.205Chapter 7.5.2 --- Results and Discussion --- p.207Chapter 7.6 --- Conclusion --- p.211Chapter 7.7 --- Appendix --- p.211Chapter 8 --- Conclusion and Future Work --- p.214Chapter 8.1 --- Conclusion --- p.214Chapter 8.2 --- Future Work --- p.215Bibliography --- p.23

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

CONTREX: Design of embedded mixed-criticality CONTRol systems under consideration of EXtra-functional properties

The increasing processing power of today’s HW/SW platforms leads to the integration of more and more functions in a single device. Additional design challenges arise when these functions share computing resources and belong to different criticality levels. CONTREX complements current activities in the area of predictable computing platforms and segregation mechanisms with techniques to consider the extra-functional properties, i.e., timing constraints, power, and temperature. CONTREX enables energy efficient and cost aware design through analysis and optimization of these properties with regard to application demands at different criticality levels. This article presents an overview of the CONTREX European project, its main innovative technology (extension of a model based design approach, functional and extra-functional analysis with executable models and run-time management) and the final results of three industrial use-cases from different domain (avionics, automotive and telecommunication).The work leading to these results has received funding from the European Community’s Seventh Framework Programme FP7/2007-2011 under grant agreement no. 611146