Placement for fast and reliable through-silicon-via (TSV) based 3D-IC layouts

The objective of this research is to explore the feasibility of addressing the major performance and reliability problems or issues, such as wirelength, stress-induced carrier mobility variation, temperature, and quality trade-offs, found in three-dimensional integrated circuits (3D ICs) that use through-silicon vias (TSVs) at placement stage. Four main works that support this goal are included. In the first work, wirelength of TSV-based 3D ICs is the main focus. In the second work, stress-induced carrier mobility variation in TSV-based 3D ICs is examined. In the third work, temperature inside TSV-based 3D ICs is investigated. In the final work, the quality trade-offs of TSV-based 3D-IC designs are explored. In the first work, a force-directed, 3D, and gate-level placement algorithm that efficiently handles TSVs is developed. The experiments based on synthesized benchmarks indicate that the developed algorithm helps generate GDSII layouts of 3D-IC designs that are optimized in terms of wirelength. In addition, the impact of TSVs on other physical aspects of 3D-IC designs is also studied by analyzing the GDSII layouts. In the second work, the model for carrier mobility variation caused by TSV and STI stresses is developed as well as the timing analysis flow considering the stresses. The impact of TSV and STI stresses on carrier mobility variation and performance of 3D ICs is studied. Furthermore, a TSV-stress-driven, force-directed, and 3D placement algorithm is developed. It exploits carrier mobility variation, caused by stress around TSVs after fabrication, to improve the timing and area objectives during placement. In addition, the impact of keep-out zone (KOZ) around TSVs on stress, carrier mobility variation, area, wirelength, and performance of 3D ICs is studied. In the third work, two temperature-aware global placement algorithms are developed. They exploit die-to-die thermal coupling in 3D ICs to improve temperature during placement. In addition, a framework used to evaluate the results from temperature-aware global placements is developed. The main component of the framework is a GDSII-level thermal analysis that considers all structures inside a TSV-based 3D IC while computing temperature. The developed placers are compared with several state-of-the-art placers published in recent literature. The experimental results indicate that the developed algorithms help improve the temperature of 3D ICs effectively. In the final work, three block-level design styles for TSV-based die-to-wafer bonded 3D ICs are discussed. Several 3D-IC layouts in the three styles are manually designed. The main difference among these layouts is the position of TSVs. Finally, the area, wirelength, timing, power, temperature, and mechanical stress of all layouts are compared to explore the trade-offs of layout quality.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Mukhopadhyay, Saibal; Committee Member: Swaminathan, Madhava

Managing Variability in VLSI Circuits.

Over the last two decades, Design for Manufacturing (DFM) has emerged as an essential field within the semiconductor industry. The main objective of DFM is to reduce and, if possible, eliminate variability in integrated circuits (ICs). Numerous techniques for managing variation have emerged throughout IC design: manufacturers design instruments with minute tolerances, process engineers calibrate and characterize a given process throughout its lifetime, and IC designers strive to model and characterize variability within their devices, libraries, and circuits. This dissertation focuses on the last of these three techniques and presents material relevant to managing variability within IC design. Since characterization and modeling are essential to the analysis and reduction of variation in modern-day designs, this dissertation begins by studying various correlation models used within Statistical Static Timing Analysis (SSTA). In the end, the study shows that using complex correlation models does not necessarily result in significant error reduction within SSTA, and that simple models (which only include die-to-die and random variation) can therefore be used to achieve similar accuracy with reduced overhead and run-time. Next, the variation models, themselves, are explored and a new critical dimension (CD) model is proposed which reduces standard deviation error in SSTA by ~3X. Finally, the focus changes from the timing analysis level and moves lower in the design hierarchy to the libraries and devices that comprise the backbone of IC design. The final three chapters study mechanical stress enhancement and discuss how to fully exploit the layout dependencies of mechanically stressed silicon. The first of these three chapters presents an optimization scheme that uses the layout dependencies of stress in conjunction with dual-threshold-voltage (Vth) assignment to decrease leakage power consumption by ~24%. Next, the second of the three chapters proposes a new standard cell library design methodology, called “STEEL.” STEEL provides average delay improvements of 11% over equivalent single-Vth implementations, while consuming 2.5X less leakage than the dual-Vth alternative. Finally, the stress enhanced studies (and this document) are concluded by a new optimization scheme that combines stress enhancement with gate length biasing to achieve 2.9X leakage power savings in IC designs without modifying Vth.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75947/1/btcline_1.pd

Thermal Management for Dependable On-Chip Systems

This thesis addresses the dependability issues in on-chip systems from a thermal perspective. This includes an explanation and analysis of models to show the relationship between dependability and tempature. Additionally, multiple novel methods for on-chip thermal management are introduced aiming to optimize thermal properties. Analysis of the methods is done through simulation and through infrared thermal camera measurements

A Holistic Solution for Reliability of 3D Parallel Systems

As device scaling slows down, emerging technologies such as 3D integration and carbon nanotube field-effect transistors are among the most promising solutions to increase device density and performance. These emerging technologies offer shorter interconnects, higher performance, and lower power. However, higher levels of operating temperatures and current densities project significantly higher failure rates. Moreover, due to the infancy of the manufacturing process, high variation, and defect densities, chip designers are not encouraged to consider these emerging technologies as a stand-alone replacement for Silicon-based transistors. The goal of this dissertation is to introduce new architectural and circuit techniques that can work around high-fault rates in the emerging 3D technologies, improving performance and reliability comparable to Silicon. We propose a new holistic approach to the reliability problem that addresses the necessary aspects of an effective solution such as detection, diagnosis, repair, and prevention synergically for a practical solution. By leveraging 3D fabric layouts, it proposes the underlying architecture to efficiently repair the system in the presence of faults. This thesis presents a fault detection scheme by re-executing instructions on idle identical units that distinguishes between transient and permanent faults while localizing it to the granularity of a pipeline stage. Furthermore, with the use of a dynamic and adaptive reconfiguration policy based on activity factors and temperature variation, we propose a framework that delivers a significant improvement in lifetime management to prevent faults due to aging. Finally, a design framework that can be used for large-scale chip production while mitigating yield and variation failures to bring up Carbon Nano Tube-based technology is presented. The proposed framework is capable of efficiently supporting high-variation technologies by providing protection against manufacturing defects at different granularities: module and pipeline-stage levels.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168118/1/javadb_1.pd

Performance and Safety Enhancement Strategies in Vehicle Dynamics and Ground Contact

Recent trends in vehicle engineering are testament to the great efforts that scientists and industries have made to seek solutions to enhance both the performance and safety of vehicular systems. This Special Issue aims to contribute to the study of modern vehicle dynamics, attracting recent experimental and in-simulation advances that are the basis for current technological growth and future mobility. The area involves research, studies, and projects derived from vehicle dynamics that aim to enhance vehicle performance in terms of handling, comfort, and adherence, and to examine safety optimization in the emerging contexts of smart, connected, and autonomous driving.This Special Issue focuses on new findings in the following topics:(1) Experimental and modelling activities that aim to investigate interaction phenomena from the macroscale, analyzing vehicle data, to the microscale, accounting for local contact mechanics; (2) Control strategies focused on vehicle performance enhancement, in terms of handling/grip, comfort and safety for passengers, motorsports, and future mobility scenarios; (3) Innovative technologies to improve the safety and performance of the vehicle and its subsystems; (4) Identification of vehicle and tire/wheel model parameters and status with innovative methodologies and algorithms; (5) Implementation of real-time software, logics, and models in onboard architectures and driving simulators; (6) Studies and analyses oriented toward the correlation among the factors affecting vehicle performance and safety; (7) Application use cases in road and off-road vehicles, e-bikes, motorcycles, buses, trucks, etc

Heterogeneous 2.5D integration on through silicon interposer

© 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry is looking for new technologies for manufacturing integrated circuits (ICs). In this quest, power consumed in transferring data over copper interconnects is a sizeable portion that needs to be addressed now and continuing over the next few decades. 2.5D Through-Si-Interposer (TSI) is a strong candidate to deliver improved performance while consuming lower power than in previous generations of servers/data centers and mobile devices. These low-power/high-performance advantages are realized through achievement of high interconnect densities on the TSI (higher than ever seen on Printed Circuit Boards (PCBs) or organic substrates), and enabling heterogeneous integration on the TSI platform where individual ICs are assembled at close proximity

Digital CMOS ISFET architectures and algorithmic methods for point-of-care diagnostics

Over the past decade, the surge of infectious diseases outbreaks across the globe is redefining how healthcare is provided and delivered to patients, with a clear trend towards distributed diagnosis at the Point-of-Care (PoC). In this context, Ion-Sensitive Field Effect Transistors (ISFETs) fabricated on standard CMOS technology have emerged as a promising solution to achieve a precise, deliverable and inexpensive platform that could be deployed worldwide to provide a rapid diagnosis of infectious diseases. This thesis presents advancements for the future of ISFET-based PoC diagnostic platforms, proposing and implementing a set of hardware and software methodologies to overcome its main challenges and enhance its sensing capabilities. The first part of this thesis focuses on novel hardware architectures that enable direct integration with computational capabilities while providing pixel programmability and adaptability required to overcome pressing challenges on ISFET-based PoC platforms. This section explores oscillator-based ISFET architectures, a set of sensing front-ends that encodes the chemical information on the duty cycle of a PWM signal. Two initial architectures are proposed and fabricated in AMS 0.35um, confirming multiple degrees of programmability and potential for multi-sensing. One of these architectures is optimised to create a dual-sensing pixel capable of sensing both temperature and chemical information on the same spatial point while modulating this information simultaneously on a single waveform. This dual-sensing capability, verified in silico using TSMC 0.18um process, is vital for DNA-based diagnosis where protocols such as LAMP or PCR require precise thermal control. The COVID-19 pandemic highlighted the need for a deliverable diagnosis that perform nucleic acid amplification tests at the PoC, requiring minimal footprint by integrating sensing and computational capabilities. In response to this challenge, a paradigm shift is proposed, advocating for integrating all elements of the portable diagnostic platform under a single piece of silicon, realising a ``Diagnosis-on-a-Chip". This approach is enabled by a novel Digital ISFET Pixel that integrates both ADC and memory with sensing elements on each pixel, enhancing its parallelism. Furthermore, this architecture removes the need for external instrumentation or memories and facilitates its integration with computational capabilities on-chip, such as the proposed ARM Cortex M3 system. These computational capabilities need to be complemented with software methods that enable sensing enhancement and new applications using ISFET arrays. The second part of this thesis is devoted to these methods. Leveraging the programmability capabilities available on oscillator-based architectures, various digital signal processing algorithms are implemented to overcome the most urgent ISFET non-idealities, such as trapped charge, drift and chemical noise. These methods enable fast trapped charge cancellation and enhanced dynamic range through real-time drift compensation, achieving over 36 hours of continuous monitoring without pixel saturation. Furthermore, the recent development of data-driven models and software methods open a wide range of opportunities for ISFET sensing and beyond. In the last section of this thesis, two examples of these opportunities are explored: the optimisation of image compression algorithms on chemical images generated by an ultra-high frame-rate ISFET array; and a proposed paradigm shift on surface Electromyography (sEMG) signals, moving from data-harvesting to information-focused sensing. These examples represent an initial step forward on a journey towards a new generation of miniaturised, precise and efficient sensors for PoC diagnostics.Open Acces

Vehicular Networks with Infrastructure: Modeling, Simulation and Testbed

This thesis focuses on Vehicular Networks with Infrastructure. In the examined scenarios, vehicular nodes (e.g., cars, buses) can communicate with infrastructure roadside units (RSUs) providing continuous or intermittent coverage of an urban road topology. Different aspects related to the design of new applications for Vehicular Networks are investigated through modeling, simulation and testing on real field. In particular, the thesis: i) provides a feasible multi-hop routing solution for maintaining connectivity among RSUs, forming the wireless mesh infrastructure, and moving vehicles; ii) explains how to combine the UHF and the traditional 5-GHz bands to design and implement a new high-capacity high-efficiency Content Downloading using disjoint control and service channels; iii) studies new RSUs deployment strategies for Content Dissemination and Downloading in urban and suburban scenarios with different vehicles mobility models and traffic densities; iv) defines an optimization problem to minimize the average travel delay perceived by the drivers, spreading different traffic flows over the surface roads in a urban scenario; v) exploits the concept of Nash equilibrium in the game-theory approach to efficiently guide electric vehicles drivers' towards the charging stations. Moreover, the thesis emphasizes the importance of using realistic mobility models, as well as reasonable signal propagation models for vehicular networks. Simplistic assumptions drive to trivial mathematical analysis and shorter simulations, but they frequently produce misleading results. Thus, testing the proposed solutions in the real field and collecting measurements is a good way to double-check the correctness of our studie