Scaling the bulk-driven MOSFET into deca-nanometer bulk CMOS technologies

The International Technology Roadmap for Semiconductors predicts that the nominal power supply voltage, VDD, will fall to 0.7 V by the end of the bulk CMOS era. At that time, it is expected that the long-channel threshold voltage of a MOSFET, VT0, will rise to 35.5% of VDD in order to maintain acceptable off-state leakage characteristics in digital systems. Given the recent push for system-on-a-chip integration, this increasing trend in VT0/VDD poses a serious threat to the future of analog design because it causes traditional analog circuit topologies to experience progressively problematic signal swing limitations in each new process generation. To combat the process-scaling-induced signal swing limitations of analog circuitry, researchers have proposed the use of bulk-driven MOSFETs. By using the bulk terminal as an input rather than the gate, the bulk-driven MOSFET makes it possible to extend the applicability of any analog cell to extremely low power supply voltages because VT0 does not appear in the device\u27s input signal path. Since the viability of the bulk-driven technique was first investigated in a 2 um p-well process, there have been numerous reports of low-voltage analog designs incorporating bulk-driven MOSFETs in the literature - most of which appear in technologies with feature sizes larger than 0.18 um. However, as of yet, no effort has been undertaken to understand how sub-micron process scaling trends have influenced the performance of a bulk-driven MOSFET, let alone make the device more adaptable to the deca-nanometer technologies widely used in the analog realm today. Thus, to further the field\u27s understanding of the bulk-driven MOSFET, this dissertation aims to examine the implications of scaling the device into a standard 90 nm bulk CMOS process. This dissertation also describes how the major disadvantages of a bulk-driven MOSFET - i.e., its reduced intrinsic gain, its limited frequency response and its large layout area requirement - can be mitigated through modifications to the device\u27s vertical doping profile and well structure. To gauge the potency of the proposed process changes, an optimized n-type bulk-driven MOSFET has been designed in a standard 90 nm bulk CMOS process via the 2-D device simulator, ATLAS

Development of a Portable CMOS Time-Domain Fluorescence Lifetime Imager

Modern laboratory equipments to measure the excited-state lifetime of fluorophores usually include an expensive picosecond pulsed-laser excitation source, a fragile photomultiplier tube, and a large instrument body for optics. A portable and robust device to make fluorescence lifetime measurement in nanosecond scale is of great attraction for chemists and biologists. This dissertation reports the development of a portable LED time-domain fluorimeter from an all-solid-state discrete-component prototype to its advanced CMOS integrated circuit implementation. The motivation of the research is to develop a multiplexed fluorimeter for point-of-care diagnosis. Instruments developed by this novel method have higher fill factor, are more portable, and are fabricated at lower cost

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

Design And Characterization Of Noveldevices For New Generation Of Electrostaticdischarge (esd) Protection Structures

The technology evolution and complexity of new circuit applications involve emerging reliability problems and even more sensitivity of integrated circuits (ICs) to electrostatic discharge (ESD)-induced damage. Regardless of the aggressive evolution in downscaling and subsequent improvement in applications\u27 performance, ICs still should comply with minimum standards of ESD robustness in order to be commercially viable. Although the topic of ESD has received attention industry-wide, the design of robust protection structures and circuits remains challenging because ESD failure mechanisms continue to become more acute and design windows less flexible. The sensitivity of smaller devices, along with a limited understanding of the ESD phenomena and the resulting empirical approach to solving the problem have yielded time consuming, costly and unpredictable design procedures. As turnaround design cycles in new technologies continue to decrease, the traditional trial-and-error design strategy is no longer acceptable, and better analysis capabilities and a systematic design approach are essential to accomplish the increasingly difficult task of adequate ESD protection-circuit design. This dissertation presents a comprehensive design methodology for implementing custom on-chip ESD protection structures in different commercial technologies. First, the ESD topic in the semiconductor industry is revised, as well as ESD standards and commonly used schemes to provide ESD protection in ICs. The general ESD protection approaches are illustrated and discussed using different types of protection components and the concept of the ESD design window. The problem of implementing and assessing ESD protection structures is addressed next, starting from the general discussion of two design methods. The first ESD design method follows an experimental approach, in which design requirements are obtained via fabrication, testing and failure analysis. The second method consists of the technology computer aided design (TCAD)-assisted ESD protection design. This method incorporates numerical simulations in different stages of the ESD design process, and thus results in a more predictable and systematic ESD development strategy. Physical models considered in the device simulation are discussed and subsequently utilized in different ESD designs along this study. The implementation of new custom ESD protection devices and a further integration strategy based on the concept of the high-holding, low-voltage-trigger, silicon controlled rectifier (SCR) (HH-LVTSCR) is demonstrated for implementing ESD solutions in commercial low-voltage digital and mixed-signal applications developed using complementary metal oxide semiconductor (CMOS) and bipolar CMOS (BiCMOS) technologies. This ESD protection concept proposed in this study is also successfully incorporated for implementing a tailored ESD protection solution for an emerging CMOS-based embedded MicroElectroMechanical (MEMS) sensor system-on-a-chip (SoC) technology. Circuit applications that are required to operate at relatively large input/output (I/O) voltage, above/below the VDD/VSS core circuit power supply, introduce further complications in the development and integration of ESD protection solutions. In these applications, the I/O operating voltage can extend over one order of magnitude larger than the safe operating voltage established in advanced technologies, while the IC is also required to comply with stringent ESD robustness requirements. A practical TCAD methodology based on a process- and device- simulation is demonstrated for assessment of the device physics, and subsequent design and implementation of custom P1N1-P2N2 and coupled P1N1-P2N2//N2P3-N3P1 silicon controlled rectifier (SCR)-type devices for ESD protection in different circuit applications, including those applications operating at I/O voltage considerably above/below the VDD/VSS. Results from the TCAD simulations are compared with measurements and used for developing technology- and circuit-adapted protection structures, capable of blocking large voltages and providing versatile dual-polarity symmetric/asymmetric S-type current-voltage characteristics for high ESD protection. The design guidelines introduced in this dissertation are used to optimize and extend the ESD protection capability in existing CMOS/BiCMOS technologies, by implementing smaller and more robust single- or dual-polarity ESD protection structures within the flexibility provided in the specific fabrication process. The ESD design methodologies and characteristics of the developed protection devices are demonstrated via ESD measurements obtained from fabricated stand-alone devices and on-chip ESD protections. The superior ESD protection performance of the devices developed in this study is also successfully verified in IC applications where the standard ESD protection approaches are not suitable to meet the stringent area constraint and performance requirement

Transport models and advanced numerical simulation of silicon-germanium heterojunction bipolar transistors

Applications in the emerging high-frequency markets for millimeter wave applications more and more use SiGe components for cost reasons. To support the technology effort, a reliable TCAD platform is required. The main issue in the simulation of scaled devices is related to the limitations of the physical models used to describe charge carrier transport. Inherent approximations in the HD formalism are discussed over different technology nodes, providing for the first time a complete survey of HD models capability and restrictions with scaling for simulation of SiGe HBTs. Moreover, a complete set of models for transport parameters of SiGe HBTs is reported, including low-field mobility, energy relaxation time, saturation velocity, high-field mobility and effective density of state. Implementation in a commercial device simulator is drawn and findings are compared with simulation results obtained using a standard set of models and with trustworthy results (i.e. MC and SHE simulation results and experimental data), validating proposed models and clarifying their reliability and accuracy over different technologies. Finally, electrical breakdown phenomena in SiGe HBTs are analyzed: a novel complete model for multiplication factor is reported and validated by experimental results; new M model provides an exhaustive accuracy over a wide range of collector voltages

Advanced CMOS Process for Submicron Silicon Carbide (SiC) Device

Silicon carbide (SiC) is a wide semiconductor material with superior material properties compared to other rival materials. Due to its fewer dislocation defects than gallium nitride and its ability to form native oxides, this material possesses an advantage among wide band gap materials. Despite having several superior properties its low voltage application is less explored. CMOS is extremely important in low voltage areas and silicon is the dominant player in it for the last 50 years where scaling has contributed a major role in this flourishment. The channel length of silicon devices has reached 3 nm whereas SiC is still in the micrometer (2 μm/ 1.2 μm) range. So, SiC technology is still in its infancy which can be compared with silicon technology in the mid-1980s range. When the SiC devices would enter into the sub-micron and deep submicron range, proper device design in those ranges is necessary to rip the benefit of scaling. In this thesis, the SiC CMOS process available from different institutes and foundries is discussed first to understand the current state of the art. Later, low-voltage conventional SiC NMOS devices in the submicron range (2 μm to 600 nm) are simulated and their key parameters and performances are analyzed. In the submicron range, one major issue in MOSFET scaling is hot carrier effects. Thus to minimize this effect, a low-doped drain (LDD) region is introduced in the conventional SiC design having a channel length of 800 nm and 600 nm. In comparison with conventional designs, LDD designs have shown better saturation current behavior, reduced threshold roll-off, reduced hot electron current density, minimized gate leakage, reduced body hole current, enhanced voltage handling capability, reduced electric field, and improved subthreshold behavior in SiC. In the end, spacer technology, dopants, doping methods, and LDD realization technique in SiC are discussed

Advanced CMOS Process for Submicron Silicon Carbide (SiC) Device

Silicon carbide (SiC) is a wide semiconductor material with superior material properties compared to other rival materials. Due to its fewer dislocation defects than gallium nitride and its ability to form native oxides, this material possesses an advantage among wide band gap materials. Despite having several superior properties its low voltage application is less explored. CMOS is extremely important in low voltage areas and silicon is the dominant player in it for the last 50 years where scaling has contributed a major role in this flourishment. The channel length of silicon devices has reached 3 nm whereas SiC is still in the micrometer (2 μm/ 1.2 μm) range. So, SiC technology is still in its infancy which can be compared with silicon technology in the mid-1980s range. When the SiC devices would enter into the sub-micron and deep submicron range, proper device design in those ranges is necessary to rip the benefit of scaling. In this thesis, the SiC CMOS process available from different institutes and foundries is discussed first to understand the current state of the art. Later, low-voltage conventional SiC NMOS devices in the submicron range (2 μm to 600 nm) are simulated and their key parameters and performances are analyzed. In the submicron range, one major issue in MOSFET scaling is hot carrier effects. Thus to minimize this effect, a low-doped drain (LDD) region is introduced in the conventional SiC design having a channel length of 800 nm and 600 nm. In comparison with conventional designs, LDD designs have shown better saturation current behavior, reduced threshold roll-off, reduced hot electron current density, minimized gate leakage, reduced body hole current, enhanced voltage handling capability, reduced electric field, and improved subthreshold behavior in SiC. In the end, spacer technology, dopants, doping methods, and LDD realization technique in SiC are discussed

높은 전류 구동능력을 가지는 SiGe 나노시트 구조의 터널링 전계효과 트랜지스터

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2021. 2. 박병국.The development of very-large-scale integration (VLSI) technology has continuously demanded smaller devices to achieve high integration density for faster computing speed or higher capacity. However, in the recent complementary-metal-oxide-semiconductor (CMOS) technology, simple downsizing the dimension of metal-oxide-semiconductor field-effect transistor (MOSFET) no longer guarantees the boosting performance of IC chips. In particular, static power consumption is not reduced while device size is decreasing because voltage scaling is slowed down at some point. The increased off-current due to short-channel effect (SCE) of MOSFET is a representative cause of the difficulty in voltage scaling. To overcome these fundamental limits of MOSFET, many researchers have been looking for the next generation of FET device over the last ten years. Tunnel field-effect transistor (TFET) has been intensively studied for its steep switching characteristics. Nevertheless, the poor current drivability of TFET is the most serious obstacle to become competitive device for MOSFET. In this thesis, TFET with high current drivability in which above-mentioned problem is significantly solved is proposed. Vertically-stacked SiGe nanosheet channels are used to boost carrier injection and gate control. The fabrication technique to form highly-condensed SiGe nanosheets is introduced. TFET is fabricated with MOSFET with the same structure in the CMOS-compatible process. Both technology-computer-aided-design (TCAD) simulation and experimental results are utilized to support and examine the advantages of proposed TFET. From the perspective of the single device, the improvement in switching characteristics and current drivability are quantitatively and qualitatively analyzed. In addition, the device performance is compared to the benchmark of previously reported TFET and co-fabricated MOSFET. Through those processes, the feasibility of SiGe nanosheet TFET is verified. It is revealed that the proposed SiGe nanosheet TFET has notable steeper switching and low leakage in the low drive voltage as an alternative to conventional MOSFET.초고밀도 집적회로 기술의 발전은 고집적도 달성을 통해 단위 칩의 연산 속도 및 용량 향상에 기여할 소형의 소자를 끊임없이 요구하고 있다. 하지만 최신의 상보형 금속-산화막-반도체 (CMOS) 기술에서 금속-산화막-반도체 전계 효과 트랜지스터 (MOSFET) 의 단순한 소형화는 더 이상 집적회로의 성능 향상을 보장해 주지 못하고 있다. 특히 소자의 크기가 줄어드는 반면 정적 전력 소모량은 전압 스케일링의 둔화로 인해 감소되지 않고 있는 상황이다. MOSFET의 짧은 채널 효과로 인해 증가된 누설 전류가 전압 스케일링의 어려움을 주는 대표적 원인으로 꼽힌다. 이러한 근본적인 MOSFET의 한계를 극복하기 위하여 지난 10여년간 새로운 단계의 전계 효과 트랜지스터 소자들이 연구되고 있다. 그 중 터널 전계 효과 트랜지스터(TFET)은 그 특유의 우수한 전원 특성으로 각광받아 집중적으로 연구되고 있다. 많은 연구에도 불구하고, TFET의 부족한 전류 구동 능력은 MOSFET의 대체재로 자리매김하는 데 가장 큰 문제점이 되고 있다. 본 학위논문에서는 상기된 문제점을 해결할 수 있는 우수한 전류 구동 능력을 가진 TFET이 제안되었다. 반송자 유입과 게이트 컨트롤을 향상시킬 수 있는 수직 적층된 실리콘저마늄(SiGe) 나노시트 채널이 사용되었다. 또한, 제안된 TFET은 CMOS 기반 공정을 활용하여 MOSFET과 함께 제작되었다. 테크놀로지 컴퓨터 지원 설계(TCAD) 시뮬레이션과 실제 측정 결과를 활용하여 제안된 소자의 우수성을 검증하였다. 단위 CMOS 소자의 관점에서, 전원 특성과 전류 구동 능력의 향상을 정량적, 정성적 방법으로 분석하였다. 그리고, 제작된 소자의 성능을 기존 제작 및 보고된 TFET 및 함께 제작된 MOSSFET과 비교하였다. 이러한 과정을 통해, 실리콘저마늄 나노시트 TFET의 활용 가능성이 입증되었다. 제안된 실리콘저마늄 나노시트 소자는 주목할 만한 전원 특성을 가졌고 저전압 구동 환경에서 한층 더 낮은 누설 전류를 가짐으로써 향후 MOSFET을 대체할만한 충분한 가능성을 보여주었다.Chapter 1 Introduction 1 1.1. Power Crisis of Conventional CMOS Technology 1 1.2. Tunnel Field-Effect Transistor (TFET) 6 1.3. Feasibility and Challenges of TFET 9 1.4. Scope of Thesis 11 Chapter 2 Device Characterization 13 2.1. SiGe Nanosheet TFET 13 2.2. Device Concept 15 2.3. Calibration Procedure for TCAD simulation 17 2.4. Device Verification with TCAD simulation 21 Chapter 3 Device Fabrication 31 3.1. Fabrication Process Flow 31 3.2. Key Processes for SiGe Nanosheet TFET 33 3.2.1. Key Process 1 : SiGe Nanosheet Formation 34 3.2.2. Key Process 2 : Source/Drain Implantation 41 3.2.3. Key Process 3 : High-κ/Metal gate Formation 43 Chapter 4 Results and Discussion 53 4.1. Measurement Results 53 4.2. Analysis of Device Characteristics 56 4.2.1. Improved Factors to Performance in SiGe Nanosheet TFET 56 4.2.2. Performance Comparison with SiGe Nanosheet MOSFET 62 4.3. Performance Evaluation through Benchmarks 64 4.4. Optimization Plan for SiGe nanosheet TFET 66 4.4.1. Improvement of Quality of Gate Dielectric 66 4.4.2. Optimization of Doping Junction at Source 67 Chapter 5 Conclusion 71 Bibliography 73 Abstract in Korean 81 List of Publications 83Docto