Variability and reliability analysis of carbon nanotube technology in the presence of manufacturing imperfections

In 1925, Lilienfeld patented the basic principle of field effect transistor (FET). Thirty-four years later, Kahng and Atalla invented the MOSFET. Since that time, it has become the most widely used type of transistor in Integrated Circuits (ICs) and then the most important device in the electronics industry. Progress in the field for at least the last 40 years has followed an exponential behavior in accordance with Moore¿s Law. That is, in order to achieve higher densities and performance at lower power consumption, MOS devices have been scaled down. But this aggressive scaling down of the physical dimensions of MOSFETs has required the introduction of a wide variety of innovative factors to ensure that they could still be properly manufactured. Transistors have expe- rienced an amazing journey in the last 10 years starting with strained channel CMOS transistors at 90nm, carrying on the introduction of the high-k/metal-gate silicon CMOS transistors at 45nm until the use of the multiple-gate transistor architectures at 22nm and at recently achieved 14nm technology node. But, what technology will be able to produce sub-10nm transistors? Different novel materials and devices are being investigated. As an extension and enhancement to current MOSFETs some promising devices are n-type III-V and p-type Germanium FETs, Nanowire and Tunnel FETs, Graphene FETs and Carbon Nanotube FETs. Also, non-conventional FETs and other charge-based information carrier devices and alternative information processing devices are being studied. This thesis is focused on carbon nanotube technology as a possible option for sub-10nm transistors. In recent years, carbon nanotubes (CNTs) have been attracting considerable attention in the field of nanotechnology. They are considered to be a promising substitute for silicon channel because of their small size, unusual geometry (1D structure), and extraordinary electronic properties, including excellent carrier mobility and quasi-ballistic transport. In the same way, carbon nanotube field-effect transistors (CNFETs) could be potential substitutes for MOSFETs. Ideal CNFETs (meaning all CNTs in the transistor behave as semiconductors, have the same diameter and doping level, and are aligned and well-positioned) are predicted to be 5x faster than silicon CMOS, while consuming the same power. However, nowadays CNFETs are also affected by manufacturing variability, and several significant challenges must be overcome before these benefits can be achieved. Certain CNFET manufacturing imperfections, such as CNT diameter and doping variations, mispositioned and misaligned CNTs, high metal-CNT contact resistance, the presence of metallic CNTs (m-CNTs), and CNT density variations, can affect CNFET performance and reliability and must be addressed. The main objective of this thesis is to analyze the impact of the current CNFET manufacturing challenges on multi-channel CNFET performance from the point of view of variability and reliability and at different levels, device and circuit level. Assuming that CNFETs are not ideal or non-homogeneous because of today CNFET manufacturing imperfections, we propose a methodology of analysis that based on a CNFET ideal compact model is able to simulate heterogeneous or non-ideal CNFETs; that is, transistors with different number of tubes that have different diameters, are not uniformly spaced, have different source/drain doping levels, and, most importantly, are made up not only of semiconducting CNTs but also metallic ones. This method will allow us to analyze how CNT-specific variations affect CNFET device characteristics and parameters and CNFET digital circuit performance. Furthermore, we also derive a CNFET failure model and propose an alternative technique based on fault-tolerant architectures to deal with the presence of m-CNTs, one of the main causes of failure in CNFET circuits

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

Accurate CMOS compact model and the corresponding circuit simulation in the presence of statistical variability and ageing

As CMOS scales down to sub-50 nm, it faces critical dimensions of charge and matter granularities, leading to the drastic increase of device parameter dispersion, named statistical variability, which is one of the main contemporary challenges for further downscaling and makes each device atomistically different leading to broad dispersion of their electrical characteristics. In addition, device reliability concerns gain inertia; among them Bias Temperature Instability (BTI) shortens device lifetime by trapping charges in defect states of the insulator or at the interface. The interplay between statistical variability and BTI results in more variations on device performance and thus greatly affect circuit performance. In turn design methodologies must evolve towards variability and reliability aware design. To do so statistical compact models including both the effects of statistical variability and BTI-induced ageing are required for the large-scale statistical circuit simulation of variability and reliability. In this study, the application of accurate compact models, that describe performance variation in the presence of both statistical variability and reliability at arbitrary BTI-induced ageing levels, to SRAM circuit simulation is described. Both SRAM cell stability and write performance are evaluated and it is seen that, due to the accurate description of device performance distributions provided by the compact models and the sensitivity of these SRAM performance metrics on device performance, the approach presented here is better suited to high-sigma statistical circuit analysis than conventional approaches based upon assumed Gaussian distributions. The approach is demonstrated using a 25 nm gate length bulk MOSFET whose performance variation is obtained from statistical TCAD simulation using the GSS simulator GARAND. The simulated performance data is then used directly as the target for BSIM4 compact model extraction that ensures device figures of merit are well resolved for each device in a statistical ensemble. The distribution of compact model parameters is then generalised into an algebraic form using Generalized Lambda Distribution (GLD) methods, so that a sufficiently large number of compact models can later be generated and interpolated at arbitrary ageing levels. Finally compact models generated in this way are used to evaluate SRAM write performance and stability under the influence of statistical variability and BTI-induced ageing

Filière technologique hybride InGaAs/SiGe pour applications CMOS

High-mobility channel materials such as indium-galium-arsenide (InGaAs) and silicon-germanium(SiGe) alloys are considered to be the leading candidates for replacing silicon (Si) in future lowpower complementary metal-oxide-semiconductor (CMOS) circuits. Numerous challenges haveto be tackled in order to turn the high-mobility CMOS concept into an industrial solution. Thisthesis addresses the majors challenges which are the integration of InGaAs on Si, the formationof high-quality gate stacks and self-aligned source and drain (S/D) regions, the optimizationof self-aligned transistors and the co-integration of InGaAs and SiGe into CMOS circuits. Allinvestigated possible solutions are proposed in the framework of very-large-scale integration requirements.Chapter 2 describes two different methods to integrate InGaAs on Si. Chapter 3 detailsthe developments of key process modules for the fabrication of self-aligned InGaAs metal-oxidesemiconductorfield-effect transistors (MOSFETs). Chapter 4 covers the realization of varioustypes of self-aligned MOSFETs towards the improvement of their performance. Finally, chapter5 demonstrates three different methods to make hybrid InGaAs/SiGe CMOS circuits.Les materiaux à forte mobilité comme l’InGaAs et le SiGe sont considérés comme des candidats potentiels pour remplacer le Si dans les circuits CMOS futurs. De nombreux défis doivent être surmontés pour transformer ce concept en réalité industrielle. Cette thèse couvre les principaux challenges que sont l’intégration de l’InGaAs sur Si, la formation d’oxydes de grille de qualité, la réalisation de régions source/drain auto-alignées de faible résistance, l’architecture des transistors ou encore la co-intégration de ces matériaux dans un procédé de fabrication CMOS.Les solutions envisagées sont proposées en gardant comme ligne directrice l’applicabilité des méthodes pour une production de grande envergure.Le chapitre 2 aborde l’intégration d’InGaAs sur Si par deux méthodes différentes. Le chapitre3 détaille le développement de modules spécifiques à la fabrication de transistors auto-alignés sur InGaAs. Le chapitre 4 couvre la réalisation de différents types de transistors auto-alignés sur InGaAs dans le but d’améliorer leurs performances. Enfin, le chapitre 5 présente trois méthodes différentes pour réaliser des circuits hybrides CMOS à base d’InGaAs et de SiGe

Sub-10nm Transistors for Low Power Computing: Tunnel FETs and Negative Capacitance FETs

One of the major roadblocks in the continued scaling of standard CMOS technology is its alarmingly high leakage power consumption. Although circuit and system level methods can be employed to reduce power, the fundamental limit in the overall energy efficiency of a system is still rooted in the MOSFET operating principle: an injection of thermally distributed carriers, which does not allow subthreshold swing (SS) lower than 60mV/dec at room temperature. Recently, a new class of steep-slope devices like Tunnel FETs (TFETs) and Negative-Capacitance FETs (NCFETs) have garnered intense interest due to their ability to surpass the 60mV/dec limit on SS at room temperature. The focus of this research is on the simulation and design of TFETs and NCFETs for ultra-low power logic and memory applications. Using full band quantum mechanical model within the Non-Equilibrium Greens Function (NEGF) formalism, source-underlapping has been proposed as an effective technique to lower the SS in GaSb-InAs TFETs. Band-tail states, associated with heavy source doping, are shown to significantly degrade the SS in TFETs from their ideal value. To solve this problem, undoped source GaSb-InAs TFET in an i-i-n configuration is proposed. A detailed circuit-to-system level evaluation is performed to investigate the circuit level metrics of the proposed devices. To demonstrate their potential in a memory application, a 4T gain cell (GC) is proposed, which utilizes the low-leakage and enhanced drain capacitance of TFETs to realize a robust and long retention time GC embedded-DRAMs. The device/circuit/system level evaluation of proposed TFETs demonstrates their potential for low power digital applications. The second part of the thesis focuses on the design space exploration of hysteresis-free Negative Capacitance FETs (NCFETs). A cross-architecture analysis using HfZrOx ferroelectric (FE-HZO) integrated on bulk MOSFET, fully-depleted SOI-FETs, and sub-10nm FinFETs shows that FDSOI and FinFET configurations greatly benefit the NCFET performance due to their undoped body and improved gate-control which enables better capacitance matching with the ferroelectric. A low voltage NC-FinFET operating down to 0.25V is predicted using ultra-thin 3nm FE-HZO. Next, we propose one-transistor ferroelectric NOR type (Fe-NOR) non-volatile memory based on HfZrOx ferroelectric FETs (FeFETs). The enhanced drain-channel coupling in ultrashort channel FeFETs is utilized to dynamically modulate memory window of storage cells thereby resulting in simple erase-, program-and read-operations. The simulation analysis predicts sub-1V program/erase voltages in the proposed Fe-NOR memory array and therefore presents a significantly lower power alternative to conventional FeRAM and NOR flash memories

ランダム・テレグラフ・ノイズの微細MOSFETへの影響に関する研究

筑波大学 (University of Tsukuba)201

Phase Noise Analyses and Measurements in the Hybrid Memristor-CMOS Phase-Locked Loop Design and Devices Beyond Bulk CMOS

Phase-locked loop (PLLs) has been widely used in analog or mixed-signal integrated circuits. Since there is an increasing market for low noise and high speed devices, PLLs are being employed in communications. In this dissertation, we investigated phase noise, tuning range, jitter, and power performances in different architectures of PLL designs. More energy efficient devices such as memristor, graphene, transition metal di-chalcogenide (TMDC) materials and their respective transistors are introduced in the design phase-locked loop. Subsequently, we modeled phase noise of a CMOS phase-locked loop from the superposition of noises from its building blocks which comprises of a voltage-controlled oscillator, loop filter, frequency divider, phase-frequency detector, and the auxiliary input reference clock. Similarly, a linear time-invariant model that has additive noise sources in frequency domain is used to analyze the phase noise. The modeled phase noise results are further compared with the corresponding phase-locked loop designs in different n-well CMOS processes. With the scaling of CMOS technology and the increase of the electrical field, the problem of short channel effects (SCE) has become dominant, which causes decay in subthreshold slope (SS) and positive and negative shifts in the threshold voltages of nMOS and pMOS transistors, respectively. Various devices are proposed to continue extending Moore\u27s law and the roadmap in semiconductor industry. We employed tunnel field effect transistor owing to its better performance in terms of SS, leakage current, power consumption etc. Applying an appropriate bias voltage to the gate-source region of TFET causes the valence band to align with the conduction band and injecting the charge carriers. Similarly, under reverse bias, the two bands are misaligned and there is no injection of carriers. We implemented graphene TFET and MoS2 in PLL design and the results show improvements in phase noise, jitter, tuning range, and frequency of operation. In addition, the power consumption is greatly reduced due to the low supply voltage of tunnel field effect transistor

Compact DC Modeling of Tunnel-FETs

En l'última dècada, el transistor d'efecte de camp amb efecte túnel (TFET) ha guanyat molt interès i es maneja com un possible successor de la tecnologia MOSFET convencional. El transport de càrrega en un TFET es basa en el mecanisme de túnel de banda a banda (B2B) i, per tant, el pendent sub-llindar a temperatura ambient pot superar el límit de 60 mV / dec. Per descriure i analitzar el comportament del TFET en les simulacions de circuits, aquesta dissertació introdueix un model compacte de CC per TFET de doble comporta. L'enfocament de modelatge considera l'efecte túnel B2B amb l'efecte parasitari del corrent túnel assistida per trampes (TAT) en l'estat ON i ambipolar del TFET. Inclou un paquet d'equacions compactes per al potencial 2D per descriure el diagrama de banda del TFET. Basat en el diagrama de banda, el B2B i el corrent TAT es deriven per separat. Per fer-ho, primer es troba una expressió compacta per la llargada túnel, que després s'utilitza juntament amb un enfocament numèric robust de tipus Wentzel-Kramers-Brillouin (WKB) per calcular la probabilitat túnel. Després, usant l'equació de túnel de Landauer, la taxa de generació túnel es calcula i s'aproxima per arribar a una expressió de forma tancada per a la densitat de corrent. Amb una aproximació addicional de la densitat de corrent utilitzant una funció matemàtica, s'aconsegueixen expressions compactes per al túnel B2B resultant i el corrent TAT. La verificació del model es realitza amb l'ajuda de les dades de simulació TCAD Sentaurus per diverses configuracions de simulació. A més, la validesa del model es demostra mitjançant mesuraments de TFET complementaris fabricats. Per demostrar l'estabilitat numèrica i la continuïtat, així com la flexibilitat, es realitzen i analitzen simulacions de circuits lògics basats en TFET com un inversor d'una sola etapa o una cel·la SRAM. La combinació del model CC amb un model TFET AC permet una simulació transitòria d'un oscil·lador en anell de 11 etapes.En la última década, el transistor de efecto de campo con efecto túnel (TFET) ha ganado mucho interés y se maneja como un posible sucesor de la tecnología MOSFET convencional. El transporte de carga en un TFET se basa en el mecanismo de túnel de banda a banda (B2B) y, por lo tanto, la pendiente sub-umbral a temperatura ambiente puede superar el límite de 60 mV / dec. Para describir y analizar el comportamiento del TFET en las simulaciones de circuitos, esta disertación introduce un modelo compacto de CC para TFET de doble compuerta. El enfoque de modelado considera el efecto túnel B2B con el efecto parasitario de la corriente túnel asistida por trampas (TAT) en el estado ON y AMBIPOLAR del TFET. Incluye un paquete de ecuaciones compactas del potencial 2D para describir el diagrama de banda del TFET. Basado en el diagrama de banda, el B2B y la corriente TAT se derivan por separado. Para hacerlo, primero se encuentra una expresión compacta para la longitud túnel, que luego se utiliza junto con un enfoque numérico robusto de tipo Wentzel-Kramers-Brillouin (WKB) para calcular la probabilidad túnel. Luego, usando la ecuación de túnel de Landauer, la tasa de generación túnel se calcula y aproxima para llegar a una expresión de forma cerrada para la densidad de corriente. Con una aproximación adicional de la densidad de corriente por una función matemática, se logran expresiones compactas para el túnel B2B resultante y la corriente TAT. La verificación del modelo se realiza con la ayuda de los datos de simulación TCAD Sentaurus para varias configuraciones de simulación. Además, la validez del modelo se demuestra mediante mediciones de TFET complementarios fabricados. Para demostrar la estabilidad numérica y la continuidad, así como la flexibilidad, se realizan y analizan simulaciones de circuitos lógicos basados en TFET como un inversor de una sola etapa o una celda SRAM. La combinación del modelo CC con un modelo TFET AC permite una simulación transitoria de un oscilador en anillo de 11 etapas.In the last decade, the tunnel field-effect transistor (TFET) has gained a lot of interest and is handled as a possible successor of the conventional MOSFET technology. The current transport of a TFET is based on the band-to-band (B2B) tunneling mechanism and therefore, the subthreshold slope at room temperature can overcome the limit of 60 mV/dec. In order to describe and analyze the TFET behavior in circuit simulations, this dissertation introduces a compact DC model for double-gate TFETs. The modeling approach considers the B2B tunneling and the parasitic effect of trap-assisted tunneling (TAT) in the ON- and AMBIPOLAR-state of the TFET. It includes a 2D compact potential equation package to de-scribe the band diagram of the TFET. Based on the band diagram, the B2B tunneling and TAT current part are derived separately. In order to do so, firstly a compact expression for the tunneling length is found, which is then used together with a numerical robust Wentzel-Kramers-Brillouin (WKB) approach to calculate the tunneling probability. Afterwards, using Landauer’s tunneling equation, the tunneling generation rate is calculated and approximated to come to a closed-form expression for the current density. Further approximation of the current density by a mathematical function, compact expressions for the resulting B2B tun-neling and TAT current are achieved. The verification of the model is done with the help of TCAD Sentaurus simulation data for various simulation setups. Furthermore, the validity of the model is proven by measurements of fabricated complementary TFETs. In order to demonstrate the numerical stability and continuity as well as the flexibility, simulations of TFET-based logic circuits like a single-stage inverter or an SRAM cell are performed and analyzed. The combination of the DC model with an TFET AC model allows for a transient simulation of an 11-stage ring oscillator

Compact DC Modeling of Tunnel-FETs

En l'última dècada, el transistor d'efecte de camp amb efecte túnel (TFET) ha guanyat molt interès i es maneja com un possible successor de la tecnologia MOSFET convencional. El transport de càrrega en un TFET es basa en el mecanisme de túnel de banda a banda (B2B) i, per tant, el pendent sub-llindar a temperatura ambient pot superar el límit de 60 mV / dec. Per descriure i analitzar el comportament del TFET en les simulacions de circuits, aquesta dissertació introdueix un model compacte de CC per TFET de doble comporta. L'enfocament de modelatge considera l'efecte túnel B2B amb l'efecte parasitari del corrent túnel assistida per trampes (TAT) en l'estat ON i ambipolar del TFET. Inclou un paquet d'equacions compactes per al potencial 2D per descriure el diagrama de banda del TFET. Basat en el diagrama de banda, el B2B i el corrent TAT es deriven per separat. Per fer-ho, primer es troba una expressió compacta per la llargada túnel, que després s'utilitza juntament amb un enfocament numèric robust de tipus Wentzel-Kramers-Brillouin (WKB) per calcular la probabilitat túnel. Després, usant l'equació de túnel de Landauer, la taxa de generació túnel es calcula i s'aproxima per arribar a una expressió de forma tancada per a la densitat de corrent. Amb una aproximació addicional de la densitat de corrent utilitzant una funció matemàtica, s'aconsegueixen expressions compactes per al túnel B2B resultant i el corrent TAT. La verificació del model es realitza amb l'ajuda de les dades de simulació TCAD Sentaurus per diverses configuracions de simulació. A més, la validesa del model es demostra mitjançant mesuraments de TFET complementaris fabricats. Per demostrar l'estabilitat numèrica i la continuïtat, així com la flexibilitat, es realitzen i analitzen simulacions de circuits lògics basats en TFET com un inversor d'una sola etapa o una cel·la SRAM. La combinació del model CC amb un model TFET AC permet una simulació transitòria d'un oscil·lador en anell de 11 etapes.En la última década, el transistor de efecto de campo con efecto túnel (TFET) ha ganado mucho interés y se maneja como un posible sucesor de la tecnología MOSFET convencional. El transporte de carga en un TFET se basa en el mecanismo de túnel de banda a banda (B2B) y, por lo tanto, la pendiente sub-umbral a temperatura ambiente puede superar el límite de 60 mV / dec. Para describir y analizar el comportamiento del TFET en las simulaciones de circuitos, esta disertación introduce un modelo compacto de CC para TFET de doble compuerta. El enfoque de modelado considera el efecto túnel B2B con el efecto parasitario de la corriente túnel asistida por trampas (TAT) en el estado ON y AMBIPOLAR del TFET. Incluye un paquete de ecuaciones compactas del potencial 2D para describir el diagrama de banda del TFET. Basado en el diagrama de banda, el B2B y la corriente TAT se derivan por separado. Para hacerlo, primero se encuentra una expresión compacta para la longitud túnel, que luego se utiliza junto con un enfoque numérico robusto de tipo Wentzel-Kramers-Brillouin (WKB) para calcular la probabilidad túnel. Luego, usando la ecuación de túnel de Landauer, la tasa de generación túnel se calcula y aproxima para llegar a una expresión de forma cerrada para la densidad de corriente. Con una aproximación adicional de la densidad de corriente por una función matemática, se logran expresiones compactas para el túnel B2B resultante y la corriente TAT. La verificación del modelo se realiza con la ayuda de los datos de simulación TCAD Sentaurus para varias configuraciones de simulación. Además, la validez del modelo se demuestra mediante mediciones de TFET complementarios fabricados. Para demostrar la estabilidad numérica y la continuidad, así como la flexibilidad, se realizan y analizan simulaciones de circuitos lógicos basados en TFET como un inversor de una sola etapa o una celda SRAM. La combinación del modelo CC con un modelo TFET AC permite una simulación transitoria de un oscilador en anillo de 11 etapas.In the last decade, the tunnel field-effect transistor (TFET) has gained a lot of interest and is handled as a possible successor of the conventional MOSFET technology. The current transport of a TFET is based on the band-to-band (B2B) tunneling mechanism and therefore, the subthreshold slope at room temperature can overcome the limit of 60 mV/dec. In order to describe and analyze the TFET behavior in circuit simulations, this dissertation introduces a compact DC model for double-gate TFETs. The modeling approach considers the B2B tunneling and the parasitic effect of trap-assisted tunneling (TAT) in the ON- and AMBIPOLAR-state of the TFET. It includes a 2D compact potential equation package to de-scribe the band diagram of the TFET. Based on the band diagram, the B2B tunneling and TAT current part are derived separately. In order to do so, firstly a compact expression for the tunneling length is found, which is then used together with a numerical robust Wentzel-Kramers-Brillouin (WKB) approach to calculate the tunneling probability. Afterwards, using Landauer’s tunneling equation, the tunneling generation rate is calculated and approximated to come to a closed-form expression for the current density. Further approximation of the current density by a mathematical function, compact expressions for the resulting B2B tun-neling and TAT current are achieved. The verification of the model is done with the help of TCAD Sentaurus simulation data for various simulation setups. Furthermore, the validity of the model is proven by measurements of fabricated complementary TFETs. In order to demonstrate the numerical stability and continuity as well as the flexibility, simulations of TFET-based logic circuits like a single-stage inverter or an SRAM cell are performed and analyzed. The combination of the DC model with an TFET AC model allows for a transient simulation of an 11-stage ring oscillator