MIDAS: Automated Approach to Design Microwave Integrated Inductors and Transformers on Silicon

The design of modern radiofrequency integrated circuits on silicon operating at microwave and millimeter-waves requires the integration of several spiral inductors and transformers that are not commonly available in the process design-kits of the technologies. In this work we present an auxiliary CAD tool for Microwave Inductor (and transformer) Design Automation on Silicon (MIDAS) that exploits commercial simulators and allows the implementation of an automatic design flow, including three-dimensional layout editing and electromagnetic simulations. In detail, MIDAS allows the designer to derive a preliminary sizing of the inductor (transformer) on the bases of the design entries (specifications). It draws the inductor (transformer) layers for the specific process design kit, including vias and underpasses, with or without patterned ground shield, and launches the electromagnetic simulations, achieving effective design automation with respect to the traditional design flow for RFICs. With the present software suite the complete design time is reduced significantly (typically 1 hour on a PC based on Intel® Pentium® Dual 1.80GHz CPU with 2-GB RAM). Afterwards both the device equivalent circuit and the layout are ready to be imported in the Cadence environment

Electromechanical Lifting Actuation of a MEMS Cantilever and Nano-Scale Analysis of Diffusion in Semiconductor Device Dielectrics

This dissertation presents experimental and theoretical studies of physical phenomena in micro- and nano-electronic devices. Firstly, a novel and unproven means of electromechanical actuation in a micro-electro-mechanical system (MEMS) cantilever was investigated. In nearly all MEMS devices, electric forces cause suspended components to move toward the substrate. I demonstrated a design with the unusual and potentially very useful property of having a suspended MEMS cantilever lift away from the substrate. The effect was observed by optical micro-videography, by electrical sensing, and it was quantified by optical interferometry. The results agree with predictions of analytic and numerical calculations. One potential application is infrared sensing in which absorbed radiation changes the temperature of the cantilever, changing the duty cycle of an electrically-driven, repetitively closing micro-relay. Secondly, ultra-thin high-k gate dielectric layers in two 22 nm technology node semiconductor devices were studied. The purpose of the investigation was to characterize the morphology and composition of these layers as a means to verify whether the transmission electron microscope (TEM) with energy dispersive spectroscopy (EDS) could sufficiently resolve the atomic diffusion at such small length scales. Results of analytic and Monte-Carlo numerical calculations were compared to empirical data to validate the ongoing viability of TEM EDS as a tool for nanoscale characterization of semiconductor devices in an era where transistor dimensions will soon be less than 10 nm

A CAD-oriented modeling approach of frequency-dependent behavior of substrate noise coupling for mixed-signal IC design

A simple, efficient CAD-oriented equivalent circuit modeling approach of frequency-dependent behavior of substrate noise coupling is presented. It is shown that the substrate exhibits significant frequency-dependent characteristics for high frequency applications using epitaxial layers on a highly doped substrate. Using the proposed modeling approach, circuit topographies consisting of only ideal lumped circuit elements can be synthesized to accurately represent the frequency response using y-parameters. The proposed model is well-suited for use in standard circuit simulators. The extracted model is shown to be in good agreement with rigorous 3D device simulation results. 1

Development of suspended thermoreflectance technique and its application in thermal property measurement of semiconductor materials

Doctor of PhilosophyDepartment of Mechanical and Nuclear EngineeringGurpreet SinghThis dissertation details the development of a new scientific tool for the thermal characterization of freestanding micro/nano-scale materials, with specific application to thin films. The tool consists of a custom-designed and calibrated opto-electric system with superior spatial and temporal resolutions in thermal measurement. The tool, termed as Suspended ThermoReflectance (STR), can successfully perform thermal mappings at the submicron level and is able to produce unconstrained thermal conductivity unlike other optical measurement techniques where independent conductivity measurement is not possible due to their reliance on heat capacity. STR works by changing the temperature of a material and collecting the associated change in light reflection from multiple points on the sample surface. The reflection is a function of the material being tested, the wavelength of the probe light and the composition of the specimen for transparent and quasi-transparent materials. Coupling the change in reflection, along the sample’s length, with the knowledge of heat conduction allows for the determination of the thermal properties of interest. A thermal analytical model is developed and incorporated with optical equations to characterize the conductivity of thin films. The analytical model is compared with a finite element model to check its applicability in the STR experiment and data analysis. Ultimately, thermal conductivity of 2 µm and 3 µm thick Si samples were determined using STR at a temperature range of 20K – 350K and compared to literature as a validation of the technique. The system was automated using a novel LabView-based program. This program allowed the user to control the equipment including electronics, optics and optical cryostat. Moreover, data acquisition and real-time monitoring of the system are also accomplished through this computer application. A description of the development, fabrication and characterization of the freestanding thin films is detailed in this dissertation. For the most part, the thin films were fabricated using standard microfabrication techniques. However, different dry and wet etching techniques were compared for minimum surface roughness to reduce light scattering. The best etching technique was used to trim the Si films for the desired thicknesses. Besides, vapor HF was used to avoid stiction-failure during the release of suspended films

Development of novel procedures for the preservation of archaeological irons and mural paintings

281 p.El objetivo principal de la tesis es desarrollar metodologías innovadoras para caracterizar y conservar el patrimonio cultural. Siguiendo un enfoque interdisciplinar, el desarrollo de dichas tecnologías responde a la necesidad de minimizar/controlar algunos de los procesos de degradación detectados durante el estudio analítico de dos diferentes tipologías de patrimonio; restos arqueológicos de naturaleza metálica y pinturas murales. En ambos casos, el protocolo analítico empleado consta de 3 fases distintas. En primera estancia, se ha realizado una evaluación química in situ mediante el uso complementario de técnicas analíticas no destructivas (XRF, LIBS, FTIR y Raman). Posteriormente, se aplicaron instrumentación de laboratorio (Raman, FTIR, XRD y SEM) y técnicas de cuantificación de sales solubles (cromatografía iónica, ICP-MS) para el estudio de micro-muestras con el fin de esclarecer los principales procesos de degradación. Basándose en el conocimiento adquirido en las dos primeras fases fue finalmente llevado a cabo el desarrollo de nuevos métodos y protocolos de conservación.En el caso de las piezas metálicas se ha desarrollado un nuevo método para semi-cuantificar las fases de hierro que más comunmente afectan a los hierros arqueológicos. Además, se ha optimizado la capacidad extractiva del método de desalinización (baño de NaOH) más empleado para la conservación de hierros afectados por infiltración de cloruros. En el caso de las pinturas murales, ha sido evaluado el posible uso de aceites esenciales como productos ecológico para inhibir el crecimiento de patinas biológicas.Este trabajo subraya el rol de la química analítica como herramienta indispensable para el desarrollo de metodologías innovadoras que faciliten la comprensión y el tratamiento de las patologías del patrimonio cultural

Flow detectors having mechanical oscillators, and use thereof in flow characterization systems

An improved system (100), resonator flow detector (102) and method for characterizing a fluid sample that includes o injecting a fluid sample into a mobile phase of a flow characterization system (106), and detecting a property of the fluid sample > or of a component thereof with a flow detector (102) comprising a mechanical resonator (120), preferably one that is operated at a frequency less than about 1 MHz, such as tuning fork resonator

Analysis of the high frequency substrate noise effects on LC-VCOs

La integració de transceptors per comunicacions de radiofreqüència en CMOS pot quedar seriosament limitada per la interacció entre els seus blocs, arribant a desaconsellar la utilització de un únic dau de silici. El soroll d’alta freqüència generat per certs blocs, com l’amplificador de potencia, pot viatjar pel substrat i amenaçar el correcte funcionament de l’oscil·lador local. Trobem tres raons importants que mostren aquest risc d’interacció entre blocs i que justifiquen la necessitat d’un estudi profund per minimitzar-lo. Les característiques del substrat fan que el soroll d’alta freqüència es propagui m’és fàcilment que el de baixa freqüència. Per altra banda, les estructures de protecció perden eficiència a mesura que la freqüència augmenta. Finalment, el soroll d’alta freqüència que arriba a l’oscil·lador degrada al seu correcte comportament. El propòsit d’aquesta tesis és analitzar en profunditat la interacció entre el soroll d’alta freqüència que es propaga pel substrat i l’oscil·lador amb l’objectiu de poder predir, mitjançant un model, l’efecte que aquest soroll pot tenir sobre el correcte funcionament de l’oscil·lador. Es volen proporcionar diverses guies i normes a seguir que permeti als dissenyadors augmentar la robustesa dels oscil·ladors al soroll d’alta freqüència que viatja pel substrat. La investigació de l’efecte del soroll de substrat en oscil·ladors s’ha iniciat des d’un punt de vista empíric, per una banda, analitzant la propagació de senyals a través del substrat i avaluant l’eficiència d’estructures per bloquejar aquesta propagació, i per altra, determinant l’efecte d’un to present en el substrat en un oscil·lador. Aquesta investigació ha mostrat que la injecció d’un to d’alta freqüència en el substrat es pot propagar fins arribar a l’oscil·lador i que, a causa del ’pulling’ de freqüència, pot modular en freqüència la sortida de l’oscil·lador. A partir dels resultats de l’anàlisi empíric s’ha aportat un model matemàtic que permet predir l’efecte del soroll en l’oscil·lador. Aquest model té el principal avantatge en el fet de que està basat en paràmetres físics de l’oscil·lador o del soroll, permetent determinar les mesures que un dissenyador pot prendre per augmentar la robustesa de l’oscil·lador així com les conseqüències que aquestes mesures tenen sobre el seu funcionament global (trade-offs). El model ha estat comparat tant amb simulacions com amb mesures reals demostrant ser molt precís a l’hora de predir l’efecte del soroll de substrat. La utilitat del model com a eina de disseny s’ha demostrat en dos estudis. Primerament, les conclusions del model han estat aplicades en el procés de disseny d’un oscil·lador d’ultra baix consum a 2.5GHz, aconseguint un oscil·lador robust al soroll de substrat d’alta freqüència i amb característiques totalment compatibles amb els principals estàndards de comunicació en aquesta banda. Finalment, el model s’ha utilitzat com a eina d’anàlisi per avaluar la causa de les diferències, en termes de robustesa a soroll de substrat, mesurades en dos oscil·ladors a 60GHz amb dues diferents estratègies d’apantallament de l’inductor del tanc de ressonant, flotant en un cas i connectat a terra en l’altre. El model ha mostrat que les diferències en robustesa són causades per la millora en el factor de qualitat i en l’amplitud d’oscil·lació i no per un augment en l’aïllament entre tanc i substrat. Per altra banda, el model ha demostrat ser vàlid i molt precís inclús en aquest rang de freqüència tan extrem. el principal avantatge en el fet de que està basat en paràmetres físics de l’oscil·lador o del soroll, permetent determinar les mesures que un dissenyador pot prendre per augmentar la robustesa de l’oscil·lador així com les conseqüències que aquestes mesures tenen sobre el seu funcionament global (trade-offs). El model ha estat comparat tant amb simulacions com amb mesures reals demostrant ser molt precís a l’hora de predir l’efecte del soroll de substrat. La utilitat del model com a eina de disseny s’ha demostrat en dos estudis. Primerament, les conclusions del model han estat aplicades en el procés de disseny d’un oscil·lador d’ultra baix consum a 2.5GHz, aconseguint un oscil·lador robust al soroll de substrat d’alta freqüència i amb característiques totalment compatibles amb els principals estàndards de comunicació en aquesta banda. Finalment, el model s’ha utilitzat com a eina d’anàlisi per avaluar la causa de les diferències, en termes de robustesa a soroll de substrat, mesurades en dos oscil·ladors a 60GHz amb dues diferents estratègies d’apantallament de l’inductor del tanc de ressonant, flotant en un cas i connectat a terra en l’altre. El model ha mostrat que les diferències en robustesa són causades per la millora en el factor de qualitat i en l’amplitud d’oscil·lació i no per un augment en l’aïllament entre tanc i substrat. Per altra banda, el model ha demostrat ser vàlid i molt precís inclús en aquest rang de freqüència tan extrem.The integration of transceivers for RF communication in CMOS can be seriously limited by the interaction between their blocks, even advising against using a single silicon die. The high frequency noise generated by some of the blocks, like the power amplifier, can travel through the substrate, reaching the local oscillator and threatening its correct performance. Three important reasons can be stated that show the risk of the single die integration. Noise propagation is easier the higher the frequency. Moreover, the protection structures lose efficiency as the noise frequency increases. Finally, the high frequency noise that reaches the local oscillator degrades its performance. The purpose of this thesis is to deeply analyze the interaction between the high frequency substrate noise and the oscillator with the objective of being able to predict, thanks to a model, the effect that this noise may have over the correct behavior of the oscillator. We want to provide some guidelines to the designers to allow them to increase the robustness of the oscillator to high frequency substrate noise. The investigation of the effect of the high frequency substrate noise on oscillators has started from an empirical point of view, on one hand, analyzing the noise propagation through the substrate and evaluating the efficiency of some structures to block this propagation, and on the other hand, determining the effect on an oscillator of a high frequency noise tone present in the substrate. This investigation has shown that the injection of a high frequency tone in the substrate can reach the oscillator and, due to a frequency pulling effect, it can modulate in frequency the output of the oscillator. Based on the results obtained during the empirical analysis, a mathematical model to predict the effect of the substrate noise on the oscillator has been provided. The main advantage of this model is the fact that it is based on physical parameters of the oscillator and of the noise, allowing to determine the measures that a designer can take to increase the robustness of the oscillator as well as the consequences (trade-offs) that these measures have over its global performance. This model has been compared against both, simulations and real measurements, showing a very high accuracy to predict the effect of the high frequency substrate noise. The usefulness of the presented model as a design tool has been demonstrated in two case studies. Firstly, the conclusions obtained from the model have been applied in the design of an ultra low power consumption 2.5 GHz oscillator robust to the high frequency substrate noise with characteristics which make it compatible with the main communication standards in this frequency band. Finally, the model has been used as an analysis tool to evaluate the cause of the differences, in terms of performance degradation due to substrate noise, measured in two 60 GHz oscillators with two different tank inductor shielding strategies, floating and grounded. The model has determined that the robustness differences are caused by the improvement in the tank quality factor and in the oscillation amplitude and no by an increased isolation between the tank and the substrate. The model has shown to be valid and very accurate even in these extreme frequency range.Postprint (published version