30th International Conference on Condition Monitoring and Diagnostic Engineering Management (COMADEM 2017)

Proceedings of COMADEM 201

Algorithms and methodologies for interconnect reliability analysis of integrated circuits

The phenomenal progress of computing devices has been largely made possible by the sustained efforts of semiconductor industry in innovating techniques for extremely large-scale integration. Indeed, gigantically integrated circuits today contain multi-billion interconnects which enable the transistors to talk to each other -all in a space of few mm2. Such aggressively downscaled components (transistors and interconnects) silently suffer from increasing electric fields and impurities/defects during manufacturing. Compounded by the Gigahertz switching, the challenges of reliability and design integrity remains very much alive for chip designers, with Electro migration (EM) being the foremost interconnect reliability challenge. Traditionally, EM containment revolves around EM guidelines, generated at single-component level, whose non-compliance means that the component fails. Failure usually refers to deformation due to EM -manifested in form of resistance increase, which is unacceptable from circuit performance point of view. Subsequent aspects deal with correct-by-construct design of the chip followed by the signoff-verification of EM reliability. Interestingly, chip designs today have reached a dilemma point of reduced margin between the actual and reliably allowed current densities, versus, comparatively scarce system-failures. Consequently, this research is focused on improved algorithms and methodologies for interconnect reliability analysis enabling accurate and design-specific interpretation of EM events. In the first part, we present a new methodology for logic-IP (cell) internal EM verification: an inadequately attended area in the literature. Our SPICE-correlated model helps in evaluating the cell lifetime under any arbitrary reliability speciation, without generating additional data - unlike the traditional approaches. The model is apt for today's fab less eco-system, where there is a) increasing reuse of standard cells optimized for one market condition to another (e.g., wireless to automotive), as well as b) increasing 3rd party content on the chip requiring a rigorous sign-off. We present results from a 28nm production setup, demonstrating significant violations relaxation and flexibility to allow runtime level reliability retargeting. Subsequently, we focus on an important aspect of connecting the individual component-level failures to that of the system failure. We note that existing EM methodologies are based on serial reliability assumption, which deems the entire system to fail as soon as the first component in the system fails. With a highly redundant circuit topology, that of a clock grid, in perspective, we present algorithms for EM assessment, which allow us to incorporate and quantify the benefit from system redundancies. With the skew metric of clock-grid as a failure criterion, we demonstrate that unless such incorporations are done, chip lifetimes are underestimated by over 2x. This component-to-system reliability bridge is further extended through an extreme order statistics based approach, wherein, we demonstrate that system failures can be approximated by an asymptotic kth-component failure model, otherwise requiring costly Monte Carlo simulations. Using such approach, we can efficiently predict a system-criterion based time to failure within existing EDA frameworks. The last part of the research is related to incorporating the impact of global/local process variation on current densities as well as fundamental physical factors on EM. Through Hermite polynomial chaos based approach, we arrive at novel variations-aware current density models, which demonstrate significant margins (> 30 %) in EM lifetime when compared with the traditional worst case approach. The above research problems have been motivated by the decade-long work experience of the author dealing with reliability issues in industrial SoCs, first at Texas Instruments and later at Qualcomm.L'espectacular progrés dels dispositius de càlcul ha estat possible en gran part als esforços de la indústria dels semiconductors en proposar tècniques innovadores per circuits d'una alta escala d'integració. Els circuits integrats contenen milers de milions d'interconnexions que permeten connectar transistors dins d'un espai de pocs mm2. Tots aquests components estan afectats per camps elèctrics, impureses i defectes durant la seva fabricació. Degut a l’activitat a nivell de Gigahertzs, la fiabilitat i integritat són reptes importants pels dissenyadors de xips, on la Electromigració (EM) és un dels problemes més importants. Tradicionalment, el control de la EM ha girat entorn a directrius a nivell de component. L'incompliment d’alguna de les directrius implica un alt risc de falla. Per falla s'entén la degradació deguda a la EM, que es manifesta en forma d'augment de la resistència, la qual cosa és inacceptable des del punt de vista del rendiment del circuit. Altres aspectes tenen a veure amb la correcta construcció del xip i la verificació de fiabilitat abans d’enviar el xip a fabricar. Avui en dia, el disseny s’enfronta a dilemes importants a l’hora de definir els marges de fiabilitat dels xips. És un compromís entre eficiència i fiabilitat. La recerca en aquesta tesi se centra en la proposta d’algorismes i metodologies per a l'anàlisi de la fiabilitat d'interconnexió que permeten una interpretació precisa i específica d'esdeveniments d'EM. A la primera part de la tesi es presenta una nova metodologia pel disseny correcte-per-construcció i verificació d’EM a l’interior de les cel·les lògiques. Es presenta un model SPICE correlat que ajuda a avaluar el temps de vida de les cel·les segons qualsevol especificació arbitrària de fiabilitat i sense generar cap dada addicional, al contrari del que fan altres tècniques. El model és apte per l'ecosistema d'empreses de disseny quan hi ha a) una reutilització creixent de cel·les estàndard optimitzades per unes condicions de mercat i utilitzades en un altre (p.ex. de wireless a automoció), o b) la utilització de components del xip provinents de terceres parts i que necessiten una verificació rigorosa. Es presenten resultats en una tecnologia de 28nm, demostrant relaxacions significatives de les regles de fiabilitat i flexibilitat per permetre la reavaluació de la fiabilitat en temps d'execució. A continuació, el treball tracta un aspecte important sobre la relació entre les falles dels components i les falles del sistema. S'observa que les tècniques existents es basen en la suposició de fiabilitat en sèrie, que porta el sistema a fallar tant aviat hi ha un component que falla. Pensant en topologies redundants, com la de les graelles de rellotge, es proposen algorismes per l'anàlisi d'EM que permeten quantificar els beneficis de la redundància en el sistema. Utilitzant com a mètrica l’esbiaixi del senyal de rellotge, es demostra que la vida dels xips pot arribar a ser infravalorada per un factor de 2x. Aquest pont de fiabilitat entre component i sistema es perfecciona a través d'una tècnica basada en estadístics d'ordre extrem on es demostra que les falles poden ser aproximades amb un model asimptòtic de fallada de l'ièssim component, evitant així simulacions de Monte Carlo costoses. Amb aquesta tècnica, es pot predir eficientment el temps de fallada a nivell de sistema utilitzant eines industrials. La darrera part de la recerca està relacionada amb avaluar l'impacte de les variacions de procés en les densitats de corrent i factors físics de la EM. Mitjançant una tècnica basada en polinomis d'Hermite s'han obtingut uns nous models de densitat de corrent que mostren millores importants (>30%) en l'estimació de la vida del sistema comprades amb les tècniques basades en el cas pitjor. La recerca d'aquesta tesi ha estat motivada pel treball de l'autor durant més d'una dècada tractant temes de fiabilitat en sistemes, primer a Texas Instruments i després a Qualcomm.Postprint (published version

Exploiting task-based programming models for resilience

Hardware errors become more common as silicon technologies shrink and become more vulnerable, especially in memory cells, which are the most exposed to errors. Permanent and intermittent faults are caused by manufacturing variability and circuits ageing. While these can be mitigated once they are identified, their continuous rate of appearance throughout the lifetime of memory devices will always cause unexpected errors. In addition, transient faults are caused by effects such as radiation or small voltage/frequency margins, and there is no efficient way to shield against these events. Other constraints related to the diminishing sizes of transistors, such as power consumption and memory latency have caused the microprocessor industry to turn to increasingly complex processor architectures. To solve the difficulties arising from programming such architectures, programming models have emerged that rely on runtime systems. These systems form a new intermediate layer on the hardware-software abstraction stack, that performs tasks such as distributing work across computing resources: processor cores, accelerators, etc. These runtime systems dispose of a lot of information, both from the hardware and the applications, and offer thus many possibilities for optimisations. This thesis proposes solutions to the increasing fault rates in memory, across multiple resilience disciplines, from algorithm-based fault tolerance to hardware error correcting codes, through OS reliability strategies. These solutions rely for their efficiency on the opportunities presented by runtime systems. The first contribution of this thesis is an algorithmic-based resilience technique, allowing to tolerate detected errors in memory. This technique allows to recover data that is lost by performing computations that rely on simple redundancy relations identified in the program. The recovery is demonstrated for a family of iterative solvers, the Krylov subspace methods, and evaluated for the conjugate gradient solver. The runtime can transparently overlap the recovery with the computations of the algorithm, which allows to mask the already low overheads of this technique. The second part of this thesis proposes a metric to characterise the impact of faults in memory, which outperforms state-of-the-art metrics in precision and assurances on the error rate. This metric reveals a key insight into data that is not relevant to the program, and we propose an OS-level strategy to ignore errors in such data, by delaying the reporting of detected errors. This allows to reduce failure rates of running programs, by ignoring errors that have no impact. The architectural-level contribution of this thesis is a dynamically adaptable Error Correcting Code (ECC) scheme, that can increase protection of memory regions where the impact of errors is highest. A runtime methodology is presented to estimate the fault rate at runtime using our metric, through performance monitoring tools of current commodity processors. Guiding the dynamic ECC scheme online using the methodology's vulnerability estimates allows to decrease error rates of programs at a fraction of the redundancy cost required for a uniformly stronger ECC. This provides a useful and wide range of trade-offs between redundancy and error rates. The work presented in this thesis demonstrates that runtime systems allow to make the most of redundancy stored in memory, to help tackle increasing error rates in DRAM. This exploited redundancy can be an inherent part of algorithms that allows to tolerate higher fault rates, or in the form of dead data stored in memory. Redundancy can also be added to a program, in the form of ECC. In all cases, the runtime allows to decrease failure rates efficiently, by diminishing recovery costs, identifying redundant data, or targeting critical data. It is thus a very valuable tool for the future computing systems, as it can perform optimisations across different layers of abstractions.Los errores en memoria se vuelven más comunes a medida que las tecnologías de silicio reducen su tamaño. La variabilidad de fabricación y el envejecimiento de los circuitos causan fallos permanentes e intermitentes. Aunque se pueden mitigar una vez identificados, su continua tasa de aparición siempre causa errores inesperados. Además, la memoria también sufre de fallos transitorios contra los cuales no se puede proteger eficientemente. Estos fallos están causados por efectos como la radiación o los reducidos márgenes de voltaje y frecuencia. Otras restricciones coetáneas, como el consumo de energía y la latencia de la memoria, obligaron a las arquitecturas de computadores a volverse cada vez más complejas. Para programar tales procesadores, se desarrollaron modelos de programación basados en entornos de ejecución. Estos sistemas forman una nueva abstracción entre hardware y software, realizando tareas como la distribución del trabajo entre recursos informáticos: núcleos de procesadores, aceleradores, etc. Estos entornos de ejecución disponen de mucha información tanto sobre el hardware como sobre las aplicaciones, y ofrecen así muchas posibilidades de optimización. Esta tesis propone soluciones a los fallos en memoria entre múltiples disciplinas de resiliencia, desde la tolerancia a fallos basada en algoritmos, hasta los códigos de corrección de errores en hardware, incluyendo estrategias de resiliencia del sistema operativo. La eficiencia de estas soluciones depende de las oportunidades que presentan los entornos de ejecución. La primera contribución de esta tesis es una técnica a nivel algorítmico que permite corregir fallos encontrados mientras el programa su ejecuta. Para corregir fallos se han identificado redundancias simples en los datos del programa para toda una clase de algoritmos, los métodos del subespacio de Krylov (gradiente conjugado, GMRES, etc). La estrategia de recuperación de datos desarrollada permite corregir errores sin tener que reinicializar el algoritmo, y aprovecha el modelo de programación para superponer las computaciones del algoritmo y de la recuperación de datos. La segunda parte de esta tesis propone una métrica para caracterizar el impacto de los fallos en la memoria. Esta métrica supera en precisión a las métricas de vanguardia y permite identificar datos que son menos relevantes para el programa. Se propone una estrategia a nivel del sistema operativo retrasando la notificación de los errores detectados, que permite ignorar fallos en estos datos y reducir la tasa de fracaso del programa. Por último, la contribución a nivel arquitectónico de esta tesis es un esquema de Código de Corrección de Errores (ECC por sus siglas en inglés) adaptable dinámicamente. Este esquema puede aumentar la protección de las regiones de memoria donde el impacto de los errores es mayor. Se presenta una metodología para estimar el riesgo de fallo en tiempo de ejecución utilizando nuestra métrica, a través de las herramientas de monitorización del rendimiento disponibles en los procesadores actuales. El esquema de ECC guiado dinámicamente con estas estimaciones de vulnerabilidad permite disminuir la tasa de fracaso de los programas a una fracción del coste de redundancia requerido para un ECC uniformemente más fuerte. El trabajo presentado en esta tesis demuestra que los entornos de ejecución permiten aprovechar al máximo la redundancia contenida en la memoria, para contener el aumento de los errores en ella. Esta redundancia explotada puede ser una parte inherente de los algoritmos que permite tolerar más fallos, en forma de datos inutilizados almacenados en la memoria, o agregada a la memoria de un programa en forma de ECC. En todos los casos, el entorno de ejecución permite disminuir los efectos de los fallos de manera eficiente, disminuyendo los costes de recuperación, identificando datos redundantes, o focalizando esfuerzos de protección en los datos críticos.Postprint (published version

Reliable Software for Unreliable Hardware - A Cross-Layer Approach

A novel cross-layer reliability analysis, modeling, and optimization approach is proposed in this thesis that leverages multiple layers in the system design abstraction (i.e. hardware, compiler, system software, and application program) to exploit the available reliability enhancing potential at each system layer and to exchange this information across multiple system layers

Methodologies for Accelerated Analysis of the Reliability and the Energy Efficiency Levels of Modern Microprocessor Architectures

Η εξέλιξη της τεχνολογίας ημιαγωγών, της αρχιτεκτονικής υπολογιστών και της σχεδίασης οδηγεί σε αύξηση της απόδοσης των σύγχρονων μικροεπεξεργαστών, η οποία επίσης συνοδεύεται από αύξηση της ευπάθειας των προϊόντων. Οι σχεδιαστές εφαρμόζουν διάφορες τεχνικές κατά τη διάρκεια της ζωής των ολοκληρωμένων κυκλωμάτων με σκοπό να διασφαλίσουν τα υψηλά επίπεδα αξιοπιστίας των παραγόμενων προϊόντων και να τα προστατέψουν από διάφορες κατηγορίες σφαλμάτων διασφαλίζοντας την ορθή λειτουργία τους. Αυτή η διδακτορική διατριβή προτείνει καινούριες μεθόδους για να διασφαλίσει τα υψηλά επίπεδα αξιοπιστίας και ενεργειακής απόδοσης των σύγχρονων μικροεπεξεργαστών οι οποίες μπορούν να εφαρμοστούν κατά τη διάρκεια του πρώιμου σχεδιαστικού σταδίου, του σταδίου παραγωγής ή του σταδίου της κυκλοφορίας των ολοκληρωμένων κυκλωμάτων στην αγορά. Οι συνεισφορές αυτής της διατριβής μπορούν να ομαδοποιηθούν στις ακόλουθες δύο κατηγορίες σύμφωνα με το στάδιο της ζωής των μικροεπεξεργαστών στο οποίο εφαρμόζονται: • Πρώιμο σχεδιαστικό στάδιο: Η στατιστική εισαγωγή σφαλμάτων σε δομές που είναι μοντελοποιημένες σε προσομοιωτές οι οποίοι στοχεύουν στην μελέτη της απόδοσης είναι μια επιστημονικά καθιερωμένη μέθοδος για την ακριβή μέτρηση της αξιοπιστίας, αλλά υστερεί στον αργό χρόνο εκτέλεσης. Σε αυτή τη διατριβή, αρχικά παρουσιάζουμε ένα νέο πλήρως αυτοματοποιημένο εργαλείο εισαγωγής σφαλμάτων σε μικροαρχιτεκτονικό επίπεδο που στοχεύει στην ακριβή αξιολόγηση της αξιοπιστίας ενός μεγάλου πλήθους μονάδων υλικού σε σχέση με διάφορα μοντέλα σφαλμάτων (παροδικά, διακοπτόμενα, μόνιμα σφάλματα). Στη συνέχεια, χρησιμοποιώντας το ίδιο εργαλείο και στοχεύοντας τα παροδικά σφάλματα, παρουσιάζουμε διάφορες μελέτες σχετιζόμενες με την αξιοπιστία και την απόδοση, οι οποίες μπορούν να βοηθήσουν τις σχεδιαστικές αποφάσεις στα πρώιμα στάδια της ζωής των επεξεργαστών. Τελικά, προτείνουμε δύο μεθοδολογίες για να επιταχύνουμε τα μαζικά πειράματα στατιστικής εισαγωγής σφαλμάτων. Στην πρώτη, επιταχύνουμε τα πειράματα έπειτα από την πραγματική εισαγωγή των σφαλμάτων στις δομές του υλικού. Στη δεύτερη, επιταχύνουμε ακόμη περισσότερο τα πειράματα προτείνοντας τη μεθοδολογία με όνομα MeRLiN, η οποία βασίζεται στη μείωση της αρχικής λίστας σφαλμάτων μέσω της ομαδοποίησής τους σε ισοδύναμες ομάδες έπειτα από κατηγοριοποίηση σύμφωνα με την εντολή που τελικά προσπελαύνει τη δομή που φέρει το σφάλμα. • Παραγωγικό στάδιο και στάδιο κυκλοφορίας στην αγορά: Οι συνεισφορές αυτής της διδακτορικής διατριβής σε αυτά τα στάδια της ζωής των μικροεπεξεργαστών καλύπτουν δύο σημαντικά επιστημονικά πεδία. Αρχικά, χρησιμοποιώντας το ολοκληρωμένο κύκλωμα των 48 πυρήνων με ονομασία Intel SCC, προτείνουμε μια τεχνική επιτάχυνσης του εντοπισμού μονίμων σφαλμάτων που εφαρμόζεται κατά τη διάρκεια λειτουργίας αρχιτεκτονικών με πολλούς πυρήνες, η οποία εκμεταλλεύεται το δίκτυο υψηλής ταχύτητας μεταφοράς μηνυμάτων που διατίθεται στα ολοκληρωμένα κυκλώματα αυτού του είδους. Δεύτερον, προτείνουμε μια λεπτομερή στατιστική μεθοδολογία με σκοπό την ακριβή πρόβλεψη σε επίπεδο συστήματος των ασφαλών ορίων λειτουργίας της τάσης των πυρήνων τύπου ARMv8 που βρίσκονται πάνω στη CPU X-Gene 2.The evolution in semiconductor manufacturing technology, computer architecture and design leads to increase in performance of modern microprocessors, which is also accompanied by increase in products’ vulnerability to errors. Designers apply different techniques throughout microprocessors life-time in order to ensure the high reliability requirements of the delivered products that are defined as their ability to avoid service failures that are more frequent and more severe than is acceptable. This thesis proposes novel methods to guarantee the high reliability and energy efficiency requirements of modern microprocessors that can be applied during the early design phase, the manufacturing phase or after the chips release to the market. The contributions of this thesis can be grouped in the two following categories according to the phase of the CPUs lifecycle that are applied at: • Early design phase: Statistical fault injection using microarchitectural structures modeled in performance simulators is a state-of-the-art method to accurately measure the reliability, but suffers from low simulation throughput. In this thesis, we firstly present a novel fully-automated versatile microarchitecture-level fault injection framework (called MaFIN) for accurate characterization of a wide range of hardware components of an x86-64 microarchitecture with respect to various fault models (transient, intermittent, permanent faults). Next, using the same tool and focusing on transient faults, we present several reliability and performance related studies that can assist design decision in the early design phases. Moreover, we propose two methodologies to accelerate the statistical fault injection campaigns. In the first one, we accelerate the fault injection campaigns after the actual injection of the faults in the simulated hardware structures. In the second, we further accelerate the microarchitecture level fault injection campaigns by proposing MeRLiN a fault pre-processing methodology that is based on the pruning of the initial fault list by grouping the faults in equivalent classes according to the instruction access patterns to hardware entries. • Manufacturing phase and release to the market: The contributions of this thesis in these phases of microprocessors life-cycle cover two important aspects. Firstly, using the 48-core Intel’s SCC architecture, we propose a technique to accelerate online error detection of permanent faults for many-core architectures by exploiting their high-speed message passing on-chip network. Secondly, we propose a comprehensive statistical analysis methodology to accurately predict at the system level the safe voltage operation margins of the ARMv8 cores of the X- Gene 2 chip when it operates in scaled voltage conditions

Efficient and Scalable Computing for Resource-Constrained Cyber-Physical Systems: A Layered Approach

With the evolution of computing and communication technology, cyber-physical systems such as self-driving cars, unmanned aerial vehicles, and mobile cognitive robots are achieving increasing levels of multifunctionality and miniaturization, enabling them to execute versatile tasks in a resource-constrained environment. Therefore, the computing systems that power these resource-constrained cyber-physical systems (RCCPSs) have to achieve high efficiency and scalability. First of all, given a fixed amount of onboard energy, these computing systems should not only be power-efficient but also exhibit sufficiently high performance to gracefully handle complex algorithms for learning-based perception and AI-driven decision-making. Meanwhile, scalability requires that the current computing system and its components can be extended both horizontally, with more resources, and vertically, with emerging advanced technology. To achieve efficient and scalable computing systems in RCCPSs, my research broadly investigates a set of techniques and solutions via a bottom-up layered approach. This layered approach leverages the characteristics of each system layer (e.g., the circuit, architecture, and operating system layers) and their interactions to discover and explore the optimal system tradeoffs among performance, efficiency, and scalability. At the circuit layer, we investigate the benefits of novel power delivery and management schemes enabled by integrated voltage regulators (IVRs). Then, between the circuit and microarchitecture/architecture layers, we present a voltage-stacked power delivery system that offers best-in-class power delivery efficiency for many-core systems. After this, using Graphics Processing Units (GPUs) as a case study, we develop a real-time resource scheduling framework at the architecture and operating system layers for heterogeneous computing platforms with guaranteed task deadlines. Finally, fast dynamic voltage and frequency scaling (DVFS) based power management across the circuit, architecture, and operating system layers is studied through a learning-based hierarchical power management strategy for multi-/many-core systems