3,831 research outputs found
Design and automation of voltage-scaled clock networks
In this dissertation, a vital step of VLSI physical design flow, synthesis of clock distribution networks, is investigated. Clock network synthesis (CNS) involves large and complex optimization problems to achieve high performance and low power demands of current integrated circuits (ICs). Ineffectiveness of existing methodologies to provide high performance at lower voltage nodes is the main driver for this dissertation research. A design and automation flow for voltage-scaled clock networks is proposed to satisfy tight timing constraints at high frequency (for high performance) and low voltage (for low power) operation. One implementation of voltage-scaled clock networks is low (voltage) swing clocking, which is a known technique, yet its applicability remains limited to designs with low performance demands. In this dissertation, novel methodologies are introduced to i) apply low swing clocking to legacy designs as a power saving methodology, ii) develop a complete CNS flow for low swing clocking of high performance ICs. These methodologies include slew-driven approaches that are better suited to future transistor and interconnect technologies. Second implementation of voltage-scaled clock networks is multi-voltage clocking, which is another known technique, yet its applicability remains limited to clock tree topology. In this dissertation, multi-voltage clocking with a clock mesh topology is investigated in order to address a missing aspect in the current IC design flows. Practical considerations of the current IC design flows are also investigated in this dissertation to expand the applicability of the proposed CNS flow. A novel methodology is introduced to facilitate clock gating within low swing clocking. The applicability of low swing clocking to FinFET technology, which is currently the industry norm, is shown to be effective.Ph.D., Electrical Engineering -- Drexel University, 201
Design of variation-tolerant synchronizers for multiple clock and voltage domains
PhD ThesisParametric variability increasingly affects the performance of electronic circuits as
the fabrication technology has reached the level of 32nm and beyond. These
parameters may include transistor Process parameters (such as threshold
voltage), supply Voltage and Temperature (PVT), all of which could have a
significant impact on the speed and power consumption of the circuit, particularly
if the variations exceed the design margins. As systems are designed with more
asynchronous protocols, there is a need for highly robust synchronizers and
arbiters. These components are often used as interfaces between communication
links of different timing domains as well as sampling devices for asynchronous
inputs coming from external components. These applications have created a need
for new robust designs of synchronizers and arbiters that can tolerate process,
voltage and temperature variations.
The aim of this study was to investigate how synchronizers and arbiters should be
designed to tolerate parametric variations. All investigations focused mainly on
circuit-level and transistor level designs and were modeled and simulated in the
UMC90nm CMOS technology process. Analog simulations were used to measure
timing parameters and power consumption along with a “Monte Carlo” statistical
analysis to account for process variations.
Two main components of synchronizers and arbiters were primarily investigated:
flip-flop and mutual-exclusion element (MUTEX). Both components can violate the
input timing conditions, setup and hold window times, which could cause
metastability inside their bistable elements and possibly end in failures. The
mean-time between failures is an important reliability feature of any synchronizer
delay through the synchronizer.
The MUTEX study focused on the classical circuit, in addition to a number of
tolerance, based on increasing internal gain by adding current sources, reducing
the capacitive loading, boosting the transconductance of the latch, compensating
the existing Miller capacitance, and adding asymmetry to maneuver the metastable
point. The results showed that some circuits had little or almost no improvements,
while five techniques showed significant improvements by reducing τ and
maintaining high tolerance.
Three design approaches are proposed to provide variation-tolerant
synchronizers. wagging synchronizer proposed to First, the is significantly
increase reliability over that of the conventional two flip-flop synchronizer. The
robustness of the wagging technique can be enhanced by using robust τ latches or
adding one more cycle of synchronization. The second approach is the
Metastability Auto-Detection and Correction (MADAC) latch which relies on swiftly
detecting a metastable event and correcting it by enforcing the previously stored
logic value. This technique significantly reduces the resolution time down from
uncertain
synchronization technique is proposed to transfer signals between Multiple-
Voltage Multiple-Clock Domains (MVD/MCD) that do not require conventional
level-shifters between the domains or multiple power supplies within each
domain. This interface circuit uses a synchronous set and feedback reset protocol
which provides level-shifting and synchronization of all signals between the
domains, from a wide range of voltage-supplies and clock frequencies.
Overall, synchronizer circuits can tolerate variations to a greater extent by
employing the wagging technique or using a MADAC latch, while MUTEX tolerance
can suffice with small circuit modifications. Communication between MVD/MCD
can be achieved by an asynchronous handshake
without a need for adding level-shifters.The Saudi Arabian Embassy in London,
Umm Al-Qura University, Saudi Arabi
Comparison of multi-layer bus interconnection and a network on chip solution
Abstract. This thesis explains the basic subjects that are required to take in consideration when designing a network on chip solutions in the semiconductor world. For example, general topologies such as mesh, torus, octagon and fat tree are explained. In addition, discussion related to network interfaces, switches, arbitration, flow control, routing, error avoidance and error handling are provided. Furthermore, there is discussion related to design flow, a computer aided designing tools and a few comprehensive researches. However, several networks are designed for the minimum latency, although there are also versions which trade performance for decreased bus widths. These designed networks are compared with a corresponding multi-layer bus interconnection and both synthesis and register transfer level simulations are run. For example, results from throughput, latency, logic area and power consumptions are gathered and compared.
It was discovered that overall throughput was well balanced with the network on chip solutions, although its maximum throughput was limited by protocol conversions. For example, the multi-layer bus interconnection was capable of providing a few times smaller latencies and higher throughputs when only a single interface was injected at the time. However, with parallel traffic and high-performance requirements a network on chip solution provided better results, even though the difference decreased when performance requirements were lower. Furthermore, it was discovered that the network on chip solutions required approximately 3–4 times higher total cell area than the multi-layer bus interconnection and that resources were mainly located at network interfaces and switches. In addition, power consumption was approximately 2–3 times higher and was mostly caused by dynamic consumption.Monitasoisen väyläarkkitehtuurin ja tietokoneverkkomaisen ratkaisun vertailua. Tiivistelmä. Tutkielmassa käsitellään tärkeimpiä aihealueita, jotka tulee huomioida suunniteltaessa tietokoneverkkomaisia väyläratkaisuja puolijohdemaailmassa. Esimerkiksi yleiset rakenteet, kuten verkko-, torus-, kahdeksankulmio- ja puutopologiat käsitellään lyhyesti. Lisäksi alustetaan verkon liitäntäkohdat, kytkimet, vuorottelu, vuon hallinta, reititys, virheiden välttely ja -käsittely. Lopuksi kerrotaan suunnitteluvuon oleellisimmat välivaiheet ja niihin soveltuvia kaupallisia työkaluja, sekä käsitellään lyhyesti muutaman aiemman julkaisun tuloksia. Tutkielmassa käytetään suunnittelutyökalua muutaman tietokoneverkkomaisen ratkaisun toteutukseen ja tavoitteena on saavuttaa pienin mahdollinen latenssi. Toisaalta myös hieman suuremman latenssin versioita suunnitellaan, mutta pienemmillä väylänleveyksillä. Lisäksi suunniteltuja tietokoneverkkomaisia ratkaisuja vertaillaan perinteisempään monitasoiseen väyläarkkitehtuuriin. Esimerkiksi synteesi- ja simulaatiotuloksia, kuten logiikan vaatimaa pinta-alaa, tehonkulutusta, latenssia ja suorituskykyä, vertaillaan keskenään.
Tutkielmassa selvisi, että suunnittelutyökalulla toteutetut tietokoneverkkomaiset ratkaisut mahdollistivat tasaisemman suorituskyvyn, joskin niiden suurin saavutettu suorituskyky ja pienin latenssi määräytyivät protokollan käännöksen aiheuttamasta viiveestä. Tutkielmassa havaittiin, että perinteisemmillä menetelmillä saavutettiin noin kaksi kertaa suurempi suorituskyky ja pienempi latenssi, kun verkossa ei ollut muuta liikennettä. Rinnakkaisen liikenteen lisääntyessä tietokoneverkkomainen ratkaisu tarjosi keskimäärin paremman suorituskyvyn, kun sille asetetut tehokkuusvaateet olivat suuret, mutta suorituskykyvaatimuksien laskiessa erot kapenivat. Lisäksi huomattiin, että tietokoneverkkomaisten ratkaisujen käyttämä pinta-ala oli noin 3–4 kertaa suurempi kuin monitasoisella väyläarkkitehtuurilla ja että resurssit sijaitsivat enimmäkseen verkon liittymäkohdissa ja kytkimissä. Lisäksi tehonkulutuksen huomattiin olevan noin 2–3 kertaa suurempi, joskin sen havaittiin koostuvan pääosin dynaamisesta kulutuksesta
Network-on-Chip
Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems
Novel Front-end Electronics for Time Projection Chamber Detectors
Este trabajo ha sido realizado en la Organización Europea para la Investigación Nuclear (CERN) y forma parte del proyecto de investigación Europeo para futuros aceleradores lineales (EUDET).
En física de partículas existen diferentes categorías de detectores de partículas. El diseño presentado esta centrado en un tipo particular de detector de trayectoria de partículas denominado TPC (Time Projection Chamber) que proporciona una imagen en tres dimensiones de las partículas eléctricamente cargadas que atraviesan su volumen gaseoso.
La tesis incluye un estudio de los objetivos para futuros detectores, resumiendo los parámetros que un sistema de adquisición de datos debe cumplir en esos casos. Además, estos requisitos son comparados con los actuales sistemas de lectura utilizados en diferentes detectores TPC. Se concluye que ninguno de los sistemas cumple las restrictivas condiciones. Algunos de los principales objetivos para futuros detectores TPC son un altísimo nivel de integración, incremento del número de canales, electrónica más rápida y muy baja potencia.
El principal inconveniente del estado del arte de los sistemas anteriores es la utilización de varios circuitos integrados en la cadena de adquisición. Este hecho hace imposible alcanzar el altísimo nivel de integración requerido para futuros detectores. Además, un aumento del número de canales y frecuencia de muestreo haría incrementar hasta valores no permitidos la potencia utilizada. Y en consecuencia, incrementar la refrigeración necesaria (en caso de ser posible).
Una de las novedades presentadas es la integración de toda la cadena de adquisición (filtros analógicos de entrada, conversor analógico-digital (ADC) y procesado de señal digital) en un único circuito integrado en tecnología de 130nm. Este chip es el primero que realiza esta altísima integración para detectores TPC.
Por otro lado, se presenta un análisis detallado de los filtros de procesado de señal. Los objetivos más importantes es la reduccióGarcía García, EJ. (2012). Novel Front-end Electronics for Time Projection Chamber Detectors [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/16980Palanci
Computation of power plane pair inductance, measurement of multiple switching current components and switching current measurement for multiple ICs with an island structure
The first part of the thesis presents the computation of power / ground plane pair inductance based on Partial Element Equivalent Circuit (PEEC) method in power distribution network (PDN) design. An efficient approach for the inductance computation is investigated. Speed-up techniques are employed include using the faster decay of mutual coupling due to the differential currents (same magnitude but opposite directions) in the two planes. Also, an approximate rectangular mesh reduction method is introduced which allows a local increase in mesh density.
The second part presents a measurement-based data-processing approach to obtain parameters of multiple current components through a bulk decoupling capacitor for power integrity studies. A lab-made low-cost current probe is developed to measure the induced voltage due to the time-varying switching current. Then, a post data-processing procedure is introduced to separate and obtain the parameters of multiple current components.
The third part proposes a measurement methodology, when IC information is not available, to obtain the equivalent switching current of each IC in the case where multiple ICs are connected to a common power island structure. Time-domain oscilloscope measurements are used to capture the noise-voltage waveforms at a few locations in the power island. Combining with the multi-port frequency-domain S-parameter measurement among the same locations, an equivalent switching current for each IC is calculated. The proposed method is validated at a different location in the power island by comparing the calculated noise voltage using the equivalent switching currents as excitations with the actual measured noise voltage --Abstract, page iv
Power distribution design for high-density packages
This thesis describes the design of a high-density power distribution system. Properties of impedances of power distribution systems are examined. Impedances are classified as self and trans-impedances. These properties are then used to save simulation time, which is a big factor for power distribution system design. Time domain models are extracted for the test cases. A novel 2D-3D technique of placing decoupling capacitors is demonstrated that is based on the effectiveness of the capacitor at that location. The power distribution system acts as a cavity resonator supporting discrete modes that vary with distance. Each capacitor is placed at the physical location where it has maximum impact on corresponding system modes. Targeting the modes at the ports where they are dominant using decoupling capacitors reduces trans-impedances. This technique is extended to the entire surface of the power distribution system using just a single set of simulations. This thesis presents a novel 2D-3D approach of designing high-density boards having chips with multiple power connections without having to go through lengthy tedious simulations
CMOS-3D smart imager architectures for feature detection
This paper reports a multi-layered smart image sensor architecture for feature extraction based on detection of interest points. The architecture is conceived for 3-D integrated circuit technologies consisting of two layers (tiers) plus memory. The top tier includes sensing and processing circuitry aimed to perform Gaussian filtering and generate Gaussian pyramids in fully concurrent way. The circuitry in this tier operates in mixed-signal domain. It embeds in-pixel correlated double sampling, a switched-capacitor network for Gaussian pyramid generation, analog memories and a comparator for in-pixel analog-to-digital conversion. This tier can be further split into two for improved resolution; one containing the sensors and another containing a capacitor per sensor plus the mixed-signal processing circuitry. Regarding the bottom tier, it embeds digital circuitry entitled for the calculation of Harris, Hessian, and difference-of-Gaussian detectors. The overall system can hence be configured by the user to detect interest points by using the algorithm out of these three better suited to practical applications. The paper describes the different kind of algorithms featured and the circuitry employed at top and bottom tiers. The Gaussian pyramid is implemented with a switched-capacitor network in less than 50 μs, outperforming more conventional solutions.Xunta de Galicia 10PXIB206037PRMinisterio de Ciencia e Innovación TEC2009-12686, IPT-2011-1625-430000Office of Naval Research N00014111031
Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip
The sustained demand for faster, more powerful chips has been met by the
availability of chip manufacturing processes allowing for the integration of increasing
numbers of computation units onto a single die. The resulting outcome,
especially in the embedded domain, has often been called SYSTEM-ON-CHIP
(SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC).
MPSoC design brings to the foreground a large number of challenges, one of
the most prominent of which is the design of the chip interconnection. With a
number of on-chip blocks presently ranging in the tens, and quickly approaching
the hundreds, the novel issue of how to best provide on-chip communication
resources is clearly felt.
NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable
answer to this design concern. By bringing large-scale networking concepts to
the on-chip domain, they guarantee a structured answer to present and future
communication requirements. The point-to-point connection and packet switching
paradigms they involve are also of great help in minimizing wiring overhead
and physical routing issues. However, as with any technology of recent inception,
NoC design is still an evolving discipline. Several main areas of interest
require deep investigation for NoCs to become viable solutions:
• The design of the NoC architecture needs to strike the best tradeoff among
performance, features and the tight area and power constraints of the onchip
domain.
• Simulation and verification infrastructure must be put in place to explore,
validate and optimize the NoC performance.
• NoCs offer a huge design space, thanks to their extreme customizability in
terms of topology and architectural parameters. Design tools are needed
to prune this space and pick the best solutions.
• Even more so given their global, distributed nature, it is essential to evaluate
the physical implementation of NoCs to evaluate their suitability for
next-generation designs and their area and power costs.
This dissertation performs a design space exploration of network-on-chip architectures,
in order to point-out the trade-offs associated with the design of
each individual network building blocks and with the design of network topology
overall. The design space exploration is preceded by a comparative analysis
of state-of-the-art interconnect fabrics with themselves and with early networkon-
chip prototypes. The ultimate objective is to point out the key advantages
that NoC realizations provide with respect to state-of-the-art communication
infrastructures and to point out the challenges that lie ahead in order to make
this new interconnect technology come true. Among these latter, technologyrelated
challenges are emerging that call for dedicated design techniques at all
levels of the design hierarchy. In particular, leakage power dissipation, containment
of process variations and of their effects. The achievement of the above
objectives was enabled by means of a NoC simulation environment for cycleaccurate
modelling and simulation and by means of a back-end facility for the
study of NoC physical implementation effects. Overall, all the results provided
by this work have been validated on actual silicon layout
- …