Investigation of different dielectric materials as gate insulator for MOSFETs

The scaling of semiconductor transistors has led to a decrease in thickness of the silicon dioxide layer used as gate dielectric. The thickness of the silicon dioxide layer is reduced to increase the gate capacitance, thus increasing the drain current. If the thickness of the gate dielectric decreases below 2nm, the leakage current due to the tunneling increases drastically. Hence it is necessary to replace the gate dielectric, silicon dioxide, with a physically thicker oxide layer of high-k materials like Hafnium oxide and Titanium oxide. High-k dielectric materials allow the capacitance to increase without a huge leakage current. Hafnium oxide and Titanium oxide films are deposited by reactive magnetron sputtering from Hafnium and Titanium targets respectively. These oxide layers are used to create metal-insulator-metal (MIM) structures using aluminum as the top and bottom electrodes. The films are deposited at various O2/Ar gas flow ratios, substrate temperatures, and process pressures. After attaining an exact recipe for these oxide layers that exhibit the desired parameters, MOS capacitors are fabricated with n-Si and p-Si substrates having aluminum electrodes at the top and bottom of each. Comparing the parameters of Hafnium oxide- and Titanium oxide- based MOS capacitors, MOSFET devices are designed with Hafnium oxide as gate dielectric

Investigation of Gate Dielectric Materials and Dielectric/Silicon Interfaces for Metal Oxide Semiconductor Devices

The progress of the silicon-based complementary-metal-oxide-semiconductor (CMOS) technology is mainly contributed to the scaling of the individual component. After decades of development, the scaling trend is approaching to its limitation, and there is urgent needs for the innovations of the materials and structures of the MOS devices, in order to postpone the end of the scaling. Atomic layer deposition (ALD) provides precise control of the deposited thin film at the atomic scale, and has wide application not only in the MOS technology, but also in other nanostructures. In this dissertation, I study rapid thermal processing (RTP) treatment of thermally grown SiO2, ALD growth of SiO2, and ALD growth of high-k HfO2 dielectric materials for gate oxides of MOS devices. Using a lateral heating treatment of SiO2, the gate leakage current of SiO2 based MOS capacitors was reduced by 4 order of magnitude, and the underlying mechanism was studied. Ultrathin SiO2 films were grown by ALD, and the electrical properties of the films and the SiO2/Si interface were extensively studied. High quality HfO2 films were grown using ALD on a chemical oxide. The dependence of interfacial quality on the thickness of the chemical oxide was studied. Finally I studied growth of HfO2 on two innovative interfacial layers, an interfacial layer grown by in-situ ALD ozone/water cycle exposure and an interfacial layer of etched thermal and RTP SiO2. The effectiveness of growth of high-quality HfO2 using the two interfacial layers are comparable to that of the chemical oxide. The interfacial properties are studied in details using XPS and ellipsometry

Investigation of Sputtered Hafnium Oxides for Gate Dielectric Applications in Integrated Circuits

This work investigated high permittivity hafnium based dielectric films for use in future generation metal oxide semiconductor field-effect transistor (MOSFET) technologies. For the sub- 100 nm MOS structure, the conventional Si02 gate dielectric required is becoming too thin ( Two deposition processes were used for investigating hafnium oxide: A traditional reactive sputtering process using a hafnium target and oxygen along with a metal oxidation process in which hafnium metal was deposited and subsequently oxidized in a rapid thermal processor. The films and their interfacial layers were studied using transmission electron microscopy and Rutherford backscattering. Suppression of the interfacial layers was attempted by utilizing various pre-deposition cleaning processes, nitrogen incorporation, and multiple annealing conditions. Statistical analysis was performed on many film properties including: thickness and refractive index by ellipsometry, equivalent oxide thickness (EOT), relative permittivity (sr), total charge density (Nss) via capacitance-voltage analysis (C-V), oxide charge density (Qox) and interface trap charge density (DiT) from surface charge analysis, and breakdown strength vi and leakage current density from current-voltage analysis (I-V). Hafnium oxide was successfully integrated into an RIT sub-micron NMOS process, and operational 0.5 um transistors were fabricated and tested

HfO2 as gate dielectric on Si and Ge substrate

Hafnium oxide HfO2 has been considered as an alternative to silicon dioxide SiO2 in future nano-scale complementary metal-oxide-semiconductor (CMOS) devices since it provides the required capacitance at the reduced device size because of its high dielectric constant. HfO2 films are currently deposited by various techniques. Many of them require high temperature annealing that can impact device performance and reliability. In this research, electrical characteristics of capacitors with HfO2 as gate dielectric deposited by standard thermal evaporation and e-beam evaporation on Si and Ge substrates were investigated. The dielectric constant of HfO2 deposited by thermal evaporation on Si is in the range of 18-25. Al/HfO2/Si MOS capacitors annealed at 450°C show low hysteresis, leakage current density and bulk oxide charges. Interface state density and low temperature charge trapping behavior of these structures were also investigated. Degradation in surface carrier mobility has been reported in Si field-effect-transistors with HfO2 as gate dielectric. To explore the possibility of alleviating this problem we have used germanium (Ge) substrate as this semiconductor has higher carrier mobility than Si. Devices fabricated by depositing HfO2 directly on Ge by standard thermal evaporation were found to be too leaky and show significant hysteresis and large shift in flatband voltage. This deterioration in electrical performance is mainly due to the formation of unstable interfacial layer of GeO2 during the HfO2 deposition. To minimize this effect, Ge surface was treated with the beam of atomic nitrogen prior to the dielectric deposition. The effect of surface nitridation, on interface as well as on bulk oxide, trap energy levels were investigated using low temperature C-V measurements. They revealed additional defect levels in the nitrided devices indicating diffusion of nitrogen from interface into the bulk oxide. Impact of surface nitridation on the reliability of Ge/HfO2/Al MOS capacitors has been investigated by application of constant voltage stress at different voltage levels for various time periods. It was observed that deeper trap levels in nitrided devices, found from low frequency and low temperature measurements, trap the charge carrier immediately after stress but with time these carriers detrap and create more traps inside the bulk oxide resulting in further devices deterioration. It is inferred that though nitrogen is effective in reducing interfacial layer growth it incorporates more defects at interface as well as in bulk oxide. Therefore, it is important to look into alternative methods of surface passivation to limit the growth of GeO2 at the interface

Electrical properties of ultra thin Al2O3 and HfO2 films as gate dielectrics in MOS technology

The rapidly evolving silicon industry demands devices with high-speed and low power consumption. This has led to aggressive scaling of the dimensions in metal oxide semiconductor field effect transistors (MOSFETs). The channel length has been reduced as a result of this scaling. The industry favorite, SlO2, has reached limitations in the thickness regime of 1-1.5 nm as a gate dielectric. High-κ gate dielectrics such as Al203 and HfO2 and their silicates are some of the materials that may, probably, replace SlO2, as gate dielectric in the next four to five years. The present study is an attempt to understand the electrical characteristics of these exciting materials grown by atomic layer deposition (ALD) technique. The flat band voltages (VFB) were determined from C-V measurements on circularly patterned MOS capacitors. For phosphorous doped polysilicon electrodes and Al-oxide based dielectrics, positive shifts in VFB were observed, relative to a pure SlO2 control, ranging from 0.2 to 0.8V. It is believed that this is caused by fixed charges. Rapid thermal annealing at 1000°C tends to decrease VFB relative to a 800°C anneal. Changes in VFB UP to 0.35 V are observed for films deposited over SlO2 underlayers, while smaller changes, up to 0.05 V, are observed for films deposited directly on Si. Spike annealing is also observed to reduce oxide leakage. HfO2 showed large amount of leakage resulting in difficulty in performing capacitance measurements. ZrO2 was found to be reacting with polycrystalline silicon and thus high leakage current was observed

Optimization of performance and reliability of HZO-based capacitors for ferroelectric memory applications

In an era in which the amount of produced and stored data continues to exponentially grow, standard memory concepts start showing size, power consumption and costs limitation which make the search for alternative device concepts essential. Within a context where new technologies such as DRAM, magnetic RAM, resistive RAM, phase change memories and eFlash are explored and optimized, ferroelectric memory devices like FeRAM seem to showcase a whole range of properties which could satisfy market needs, offering the possibility of creating a non-volatile RAM. In fact, hafnia and zirconia-based ferroelectric materials opened up a new scenario in the memory technology scene, overcoming the dimension scaling limitations and the integration difficulties presented by their predecessors perovskite ferroelectrics. In particular, HfₓZr₁₋ₓO₂ stands out because of high processing flexibility and ease of integration in the standard semiconductor industry process flows for CMOS fabrication. Nonetheless, further understanding is necessary in order tocorrelate device performance and reliability to the establishment of ferroelectricity itself. The aim of this work is to investigate how the composition of the ferroelectric oxide, together with the one of the electrode materials influence the behavior of a ferroelectric RAM. With this goal, different process parameters and reliability properties are considered and an analysis of the polarization reversal is performed. Starting from undoped hafnia and zirconia and subsequently examining their intermixed system, it is shown how surface/volume energy contributions, mechanical stress and oxygen-related defects all concur in the formation of the ferroelectric phase. Based on the process optimization of an HfₓZr₁₋ₓO₂-based capacitor performed within these pages, a 64 kbit 1T1C FeRAM array is demonstrated by Sony Semiconductor Solutions Corporation which shows write voltage and latency as low as 2.0 V and 16 ns, respectively. Outstanding retention and endurance performances are also predicted, which make the addressed device an extremely strong competitor in the semiconductor scene

Electric and Magnetic Properties of Atomic Layer Deposited ZrO2-HfO2 Thin Films

Atomic layer deposition method was employed to deposit thin films consisting of ZrO2 and HfO2. Zirconia films were doped with hafnia and vice versa, and also nanolaminates were formed. All depositions were carried out at 300 degrees C. Most films were crystalline in their as-deposited state. Zirconia exhibited the metastable cubic and tetragonal phases by a large majority, whereas hafnia was mostly in its stable monoclinic phase. Magnetic and electrical properties of the films were assessed. Un-doped zirconia was ferromagnetic and this property diminished with increasing the amount of hafnia in a film. All films exhibited ferroelectric-like behavior and the polarization curves also changed with respect to the film composition. (C) The Author(s) 2018. Published by ECS.Peer reviewe

Ferroelectric-Semiconductor Systems for New Generation of Solar Cells

This dissertation includes two parts. In the first part the study is focused on the fabrication of multifunctional thin films for photovoltaic applications. There is no doubt about the importance of transforming world reliance from traditional energy resources, mainly fossil fuel, into renewable energies. Photovoltaic section still owns very small portion of the production, despite its fast growth and vast research investments. New methods and concepts are proposed in order to improve the efficiency of traditional solar cells or introduce new platforms. Recently, ferroelectric photovoltaics have gained interest among researchers. First objective in application of ferroelectric material is to utilize its large electric field as a replacement for or improvement of built-in electric field in semiconductor p-n junctions which is responsible for the separation of generated electron-hole pairs. Increase in built in electric field will increase open-circuit voltage of the solar cell. In this regard, thin films of ferroelectric hafnium dioxide doped with silicon have been fabricated using physical vapor deposition techniques. Scanning probe microscopy techniques (PFM and KPFM) have been employed to analyze ferroelectric response and surface potential of the sample. The effects of poling direction of the ferroelectric film on the surface potential and current-voltage characteristics of the cell have been investigated. The results showed that the direction of poling affects photoresponse of the cell and based on the direction it can either improved or diminished. In the second part of this work, epitaxial thin films have been synthesized with physical vapor deposition techniques such as sputtering and electron beam evaporation for the ultimate goal of producing multifunctional three-dimensional structures. Three-dimensional structures have been used for applications such as magnetic sensors, filters, micro-robots and can be used for modification of the surface of solar cells in order to improve light absorption and efficiency. One of the important techniques for producing 3-D structures is using origami techniques. The effectiveness of this technique depends on the control of parameters which define direction of bending and rolling of the film or curvature of the structure based on the residual stress in the structure after film’s release and on the quality and uniformity of the film. In epitaxially grown films, the magnitude and direction of the stress are optimized, so the control over direction of rolling or bending of the film can be controlled more accurately. For this purpose, deposition conditions for epitaxy of Zn, Fe, Ru, Ti, NaCl and Cr on Si, Al2O3 or MgO substrates have been investigated and optimized. Crystallinity, composition and morphology of the films were characterized using reflective high energy diffraction (RHEED), Auger electron spectroscopy (AES), energy dispersive X-ray (EDX), and scanning electron microscopy (SEM)

Optical properties and structure of HfO2 thin films grown by high pressure reactive sputtering

Thin films of hafnium oxide have been grown by high pressure reactive sputtering on transparent quartz substrates (UV-grade silica) and silicon wafers. Deposition conditions were adjusted to obtain as well as amorphous films. Optical properties of the films deposited on the silica substrates were investigated by transmittance and reflectance spectroscopy in the ultraviolet, visible and near infrared range (UV-VIS-NIR). A numerical analysis method that takes into account the different surface roughness of the polycrystalline and amorphous films was applied to calculate the optical constants (refractive index and absorption coefficient). Amorphous films were found to have a higher refractive index and a lower transparency than polycrystalline films. This is attributed to a higher density of the amorphous samples, which was confirmed by atomic density measurements performed by heavy-ion elastic recoil detection analysis (ERDA). The absorption coefficient gave an excellent fit to the Tauc law (indirect gap), which allowed to obtain a band gap value of 5.54 eV. The structure of the films (amorphous or polycrystalline) was found to have no significant influence on the nature of the band gap. The Tauc plots also give information about the structure of the films, because the slope of the plot (the Tauc parameter) is related to the degree of order in the bond network. The amorphous samples had a larger value of the Tauc parameter, i.e., more order than the polycrystalline samples. This is indicative of a uniform bond network with percolation of the bond chains, in contrast to the randomly oriented polycrystalline grains separated by grain boundaries