Low-Power Embedded Design Solutions and Low-Latency On-Chip Interconnect Architecture for System-On-Chip Design

This dissertation presents three design solutions to support several key system-on-chip (SoC) issues to achieve low-power and high performance. These are: 1) joint source and channel decoding (JSCD) schemes for low-power SoCs used in portable multimedia systems, 2) efficient on-chip interconnect architecture for massive multimedia data streaming on multiprocessor SoCs (MPSoCs), and 3) data processing architecture for low-power SoCs in distributed sensor network (DSS) systems and its implementation. The first part includes a low-power embedded low density parity check code (LDPC) - H.264 joint decoding architecture to lower the baseband energy consumption of a channel decoder using joint source decoding and dynamic voltage and frequency scaling (DVFS). A low-power multiple-input multiple-output (MIMO) and H.264 video joint detector/decoder design that minimizes energy for portable, wireless embedded systems is also designed. In the second part, a link-level quality of service (QoS) scheme using unequal error protection (UEP) for low-power network-on-chip (NoC) and low latency on-chip network designs for MPSoCs is proposed. This part contains WaveSync, a low-latency focused network-on-chip architecture for globally-asynchronous locally-synchronous (GALS) designs and a simultaneous dual-path routing (SDPR) scheme utilizing path diversity present in typical mesh topology network-on-chips. SDPR is akin to having a higher link width but without the significant hardware overhead associated with simple bus width scaling. The last part shows data processing unit designs for embedded SoCs. We propose a data processing and control logic design for a new radiation detection sensor system generating data at or above Peta-bits-per-second level. Implementation results show that the intended clock rate is achieved within the power target of less than 200mW. We also present a digital signal processing (DSP) accelerator supporting configurable MAC, FFT, FIR, and 3-D cross product operations for embedded SoCs. It consumes 12.35mW along with 0.167mm2 area at 333MHz

Network-on-Chip Synchronization

Technology scaling has enabled the number of cores within a System on Chip (SoC) to increase significantly. Globally Asynchronous Locally Synchronous (GALS) systems using Dynamic Voltage and Frequency Scaling (DVFS) operate each of these cores on distinct and dynamic clock domains. The main communication method between these cores is increasingly more likely to be a Network-on-Chip (NoC). Typically, the interfaces between these clock domains experience multi-cycle synchronization latencies due to their use of “brute-force” synchronizers. This dissertation aims to improve the performance of NoCs and thereby SoCs as a whole by reducing this synchronization latency. First, a survey of NoC improvement techniques is presented. One such improvement technique: a multi-layer NoC, has been successfully simulated. Given how one of the most commonly used techniques is DVFS, a thorough analysis and simulation of brute-force synchronizer circuits in both current and future process technologies is presented. Unfortunately, a multi-cycle latency is unavoidable when using brute-force synchronizers, so predictive synchronizers which require only a single cycle of latency have been proposed. To demonstrate the impact of these predictive synchronizer circuits at a high level, multi-core system simulations incorporating these circuits have been completed. Multiple forms of GALS NoC configurations have been simulated, including multi-synchronous, NoC-synchronous, and single-synchronizer. Speedup on the SPLASH benchmark suite was measured to directly quantify the performance benefit of predictive synchronizers in a full system. Additionally, Mean Time Between Failures (MTBF) has been calculated for each NoC synchronizer configuration to determine the reliability benefit possible when using predictive synchronizers

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

Head-of-Line Blocking Reduction in Power-Efficient Networks-on-Chip

Tesis por compendioNowadays, thanks to the continuous improvements in the integration scale, more and more cores are added on the same chip, leading to higher system performance. In order to interconnect all nodes, a network-on-chip (NoC) is used, which is in charge of delivering data between cores. However, increasing the number of cores leads to a significant power consumption increase, leading the NoC to be one of the most expensive components in terms of power. Because of this, during the last years, several mechanisms have been proposed to address the NoC power consumption by means of DVFS (Dynamic Voltage and Frequency Scaling) and power-gating strategies. Nevertheless, improvements achieved by these mechanisms are achieved, to a greater or lesser extent, at the cost of system performance, potentially increasing the risk of saturating the network by forming congested points which, in turn, compromise the rest of the system functionality. One side effect is the creation of the "Head-of-Line blocking" effect where congested packets at the head of queues prevent other non-blocked packets from advancing. To address this issue, in this thesis, on one hand, we propose novel congestion control techniques in order to improve system performance by removing the "Head-of-Line" blocking effect. On the other hand, we propose combined solutions adapted to DVFS in order to achieve improvements in terms of performance and power. In addition to this, we propose a path-aware power-gating-based mechanism, which is capable of detecting the flows sharing buffer resources along data paths and perform to switch them off when not needed. With all these combined solutions we can significantly reduce the power consumption of the NoC when compared with state-of-the-art proposals.Hoy en día, gracias a las mejoras en la escala de integración cada vez se integran más y más núcleos en un mismo chip, mejorando así sus prestaciones. Para interconectar todos los nodos dentro del chip se emplea una red en chip (NoC, Network-on-Chip), la cual es la encargada de intercambiar información entre núcleos. No obstante, aumentar el número de núcleos en el chip también conlleva a su vez un importante incremento en el consumo de la NoC, haciendo que ésta se convierta en una de las partes más caras del chip en términos de consumo. Por ello, en los últimos años se han propuesto diversas técnicas de ahorro de energía orientadas a reducir el consumo de la NoC mediante el uso de DVFS (Dynamic Voltage and Frequency Scaling) o estrategias basadas en "power-gating". Sin embargo, éstas mejoras de consumo normalmente se obtienen a costa de sacrificar, en mayor o menor medida, las prestaciones del sistema, aumentado potencialmente así el riesgo de saturar la red, generando puntos de congestión que, a su vez, comprometen el rendimiento del resto del sistema. Un efecto colateral es el "Head-of-Line blocking", mediante el que paquetes congestionados en la cabeza de la cola impiden que otros paquetes no congestionados avancen. Con el fin de solucionar este problema, en ésta tesis, en primer lugar, proponemos técnicas novedosas de control de congestión para incrementar el rendimiento del sistema mediante la eliminación del "Head-of-Line blocking", mientras que, por otra parte, proponemos soluciones combinadas adaptadas a DVFS con el fin de conseguir mejoras en términos de rendimiento y energía. Además, proponemos una técnica de "power-gating" orientada a rutas de datos, la cual es capaz de detectar flujos de datos compartiendo recursos a lo largo de rutas y apagar dichos recursos de forma dinámica cuando no son necesarios. Con todas éstas soluciones combinadas podemos reducir el consumo de energía de la NoC en comparación con otras técnicas presentes en el estado del arte.Hui en dia, gr\`acies a les millores en l'escala d'integraci\'o, cada vegada s'integren m\'es i m\'es nuclis en un mateix xip, la qual cosa millora les seues prestacions. Per tal d'interconectar tots els nodes dins el xip es fa \'us d'una Xarxa en Xip (NoC; Network-on-Chip), la qual \'es l'encarregada d'intercanviar informaci\'o entre els nuclis. No obstant aix\`o, incrementar el nombre de nuclis en el xip tamb\'e comporta un important augment en el consum de la NoC, la qual cosa fa que aquesta es convertisca en una de les parts m\'es costoses del xip en termes de consum. Per aix\`o, en els \'ultims anys s'han proposat diverses t\`ecniques d'estalvi d'energia orientades a reduir el consum de la NoC mitjançant l'\'us de DVFS (Dynamic Voltage and Frequency Scaling) o estrat\`egies basades en ``power-gating''. Malgrat aix\`o, aquestes millores en les prestacions normalment s'obtenen a costa de sacrificar, en major o menor mesura, les prestacions del sistema i augmenta aix\'i el risc de saturar la xarxa al generar-se punts de congesti\'o, que al mateix temps, comprometen el rendiment de la resta del sistema. Un efecte col-lateral \'es el ``Head-of- Line blocking'', mitjançant el qual, els paquets congestionats al cap de la cua, impedixen que altres paquets no congestionats avancen. A fi de solucionar eixe problema, en aquesta tesi, en primer lloc, proposem noves t\`ecniques de control de congesti\'o amb l'objectiu d'incrementar el rendiment del sistema per mitj\`a de l'eliminaci\'o del ``Head-of- Line blocking'', i d'altra banda, proposem solucions combinades adaptades a DVFS amb la finalitat d'aconseguir millores en termes de rendiment i energia. A m\'es, proposem una t\`ecnica de ``power-gating'' orientada a rutes de dades, la qual \'es capa\c c de detectar fluxos de dades al compartir recursos al llarg de les rutes i apagar eixos recursos de forma din\`amica quan no s\'on necessaris. Amb totes aquestes solucions combinades podem reduir el consum d'energia de la NoC en comparaci\'o amb altres t\`ecniques presents en l'estat de l'art.Escamilla López, JV. (2017). Head-of-Line Blocking Reduction in Power-Efficient Networks-on-Chip [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/90419TESISCompendi

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Embedded dynamic programming networks for networks-on-chip

PhD ThesisRelentless technology downscaling and recent technological advancements in three dimensional integrated circuit (3D-IC) provide a promising prospect to realize heterogeneous system-on-chip (SoC) and homogeneous chip multiprocessor (CMP) based on the networks-onchip (NoCs) paradigm with augmented scalability, modularity and performance. In many cases in such systems, scheduling and managing communication resources are the major design and implementation challenges instead of the computing resources. Past research efforts were mainly focused on complex design-time or simple heuristic run-time approaches to deal with the on-chip network resource management with only local or partial information about the network. This could yield poor communication resource utilizations and amortize the benefits of the emerging technologies and design methods. Thus, the provision for efficient run-time resource management in large-scale on-chip systems becomes critical. This thesis proposes a design methodology for a novel run-time resource management infrastructure that can be realized efficiently using a distributed architecture, which closely couples with the distributed NoC infrastructure. The proposed infrastructure exploits the global information and status of the network to optimize and manage the on-chip communication resources at run-time. There are four major contributions in this thesis. First, it presents a novel deadlock detection method that utilizes run-time transitive closure (TC) computation to discover the existence of deadlock-equivalence sets, which imply loops of requests in NoCs. This detection scheme, TC-network, guarantees the discovery of all true-deadlocks without false alarms in contrast to state-of-the-art approximation and heuristic approaches. Second, it investigates the advantages of implementing future on-chip systems using three dimensional (3D) integration and presents the design, fabrication and testing results of a TC-network implemented in a fully stacked three-layer 3D architecture using a through-silicon via (TSV) complementary metal-oxide semiconductor (CMOS) technology. Testing results demonstrate the effectiveness of such a TC-network for deadlock detection with minimal computational delay in a large-scale network. Third, it introduces an adaptive strategy to effectively diffuse heat throughout the three dimensional network-on-chip (3D-NoC) geometry. This strategy employs a dynamic programming technique to select and optimize the direction of data manoeuvre in NoC. It leads to a tool, which is based on the accurate HotSpot thermal model and SystemC cycle accurate model, to simulate the thermal system and evaluate the proposed approach. Fourth, it presents a new dynamic programming-based run-time thermal management (DPRTM) system, including reactive and proactive schemes, to effectively diffuse heat throughout NoC-based CMPs by routing packets through the coolest paths, when the temperature does not exceed chip’s thermal limit. When the thermal limit is exceeded, throttling is employed to mitigate heat in the chip and DPRTM changes its course to avoid throttled paths and to minimize the impact of throttling on chip performance. This thesis enables a new avenue to explore a novel run-time resource management infrastructure for NoCs, in which new methodologies and concepts are proposed to enhance the on-chip networks for future large-scale 3D integration.Iraqi Ministry of Higher Education and Scientific Research (MOHESR)

Combined Dynamic Thermal Management Exploiting Broadcast-Capable Wireless Network-on-Chip Architecture

With the continuous scaling of device dimensions, the number of cores on a single die is constantly increasing. This integration of hundreds of cores on a single die leads to high power dissipation and thermal issues in modern Integrated Circuits (ICs). This causes problems related to reliability, timing violations and lifetime of electronic devices. Dynamic Thermal Management (DTM) techniques have emerged as potential solutions that mitigate the increasing temperatures on a die. However, considering the scaling of system sizes and the adoption of the Network-on-Chip (NoC) paradigm to serve as the interconnection fabric exacerbates the problem as both cores and NoC elements contribute to the increased heat dissipation on the chip. Typically, DTM techniques can either be proactive or reactive. Proactive DTM techniques, where the system has the ability to predict the thermal profile of the chip ahead of time are more desirable than reactive DTM techniques where the system utilizes thermal sensors to determine the current temperature of the chip. Moreover, DTM techniques either address core or NoC level thermal issues separately. Hence, this thesis proposes a combined proactive DTM technique that integrates both core level and NoC level DTM techniques. The combined DTM mechanism includes a dynamic temperature-aware routing approach for the NoC level elements, and includes task reallocation heuristics for the core level elements. On-chip wireless interconnects recently envisioned to enable energy-efficient data exchange between cores in a multicore chip will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM. Combining the proactive DTM technique with on-chip wireless interconnects, the on-chip temperature is restricted within target temperatures without significantly affecting the performance of the NoC based interconnection fabric of the multicore chip

A HEURISTIC FOR OPTIMIZING THE PHYSICAL LAYOUT AND NETWORK TOPOLOGY OF INTEGRATED 3D MULTI-CHIP SYSTEMS UNDER TEMPERATURE CONSTRAINTS

M.S. Thesis. University of Hawaiʻi at Mānoa 2018