Zuverlässige und Energieeffiziente gemischt-kritische Echtzeit On-Chip Systeme

Multi- and many-core embedded systems are increasingly becoming the target for many applications that require high performance under varying conditions. A resulting challenge is the control, and reliable operation of such complex multiprocessing architectures under changes, e.g., high temperature and degradation. In mixed-criticality systems where many applications with varying criticalities are consolidated on the same execution platform, fundamental isolation requirements to guarantee non-interference of critical functions are crucially important. While Networks-on-Chip (NoCs) are the prevalent solution to provide scalable and efficient interconnects for the multiprocessing architectures, their associated energy consumption has immensely increased. Specifically, hard real-time NoCs must manifest limited energy consumption as thermal runaway in such a core shared resource jeopardizes the whole system guarantees. Thus, dynamic energy management of NoCs, as opposed to the related work static solutions, is highly necessary to save energy and decrease temperature, while preserving essential temporal requirements. In this thesis, we introduce a centralized management to provide energy-aware NoCs for hard real-time systems. The design relies on an energy control network, developed on top of an existing switch arbitration network to allow isolation between energy optimization and data transmission. The energy control layer includes local units called Power-Aware NoC controllers that dynamically optimize NoC energy depending on the global state and applications’ temporal requirements. Furthermore, to adapt to abnormal situations that might occur in the system due to degradation, we extend the concept of NoC energy control to include the entire system scope. That is, online resource management employing hierarchical control layers to treat system degradation (imminent core failures) is supported. The mechanism applies system reconfiguration that involves workload migration. For mixed-criticality systems, it allows flexible boundaries between safety-critical and non-critical subsystems to safely apply the reconfiguration, preserving fundamental safety requirements and temporal predictability. Simulation and formal analysis-based experiments on various realistic usecases and benchmarks are conducted showing significant improvements in NoC energy-savings and in treatment of system degradation for mixed-criticality systems improving dependability over the status quo.Eingebettete Many- und Multi-core-Systeme werden zunehmend das Ziel für Anwendungen, die hohe Anfordungen unter unterschiedlichen Bedinungen haben. Für solche hochkomplexed Multi-Prozessor-Systeme ist es eine grosse Herausforderung zuverlässigen Betrieb sicherzustellen, insbesondere wenn sich die Umgebungseinflüsse verändern. In Systeme mit gemischter Kritikalität, in denen viele Anwendungen mit unterschiedlicher Kritikalität auf derselben Ausführungsplattform bedient werden müssen, sind grundlegende Isolationsanforderungen zur Gewährleistung der Nichteinmischung kritischer Funktionen von entscheidender Bedeutung. Während On-Chip Netzwerke (NoCs) häufig als skalierbare Verbindung für die Multiprozessor-Architekturen eingesetzt werden, ist der damit verbundene Energieverbrauch immens gestiegen. Daher sind dynamische Plattformverwaltungen, im Gegensatz zu den statischen, zwingend notwendig, um ein System an die oben genannten Veränderungen anzupassen und gleichzeitig Timing zu gewährleisten. In dieser Arbeit entwickeln wir energieeffiziente NoCs für harte Echtzeitsysteme. Das Design basiert auf einem Energiekontrollnetzwerk, das auf einem bestehenden Switch-Arbitration-Netzwerk entwickelt wurde, um eine Isolierung zwischen Energieoptimierung und Datenübertragung zu ermöglichen. Die Energiesteuerungsschicht umfasst lokale Einheiten, die als Power-Aware NoC-Controllers bezeichnet werden und die die NoC-Energie in Abhängigkeit vom globalen Zustand und den zeitlichen Anforderungen der Anwendungen optimieren. Darüber hinaus wird das Konzept der NoC-Energiekontrolle zur Anpassung an Anomalien, die aufgrund von Abnutzung auftreten können, auf den gesamten Systemumfang ausgedehnt. Online- Ressourcenverwaltungen, die hierarchische Kontrollschichten zur Behandlung Abnutzung (drohender Kernausfälle) einsetzen, werden bereitgestellt. Bei Systemen mit gemischter Kritikalität erlaubt es flexible Grenzen zwischen sicherheitskritischen und unkritischen Subsystemen, um die Rekonfiguration sicher anzuwenden, wobei grundlegende Sicherheitsanforderungen erhalten bleiben und Timing Vorhersehbarkeit. Experimente werden auf der Basis von Simulationen und formalen Analysen zu verschiedenen realistischen Anwendungsfallen und Benchmarks durchgeführt, die signifikanten Verbesserungen bei On-Chip Netzwerke-Energieeinsparungen und bei der Behandlung von Abnutzung für Systeme mit gemischter Kritikalität zur Verbesserung die Systemstabilität gegenüber dem bisherigen Status quo zeigen

Hierarchical Agent-based Adaptation for Self-Aware Embedded Computing Systems

Siirretty Doriast

Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Low-power CMOS digital-pixel Imagers for high-speed uncooled PbSe IR applications

This PhD dissertation describes the research and development of a new low-cost medium wavelength infrared MWIR monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapour phase deposition (VPD) PbSe-based medium wavelength IR (MWIR) detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. The work supports on the hypothesis that, by the use of the preceding design techniques, current standard inexpensive CMOS technologies fulfill all operational requirements of the VPD PbSe detector in terms of connectivity, reliability, functionality and scalability to integrate the device. The resulting monolithic PbSe-CMOS camera must consume very low power, operate at kHz frequencies, exhibit good uniformity and fit the CMOS read-out active pixels in the compact pitch of the focal plane, all while addressing the particular characteristics of the MWIR detector: high dark-to-signal ratios, large input parasitic capacitance values and remarkable mismatching in PbSe integration. In order to achieve these demands, this thesis proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed pattern noise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation. The main aim is to potentiate the integration of PbSe-based infra-red (IR)-image sensing technologies so as to widen its use, not only in distinct scenarios, but also at different stages of PbSe-CMOS integration maturity. For this purpose, we posit to investigate a comprehensive set of functional blocks distributed in two parallel approaches: • Frame-based “Smart” MWIR imaging based on new DPS circuit topologies with gain and offset FPN correction capabilities. This research line exploits the detector pitch to offer fully-digital programmability at pixel level and complete functionality with input parasitic capacitance compensation and internal frame memory. • Frame-free “Compact”-pitch MWIR vision based on a novel DPS lossless analog integrator and configurable temporal difference, combined with asynchronous communication protocols inside the focal plane. This strategy is conceived to allow extensive pitch compaction and readout speed increase by the suppression of in-pixel digital filtering, and the use of dynamic bandwidth allocation in each pixel of the FPA. In order make the electrical validation of first prototypes independent of the expensive PbSe deposition processes at wafer level, investigation is extended as well to the development of affordable sensor emulation strategies and integrated test platforms specifically oriented to image read-out integrated circuits. DPS cells, imagers and test chips have been fabricated and characterized in standard 0.15μm 1P6M, 0.35μm 2P4M and 2.5μm 2P1M CMOS technologies, all as part of research projects with industrial partnership. The research has led to the first high-speed uncooled frame-based IR quantum imager monolithically fabricated in a standard VLSI CMOS technology, and has given rise to the Tachyon series [1], a new line of commercial IR cameras used in real-time industrial, environmental and transportation control systems. The frame-free architectures investigated in this work represent a firm step forward to push further pixel pitch and system bandwidth up to the limits imposed by the evolving PbSe detector in future generations of the device.La present tesi doctoral descriu la recerca i el desenvolupament d'una nova tecnologia monolítica d'imatgeria infraroja de longitud d'ona mitja (MWIR), no refrigerada i de baix cost, per a usos industrials d'alta velocitat. El treball pren el relleu dels últims avenços assolits pel soci industrial NIT S.L. en el camp dels detectors MWIR de PbSe depositats en fase vapor (VPD), afegint-hi coneixement fonamental en la investigació de noves tècniques de disseny de circuits VLSI analògics i mixtes pel desenvolupament del dispositiu integrat de lectura unit al detector pixelat. Es parteix de la hipòtesi que, mitjançant l'ús de les esmentades tècniques de disseny, les tecnologies CMOS estàndard satisfan tots els requeriments operacionals del detector VPD PbSe respecte a connectivitat, fiabilitat, funcionalitat i escalabilitat per integrar de forma econòmica el dispositiu. La càmera PbSe-CMOS resultant ha de consumir molt baixa potència, operar a freqüències de kHz, exhibir bona uniformitat, i encabir els píxels actius CMOS de lectura en el pitch compacte del pla focal de la imatge, tot atenent a les particulars característiques del detector: altes relacions de corrent d'obscuritat a senyal, elevats valors de capacitat paràsita a l'entrada i dispersions importants en el procés de fabricació. Amb la finalitat de complir amb els requisits previs, es proposen arquitectures de sensors de visió de molt baix acoblament interpíxel basades en l'ús d'una matriu de pla focal (FPA) de píxels actius exclusivament digitals. Cada píxel sensor digital (DPS) està equipat amb mòduls de comunicació d'alta velocitat, autopolarització, cancel·lació de l'offset, conversió analògica-digital (ADC) i correcció del soroll de patró fixe (FPN). El consum en cada cel·la es minimitza fent un ús exhaustiu del MOSFET operant en subllindar. L'objectiu últim és potenciar la integració de les tecnologies de sensat d'imatge infraroja (IR) basades en PbSe per expandir-ne el seu ús, no només a diferents escenaris, sinó també en diferents estadis de maduresa de la integració PbSe-CMOS. En aquest sentit, es proposa investigar un conjunt complet de blocs funcionals distribuïts en dos enfocs paral·lels: - Dispositius d'imatgeria MWIR "Smart" basats en frames utilitzant noves topologies de circuit DPS amb correcció de l'FPN en guany i offset. Aquesta línia de recerca exprimeix el pitch del detector per oferir una programabilitat completament digital a nivell de píxel i plena funcionalitat amb compensació de la capacitat paràsita d'entrada i memòria interna de fotograma. - Dispositius de visió MWIR "Compact"-pitch "frame-free" en base a un novedós esquema d'integració analògica en el DPS i diferenciació temporal configurable, combinats amb protocols de comunicació asíncrons dins del pla focal. Aquesta estratègia es concep per permetre una alta compactació del pitch i un increment de la velocitat de lectura, mitjançant la supressió del filtrat digital intern i l'assignació dinàmica de l'ample de banda a cada píxel de l'FPA. Per tal d'independitzar la validació elèctrica dels primers prototips respecte a costosos processos de deposició del PbSe sensor a nivell d'oblia, la recerca s'amplia també al desenvolupament de noves estratègies d'emulació del detector d'IR i plataformes de test integrades especialment orientades a circuits integrats de lectura d'imatge. Cel·les DPS, dispositius d'imatge i xips de test s'han fabricat i caracteritzat, respectivament, en tecnologies CMOS estàndard 0.15 micres 1P6M, 0.35 micres 2P4M i 2.5 micres 2P1M, tots dins el marc de projectes de recerca amb socis industrials. Aquest treball ha conduït a la fabricació del primer dispositiu quàntic d'imatgeria IR d'alta velocitat, no refrigerat, basat en frames, i monolíticament fabricat en tecnologia VLSI CMOS estàndard, i ha donat lloc a Tachyon, una nova línia de càmeres IR comercials emprades en sistemes de control industrial, mediambiental i de transport en temps real.Postprint (published version

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

High-level services for networks-on-chip

Future technology trends envision that next-generation Multiprocessors Systems-on- Chip (MPSoCs) will be composed of a combination of a large number of processing and storage elements interconnected by complex communication architectures. Communication and interconnection between these basic blocks play a role of crucial importance when the number of these elements increases. Enabling reliable communication channels between cores becomes therefore a challenge for system designers. Networks-on-Chip (NoCs) appeared as a strategy for connecting and managing the communication between several design elements and IP blocks, as required in complex Systems-on-Chip (SoCs). The topic can be considered as a multidisciplinary synthesis of multiprocessing, parallel computing, networking, and on- chip communication domains. Networks-on-Chip, in addition to standard communication services, can be employed for providing support for the implementation of system-level services. This dissertation will demonstrate how high-level services can be added to an MPSoC platform by embedding appropriate hardware/software support in the network interfaces (NIs) of the NoC. In this dissertation, the implementation of innovative modules acting in parallel with protocol translation and data transmission in NIs is proposed and evaluated. The modules can support the execution of the high-level services in the NoC at a relatively low cost in terms of area and energy consumption. Three types of services will be addressed and discussed: security, monitoring, and fault tolerance. With respect to the security aspect, this dissertation will discuss the implementation of an innovative data protection mechanism for detecting and preventing illegal accesses to protected memory blocks and/or memory mapped peripherals. The second aspect will be addressed by proposing the implementation of a monitoring system based on programmable multipurpose monitoring probes aimed at detecting NoC internal events and run-time characteristics. As last topic, new architectural solutions for the design of fault tolerant network interfaces will be presented and discussed

Embedded System Design

A unique feature of this open access textbook is to provide a comprehensive introduction to the fundamental knowledge in embedded systems, with applications in cyber-physical systems and the Internet of things. It starts with an introduction to the field and a survey of specification models and languages for embedded and cyber-physical systems. It provides a brief overview of hardware devices used for such systems and presents the essentials of system software for embedded systems, including real-time operating systems. The author also discusses evaluation and validation techniques for embedded systems and provides an overview of techniques for mapping applications to execution platforms, including multi-core platforms. Embedded systems have to operate under tight constraints and, hence, the book also contains a selected set of optimization techniques, including software optimization techniques. The book closes with a brief survey on testing. This fourth edition has been updated and revised to reflect new trends and technologies, such as the importance of cyber-physical systems (CPS) and the Internet of things (IoT), the evolution of single-core processors to multi-core processors, and the increased importance of energy efficiency and thermal issues

Systematische Transaction-Level-Kommunikations-Modellierung mit SystemC

An emerging approach to embedded system design is to assemble them from a library of hardware and software component models (IP, intellectual property) using a system description language, such as SystemC. SystemC allows describing the communication among IPs in terms of abstract operations (transactions). The promise is that with transaction-level modeling (TLM), future systems-on-chip with one billion transistors and more can be composed out of IPs as simply as playing with LEGO bricks. However, reality is far out. In fact, each IP vendor promotes another proprietary interface standard and the provided design tools lack compatibility, such that heterogeneous IPs cannot be integrated efficiently. A novel generic interconnect fabric for TLM is presented which aims at enabling inter-operation between models of different levels of abstraction (mixed-mode) and models with different interfaces (heterogeneous components), with as little overhead as possible. A generic, protocol independent representation of transactions is developed, among with an abstraction level formalism. This approach is shown to support systematic simulation of state-of-the-art buses and networks-on-chip such as IBM CoreConnect and PCI Express over several levels of TLM abstraction. A layered simulation framework for SystemC, GreenBus, is developed to examine the proposed concepts. The thesis discusses new implementation techniques for communication modeling with SystemC which outperform the existing approaches in terms of flexibility, simulation accuracy, and performance. Based on these techniques, advanced concepts for TLM-based hardware/software co-design and FPGA prototyping are examined. Several experiments and a video processor case study highlight the efficiency of the approach and show its applicability in a TLM design flow.Eingebettete Systeme werden zunehmend auf Basis vorgefertigter Hard- und Softwarebausteine entwickelt, die in Form von Modellen (IP, Intellectual Property) vorliegen. Hierzu werden Systembeschreibungssprachen wie SystemC eingesetzt. SystemC ermöglicht, die Kommunikation zwischen IPs durch abstrakte Operationen, sog. Transaktionen zu beschreiben. Mit dieser Transaction-Level-Modellierung (TLM) sollen auch zukünftige Systeme mit 1 Milliarde Transistoren und mehr effizient entwickelt werden können. Idealerweise sollte das Hantieren mit IPs dabei so einfach sein wie das Spielen mit LEGO-Steinen. In der Realität sind jedoch IPs unterschiedlicher Hersteller nicht ohne weiteres integrierbar, und auch die Entwurfswerkzeuge sind nicht kompatibel. In dieser Doktorarbeit wird ein neuer, generischer Ansatz für die Transaction-Level-Modellierung mit SystemC vorgestellt, der Kommunikation zwischen Modellen auf unterschiedlichen Abstraktionsebenen (Mixed-Mode) und mit unterschiedlichen Schnittstellen (heterogene Komponenten) möglich macht. Der zusätzlich benötigte Simulations- und Code-Aufwand ist minimal. Ein protokollunabhängiges Transaktionsmodell und ein formaler Ansatz zur Beschreibung von Abstraktionsebenen werden vorgestellt, mit denen verschiedenartige Busse und Networks-on-Chip wie IBM CoreConnect und PCI Express auf verschiedenen TLM-Abstraktionsebenen simuliert werden können. Ein modulares Simulationsframework für SystemC wird entwickelt (GreenBus), um die vorgeschlagenen Konzepte zu untersuchen. Anhand von GreenBus werden neue Implementierungstechniken diskutiert, die den existierenden Ansätzen in Flexibilität, Simulationsgenauigkeit und -geschwindigkeit überlegen sind. Die Vor- und Nachteile der entwickelten Techniken werden mit Experimenten belegt, und eine Videoprozessor-Fallstudie demonstriert die Effizienz des Ansatzes in einem TLM-basierten Entwurfsfluss