2,754 research outputs found

    Active Matrix Flexible Sensory Systems: Materials, Design, Fabrication, and Integration

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    A variety of modern applications including soft robotics, prosthetics, and health monitoring devices that cover electronic skins (e-skins), wearables as well as implants have been developed within the last two decades to bridge the gap between artificial and biological systems. During this development, high-density integration of various sensing modalities into flexible electronic devices becomes vitally important to improve the perception and interaction of the human bodies and robotic appliances with external environment. As a key component in flexible electronics, the flexible thin-film transistors (TFTs) have seen significant advances, allowing for building flexible active matrices. The flexible active matrices have been integrated with distributed arrays of sensing elements, enabling the detection of signals over a large area. The integration of sensors within pixels of flexible active matrices has brought the application scenarios to a higher level of sophistication with many advanced functionalities. Herein, recent progress in the active matrix flexible sensory systems is reviewed. The materials used to construct the semiconductor channels, the dielectric layers, and the flexible substrates for the active matrices are summarized. The pixel designs and fabrication strategies for the active matrix flexible sensory systems are briefly discussed. The applications of the flexible sensory systems are exemplified by reviewing pressure sensors, temperature sensors, photodetectors, magnetic sensors, and biosignal sensors. At the end, the recent development is summarized and the vision on the further advances of flexible active matrix sensory systems is provided

    Tactile sensing chips with POSFET array and integrated interface electronics

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    This work presents the advanced version of novel POSFET (Piezoelectric Oxide Semiconductor Field Effect Transistor) devices based tactile sensing chip. The new version of the tactile sensing chip presented here comprises of a 4 x 4 array of POSFET touch sensing devices and integrated interface electronics (i.e. multiplexers, high compliance current sinks and voltage output buffers). The chip also includes four temperature diodes for the measurement of contact temperature. Various components on the chip have been characterized systematically and the overall operation of the tactile sensing system has been evaluated. With new design the POSFET devices have improved performance (i.e. linear response in the dynamic contact forces range of 0.01–3N and sensitivity (without amplification) of 102.4 mV/N), which is more than twice the performance of their previous implementations. The integrated interface electronics result in reduced interconnections which otherwise would be needed to connect the POSFET array with off-chip interface electronic circuitry. This research paves the way for CMOS (Complementary Metal Oxide Semiconductor) implementation of full on-chip tactile sensing systems based on POSFETs

    Medical Applications of Tissue-Equivalent, Organic-Based Flexible Direct X-Ray Detectors

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    The aim of this study is to assess direct X-ray detectors based on organic thin films, fabricated onto flexible plastic substrates, and operating at ultra-low bias (<1 V), for different medical applications. With this purpose, flexible fully organic pixelated X-ray detectors have been tested at the imaging beamline SYRMEP (SYnchrotron Radiation for MEdical Physics) at the Italian synchrotron Elettra, Trieste. The detectors' performance has been assessed for potential employment both as reliable wearable personal dosimeters for patients and as flexible X-ray medical imaging systems. A spatial resolution of 1.4 lp mm−1 with a contrast of 0.37 has been evaluated. Finally, we validate the detector using X-ray doses and energies typically employed for actual medical radiography, and using X-ray beam pulses provided by a commercial dental radiography system, recording a sensitivity of 1.6 × 105 μC Gy−1 cm−3 with a linear response with increasing of the dose rates and a reliable signal to 100 ms X-rays pulses

    Sensor requirements for Earth and planetary observations

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    Future generations of Earth and planetary remote sensing instruments will require extensive developments of new long-wave and very long-wave infrared detectors. The upcoming NASA Earth Observing System (EOS) will carry a suite of instruments to monitor a wide range of atmospheric and surface parameters with an unprecedented degree of accuracy for a period of 10 to 15 years. These instruments will observe Earth over a wide spectral range extending from the visible to nearly 17 micrometers with a moderate to high spectral and spacial resolution. In addition to expected improvements in communication bandwidth and both ground and on-board computing power, these new sensor systems will need large two-dimensional detector arrays. Such arrays exist for visible wavelengths and, to a lesser extent, for short wavelength infrared systems. The most dramatic need is for new Long Wavelength Infrared (LWIR) and Very Long Wavelength Infrared (VLWIR) detector technologies that are compatible with area array readout devices and can operate in the temperature range supported by long life, low power refrigerators. A scientific need for radiometric and calibration accuracies approaching 1 percent translates into a requirement for detectors with excellent linearity, stability and insensitivity to operating conditions and space radiation. Current examples of the kind of scientific missions these new thermal IR detectors would enhance in the future include instruments for Earth science such as Orbital Volcanological Observations (OVO), Atmospheric Infrared Sounder (AIRS), Moderate Resolution Imaging Spectrometer (MODIS), and Spectroscopy in the Atmosphere using Far Infrared Emission (SAFIRE). Planetary exploration missions such as Cassini also provide examples of instrument concepts that could be enhanced by new IR detector technologies

    High-sensitivity high-resolution X-ray imaging with soft-sintered metal halide perovskites

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    To realize the potential of artificial intelligence in medical imaging, improvements in imaging capabilities are required, as well as advances in computing power and algorithms. Hybrid inorganic–organic metal halide perovskites, such as methylammonium lead triiodide (MAPbI3), offer strong X-ray absorption, high carrier mobilities (µ) and long carrier lifetimes (τ), and they are promising materials for use in X-ray imaging. However, their incorporation into pixelated sensing arrays remains challenging. Here we show that X-ray flat-panel detector arrays based on microcrystalline MAPbI3 can be created using a two-step manufacturing process. Our approach is based on the mechanical soft sintering of a freestanding absorber layer and the subsequent integration of this layer on a pixelated backplane. Freestanding microcrystalline MAPbI3 wafers exhibit a sensitivity of 9,300 µC Gyair–1 cm–2 with a μτ product of 4 × 10–4 cm2 V–1, and the resulting X-ray imaging detector, which has 508 pixels per inch, combines a high spatial resolution of 6 line pairs per millimetre with a low detection limit of 0.22 nGyair per frame

    The X-Gamma Imaging Spectrometer (XGIS) onboard THESEUS

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    A compact and modular X and gamma-ray imaging spectrometer (XGIS) has been designed as one of the instruments foreseen on-board the THESEUS mission proposed in response to the ESA M5 call. The experiment envisages the use of CsI scintillator bars read out at both ends by single-cell 25 mm 2 Silicon Drift Detectors. Events absorbed in the Silicon layer (lower energy X rays) and events absorbed in the scintillator crystal (higher energy X rays and Gamma-rays) are discriminated using the on-board electronics. A coded mask provides imaging capabilities at low energies, thus allowing a compact and sensitive instrument in a wide energy band (~2 keV up to ~20 MeV). The instrument design, expected performance and the characterization performed on a series of laboratory prototypes are discussed.Comment: To be published in the Proceedings of the THESEUS Workshop 2017 (http://www.isdc.unige.ch/theseus/workshop2017.html), Journal of the Italian Astronomical Society (Mem.SAIt), Editors L. Amati, E. Bozzo, M. Della Valle, D. Gotz, P. O'Brien. Details on the THESEUS mission concept can be found in the white paper Amati et al. 2017 (arXiv:171004638) and Stratta et al. 2017 (arXiv:1712.08153

    Exploring Perovskite Photodiodes:Device Physics and Applications

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    Exploring Perovskite Photodiodes:Device Physics and Applications

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