Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

Design of a 20 GHz DPI method for SOIC8

International audienceThe direct power injection (DPI) test defined in IEC 62132-4 measures the conducted immunity of integrated circuits (ICs) up to 1GHz. As the frequency of functional and interference signals is increasing, we would like to characterise immunity for higher frequencies as well. In this paper, we show why typical IEC 62132-4 compliant DPI set-ups become inaccurate when going up to 20GHz. We propose to determine the power Ptrans actually transmitted to the device under test (DUT) by using offline short-open-load-thru (SOLT) or thru-reflect-line (TRL) calibration. Furthermore, we design a low-cost FR4 printed circuit board (PCB) that allows for testing of SOIC8-packaged ICs. We verify that this board has acceptable and reproducible losses up to 20 GHz, as well as acceptable crosstalk

Gateway Electromagnetic Environmental Effects (E3) Requirements

Electromagnetic Compatibility (EMC) is essential to the success of any vehicle design that incorporates a complex assortment of electronic, electrical, and electromechanical systems and sub-systems that is expected to meet operational and performance requirements while exposed to a changing set of electromagnetic environments composed of both man-made and naturally occurring threats. The combined aspects of these environments are known as Electromagnetic Environmental Effects (E3). The attainment of EMC is accomplished through the application of sound engineering principles and practices that enable a complex vehicle or vehicles to operate successfully when exposed to the effects of its expected and/or specified electromagnetic environments

Design of a 20 GHz DPI method for SOIC8

The direct power injection (DPI) test defined in IEC 62132-4 measures the conducted immunity of integrated circuits (ICs) up to 1 GHz. As the frequency of functional and interference signals is increasing, we would like to characterise immunity for higher frequencies as well. In this paper, we show why typical IEC 62132-4 compliant DPI set-ups become inaccurate when going up to 20 GHz. We propose to determine the power Ptrans actually transmitted to the device under test (DUT) by using offline short-open-load-thru (SOLT) or thru-reflect-line (TRL) calibration. Furthermore, we design a low-cost FR4 printed circuit board (PCB) that allows for testing of SOIC8-packaged ICs. We verify that this board has acceptable and reproducible losses up to 20 GHz, as well as acceptable crosstalk.Peer ReviewedPreprin

Effects of thermal aggressions on susceptibility responses and immunity figures of PWM patterns

In embedded and on-board electronics context, environmental temperature has an influence on the real electromagnetic compliance and EMC figures. We present studies and results of temperature impacts on susceptibility and immunity figures. Specific dual thermal-electromagnetic set-up have been developed for this. A campaign of EMC-Thermal-parametric measurements has been realized on PWM patterns of digital PCBs dedicated for electronic drive and command. Temperature dependent susceptibility behaviors are presented, in the range of 3GHz for harmonic aggressions, that leads to discuss of new cases of EM sensitivity, couplings and immunity approach on electronic devices

Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit

with constraints for high-level integration of electronics, new EMC behaviors have to be considered to prevent real electromagnetic compliance. Especially, in embedded and on-board device's context, environmental temperature has an influence on the circuit behavior and EMC figures. This paper deals with susceptibility studies combined with temperature effects on electronic devices used to control power and transmissions. Specific dual thermal-electromagnetic test set-up developed for this are presented. Main results of an experimental campaign on digital PCB dedicated for generation of Pulse Width Modulation (PWM) patterns are presented. Temperature dependant susceptibility and sensitivity of the PWM parameters are compared and analyzed

Advancement on the Susceptibility of Analog Front-Ends to EMI

L'abstract è presente nell'allegato / the abstract is in the attachmen

Stability of microprocessor relay protection and automation systems against intentional destructive electromagnetic impacts. Part 2

Problems of impact of the electromagnetic high-power pulses generated at nuclear explosion or by means of the special equipment, intended specially for damage of the electronic equipment, in particular digital protective relays and automatic systems, and also ways of protection from these impacts are considered.В статье рассматриваются проблемы воздействия мощных электромагнитных импульсов, генерируемых при ядерном взрыве или с помощью специального оборудования, предназначенных специально для повреждения электронной аппаратуры, в частности микропроцессорных устройств релейной защиты и автоматики, а также меры защиты от этих воздействий

Design for Electromagnetic Compatibility--In a Nutshell

This open access book provides practicing electrical engineers and students a practical – and mathematically sound – introduction to the topic of electromagnetic compatibility (EMC). The author enables readers to understand better how to overcome commonly failed EMC tests for radiated emission, radiated immunity, and electrostatic discharge (ESD), while providing concrete EMC design guidelines. The book also presents an overview of EMC standards and regulations and how to test for a global market access

Interfered technology: A radiant future: A look forward to EMC in 2023, five years from now

In 1973, a three-part full-page article was published in the local newspaper describing our society in the region of Twente, the Netherlands, in 1923, 1973, and 2023 [1]. The author of this article was only 11 years old at the time, but the predictions made were interesting enough to keep that article for 45 years. The article [1] predicted several innovations for 2023, 50 years ahead, such as a magnetic levitation monorail from Twente to Amsterdam reducing the travel time from 2 hours to less than 30 minutes, as shown in Figure 1. However, all we got after 45 years was a new motorway, with lots of traffic jams, and a train that still takes 2 hours. Despite over a century of research and development, maglev trains are currently operated in just three countries: Japan, South Korea, and China. Other innovations predicted in 1973 for 2023 were clothes made by printers (yes, nearly), no cars in city centres (yes), products made in Shanghai (yes), European regions instead of European countries (no, although Catalonia would like this), no manufacturing but only research and development (no), Holec and Signaal merged (no, Holec split up into several divisions now owned by Siemens, Eaton, and General Electric, and Signaal was sold by Philips to Thomson-CSF, now THALES). And the announcement that the University of Twente will be organizing a conference on communication technology, including electronics. This was a very good prediction: communication technology will be a key issue in 2023