Design of Power/Analog/Digital Systems Through Mixed-Level Simulations

In recent years the development of the applications in the field of telecommunications, data processing, control, renewable energy generation, consumer and automotive electronics determined the need for increasingly complex systems, also in shorter time to meet the growing market demand. The increasing complexity is mainly due to the mixed nature of these systems that must be developed to accommodate the new functionalities and to satisfy the more stringent performance requirements of the emerging applications. This means a more complex design and verification process. The key to managing the increased design complexity is a structured and integrated design methodology which allows the sharing of different circuit implementations that can be at transistor level and/or at a higher level (i.e.HDL languages).In order to expedite the mixed systems design process it is necessary to provide: an integrated design methodology; a suitable supporting tool able to manage the entire design process and design complexity and its successive verification.It is essential that the different system blocks (power, analog, digital), described at different level of abstraction, can be co-simulated in the same design context. This capability is referred to as mixed-level simulation.One of the objectives of this research is to design a mixed system application referred to the control of a coupled step-up dc-dc converter. This latter consists of a power stage designed at transistor-level, also including accurate power device models, and the analog controller implemented using VerilogA modules. Digital controllers are becoming very attractive in dc-dc converters for their programmability, ability to implement sophisticated control schemes, and ease of integration with other digital systems. Thus, in this dissertation it will be presented a detailed design of a Flash Analog-to-Digital Converter (ADC). The designed ADC provides medium-high resolution associated to high-speed performance. This makes it useful not only for the control application aforementioned but also for applications with huge requirements in terms of speed and signal bandwidth. The entire design flow of the overall system has been conducted in the Cadence Design Environment that also provides the ability to mixed-level simulations. Furthermore, the technology process used for the ADC design is the IHP BiCMOS 0.25 µm by using 50 GHz NPN HBT devices

Design of Energy-Efficient A/D Converters with Partial Embedded Equalization for High-Speed Wireline Receiver Applications

As the data rates of wireline communication links increases, channel impairments such as skin effect, dielectric loss, fiber dispersion, reflections and cross-talk become more pronounced. This warrants more interest in analog-to-digital converter (ADC)-based serial link receivers, as they allow for more complex and flexible back-end digital signal processing (DSP) relative to binary or mixed-signal receivers. Utilizing this back-end DSP allows for complex digital equalization and more bandwidth-efficient modulation schemes, while also displaying reduced process/voltage/temperature (PVT) sensitivity. Furthermore, these architectures offer straightforward design translation and can directly leverage the area and power scaling offered by new CMOS technology nodes. However, the power consumption of the ADC front-end and subsequent digital signal processing is a major issue. Embedding partial equalization inside the front-end ADC can potentially result in lowering the complexity of back-end DSP and/or decreasing the ADC resolution requirement, which results in a more energy-effcient receiver. This dissertation presents efficient implementations for multi-GS/s time-interleaved ADCs with partial embedded equalization. First prototype details a 6b 1.6GS/s ADC with a novel embedded redundant-cycle 1-tap DFE structure in 90nm CMOS. The other two prototypes explain more complex 6b 10GS/s ADCs with efficiently embedded feed-forward equalization (FFE) and decision feedback equalization (DFE) in 65nm CMOS. Leveraging a time-interleaved successive approximation ADC architecture, new structures for embedded DFE and FFE are proposed with low power/area overhead. Measurement results over FR4 channels verify the effectiveness of proposed embedded equalization schemes. The comparison of fabricated prototypes against state-of-the-art general-purpose ADCs at similar speed/resolution range shows comparable performances, while the proposed architectures include embedded equalization as well

REALIZATION OF A VARIABLE RESOLUTION MODIFIED SEMIFLASH ADC BASED ON BIT SEGMENTATION SCHEME

A modified variable resolution semiflash ADC, based on ‘bit segmentation scheme’, is presented. Its speed and comparator count are identical to a normal flash ADC. An 8-bit ADC has 256 different bit combinations. Sixteen consecutive bit combinations from the MSB side – beginning with the first one, remain unaltered for such an ADC. It continues this way till the last group of sixteen bits. In the designed circuit, the four MSB and four LSB bits are determined in the first and second part of the clock. Following the same logic, the bits in a 16-bit ADC can be found out in only two clock cycles by employing only fifteen comparators. It implies that a higher resolution ADC can easily be determined with low power and small die area. It is tested in P-SIM Professional 9 for an 8-bit ADC and curves drawn to establish the validity of the proposal

Carbon footprint of 3D-printed bone tissue engineering scaffolds: an life cycle assessment study

The bone tissue engineering scaffolds is one of the methods for repairing bone defects caused by various factors. According to modern tissue engineering technology, three-dimensional (3D) printing technology for bone tissue engineering provides a temporary basis for the creation of biological replacements. Through the generated 3D bone tissue engineering scaffolds from previous studies, the assessment to evaluate the environmental impact has shown less attention in research. Therefore, this paper is aimed to propose the Model of life cycle assessment (LCA) for 3D bone tissue engineering scaffolds of 3D gel-printing technology and presented the analysis technique of LCA from cradle-to-gate for assessing the environmental impacts of carbon footprint. Acrylamide (C3H5NO), citric acid (C6H8O7), N,N-Dimethylaminopropyl acrylamide (C8H16N2O), deionized water (H2O), and 2-Hydroxyethyl acrylate (C5H8O3) was selected as the material resources. Meanwhile, the 3D gel-printing technology was used as the manufacturing processes in the system boundary. The analysis is based on the LCA Model through the application of GaBi software. The environmental impact was assessed in the 3D gel-printing technology and it was obtained that the system shows the environmental impact of global warming potential (GWP). All of the emissions contributed to GWP have been identified such as emissions to air, freshwater, seawater, and industrial soil. The aggregation of GWP result in the stage of manufacturing process for input and output data contributed 47.6% and 32.5% respectively. Hence, the data analysis of the results is expected to use for improving the performance at the material and manufacturing process of the product life cycle

A Novel Frequency Based Current-to-Digital Converter with Programmable Dynamic Range

This work describes a novel frequency based Current to Digital converter, which would be fully realizable on a single chip. Biological systems make use of delay line techniques to compute many things critical to the life of an animal. Seeking to build up such a system, we are adapting the auditory localization circuit found in barn owls to detect and compute the magnitude of an input current. The increasing drive to produce ultra low-power circuits necessitates the use of very small currents. Frequently these currents need to accurately measured, but current solutions typically involve off-chip measurements. These are usually slow, and moving a current off chip increases noise to the system. Moving a system such as this completely on chip will allow for precise measurement and control of bias currents, and it will allow for better compensation of some common transistor mismatch issues. This project affords an extremely low power (100s nW) converter technology that is also very space efficient. The converter is completely asynchronous which yields ultra-low power standby operation [1]

Background Calibration of a 6-Bit 1Gsps Split-Flash ADC

In this MS thesis, a redundant flash analog-to-digital converter (ADC) using a ``Split-ADC\u27 calibration structure and lookup-table-based correction is presented. ADC input capacitance is minimized through use of small, power efficient comparators; redundancy is used to tolerate the resulting large offset voltages. Correction of errors and estimation of calibration parameters are performed continuously in the background in the digital domain. The proposed flash ADC has an effective-number-of-bits (ENOB) of 6-bits and is designed for a target sampling rate of 1Gs/s in 180nm CMOS. The calibration algorithm described has been simulated in MATLAB and an FPGA implementation has been investigated

TIME-DIFFERENCE CIRCUITS: METHODOLOGY, DESIGN, AND DIGITAL REALIZATION

This thesis presents innovations for a special class of circuits called Time Difference (TD) circuits. We introduce a signal processing methodology with TD signals that alters the target signal from a magnitude perspective to time interval between two time events and systematically organizes the primary TD functions abstracted from existing TD circuits and systems. The TD circuits draw attention from a broad range of application fields. In addition, highly evolved complementary metal-oxide-semiconductor (CMOS) technology suffers from various problems related to voltage and current amplitude signal processing methods. Compared to traditional analog and digital circuits, TD circuits bring several compelling features: high-resolution, high-throughput, and low-design complexity with digital integration capability. Further, the fabrication technology is advancing into the nanometer regime; the reduction in voltage headroom limits the performance of traditional analog/mixed-signal designs. All-digital design of time-difference circuit needs to be stressed to adapt to the low-cost, low-power, and high-portability applications. We focus on Time-to-Digital Converters (TDC), one of the crucial building blocks in TD circuits. A novel algorithmic architecture is proposed based on a binary search algorithm and validated with both simulation and fabricated silicon. An all-digital structure Time-difference Amplifier (TDA) is designed and implemented to make FPGA and other all-digital implementations for TDC and related TD circuits feasible. Besides, we propose an all-digital timing measurement circuit based on the process variation from CMOS fabrication: PVTMC, which achieves a high measurement resolution: