Oxygen-insertion Technology for CMOS Performance Enhancement

Until 2003, the semiconductor industry followed Dennard scaling rules to improve complementary metal-oxide-semiconductor (CMOS) transistor performance. However, performance gains with further reductions in transistor gate length are limited by physical effects that do not scale commensurately with device dimensions: short-channel effects (SCE) due to gate-leakage-limited gate-oxide thickness scaling, channel mobility degradation due to enhanced vertical electric fields, increased parasitic resistances due to reductions in source/drain (S/D) contact area, and increased variability in transistor performance due to random dopant fluctuation (RDF) effects and gate work function variations (WFV). These emerging scaling issues, together with increased process complexity and cost, pose severe challenges to maintaining the exponential scaling of transistor dimensions. This dissertation discusses the benefits of oxygen-insertion (OI) technology, a CMOS performance booster, for overcoming these challenges. The benefit of OI technology to mitigate the increase in sheet resistance ($R_{sh}$) with decreasing junction depth ($X_J$) for ultra-shallow-junctions (USJs) relevant for deep-sub-micron planar CMOS transistors is assessed through the fabrication of $R_{sh}$ test structures, electrical characterization, and technology computer-aided design (TCAD) simulations. Experimental and secondary ion mass spectroscopy (SIMS) analyses indicate that OI technology can facilitate low-resistivity USJ formation by reducing $R_{sh}$ and $X_J$ due to retarded transient-enhanced-diffusion (TED) effects and enhanced dopant retention during post-implantation thermal annealing. It is also shown that a low-temperature-oxide (LTO) capping can increase $R_{sh}$ unfavorably due to lower dopant activation levels, which can be alleviated by OI technology. This dissertation extends the evaluation of OI technology to advanced FinFET technology, targeting 7/8-nm low power technology node. A bulk-Si FinFET design comprising a super-steep retrograde (SSR) fin channel doping profile achievable with OI technology is studied by three-dimensional (3-D) TCAD simulations. As compared with the conventional bulk-Si (control) FinFET design with a heavily-doped fin channel doping profile, SSR FinFETs can achieve higher $I_{on}/I_{off}$ ratios and reduce the sensitivity of device performance to variations due to the lightly doped fin channel. As compared with the SOI FinFET design, SSR FinFETs can achieve similarly low $V_{DD,min}$ for 6T-SRAM cell yield estimation. Both SSR and SOI design can provide for as much as 100 mV reduction in $V_{DD,min}$ compared with the control FinFET design. Overall, the SSR FinFET design that can be achieved with OI technology is demonstrated to be a cheaper alternative to the SOI FinFET technology for extending CMOS scaling beyond the 10-nm node. Finally, this dissertation investigates the benefits of OI technology for reducing the Schottky barrier height ($\Phi_{Bp}$) of a Pt/Ti/p-type Si metal-semiconductor (M/S) contact, which can be expected to help reduce the specific contact resistivity for a p-type silicon contact. Electrical measurements of back-to-back Schottky diodes, SIMS, and X-ray photoelectron spectroscopy (XPS) show that the reduction in $\Phi_{Bp}$ is associated with enhanced Ti 2p and Si 2p core energy level shifts. OI technology is shown to favor low-$\Phi_{Bp}$ Pt monosilicide formation during forming gas anneal (FGA) by suppressing the grain boundary diffusion of Pt atoms into the crystalline Si substrate

Robust low-power digital circuit design in nano-CMOS technologies

Device scaling has resulted in large scale integrated, high performance, low-power, and low cost systems. However the move towards sub-100 nm technology nodes has increased variability in device characteristics due to large process variations. Variability has severe implications on digital circuit design by causing timing uncertainties in combinational circuits, degrading yield and reliability of memory elements, and increasing power density due to slow scaling of supply voltage. Conventional design methods add large pessimistic safety margins to mitigate increased variability, however, they incur large power and performance loss as the combination of worst cases occurs very rarely. In-situ monitoring of timing failures provides an opportunity to dynamically tune safety margins in proportion to on-chip variability that can significantly minimize power and performance losses. We demonstrated by simulations two delay sensor designs to detect timing failures in advance that can be coupled with different compensation techniques such as voltage scaling, body biasing, or frequency scaling to avoid actual timing failures. Our simulation results using 45 nm and 32 nm technology BSIM4 models indicate significant reduction in total power consumption under temperature and statistical variations. Future work involves using dual sensing to avoid useless voltage scaling that incurs a speed loss. SRAM cache is the first victim of increased process variations that requires handcrafted design to meet area, power, and performance requirements. We have proposed novel 6 transistors (6T), 7 transistors (7T), and 8 transistors (8T)-SRAM cells that enable variability tolerant and low-power SRAM cache designs. Increased sense-amplifier offset voltage due to device mismatch arising from high variability increases delay and power consumption of SRAM design. We have proposed two novel design techniques to reduce offset voltage dependent delays providing a high speed low-power SRAM design. Increasing leakage currents in nano-CMOS technologies pose a major challenge to a low-power reliable design. We have investigated novel segmented supply voltage architecture to reduce leakage power of the SRAM caches since they occupy bulk of the total chip area and power. Future work involves developing leakage reduction methods for the combination logic designs including SRAM peripherals

A Process Variation Tolerant Self-Compensation Sense Amplifier Design

As we move under the aegis of the Moore\u27s law, we have to deal with its darker side with problems like leakage and short channel effects. Once we go beyond 45nm regime process variations also have emerged as a significant design concern.Embedded memories uses sense amplifier for fast sensing and typically, sense amplifiers uses pair of matched transistors in a positive feedback environment. A small difference in voltage level of applied input signals to these matched transistors is amplified and the resulting logic signals are latched. Intra die variation causes mismatch between the sense transistors that should ideally be identical structures. Yield loss due to device and process variations has never been so critical to cause failure in circuits. Due to growth in size of embedded SRAMs as well as usage of sense amplifier based signaling techniques, process variations in sense amplifiers leads to significant loss of yield for that we need to come up with process variation tolerant circuit styles and new devices. In this work impact of transistor mismatch due to process variations on sense amplifier is evaluated and this problem is stated. For the solution of the problem a novel self compensation scheme on sense amplifiers is presented on different technology nodes up to 32nm on conventional bulk MOSFET technology. Our results show that the self compensation technique in the conventional bulk MOSFET latch type sense amplifier not just gives improvement in the yield but also leads to improvement in performance for latch type sense amplifiers. Lithography related CD variations, fluctuations in dopant density, oxide thickness and parametric variations of devices are identified as a major challenge to the classical bulk type MOSFET. With the emerging nanoscale devices, SIA roadmap identifies FinFETs as a candidate for post-planar end-of-roadmap CMOS device. With current technology scaling issues and with conventional bulk type MOSFET on 32nm node our technique can easily be applied to Double Gate devices. In this work, we also develop the model of Double Gate MOSFET through 3D Device Simulator Damocles and TCAD simulator. We propose a FinFET based process variation tolerant sense amplifier design that exploits the back gate of FinFET devices for dynamic compensation against process variations. Results from statistical simulation show that the proposed dynamic compensation is highly effective in restoring yield at a level comparable to that of sense amplifiers without process variations. We created the 32nm double gate models generated from Damocles 3-D device simulations [25] and Taurus Device Simulator available commercially from Synopsys [47] and use them in the nominal latch type sense amplifier design and on the Independent Gate Self Compensation Sense Amplifier Design (IGSSA) to compare the yield and performance benefits of sense amplifier design on FinFET technology over the conventional bulk type CMOS based sense amplifier on 32nm technology node effective in restoring yield at a level comparable to that of sense amplifiers without process variations. We created the 32nm double gate models generated from Damocles 3-D device simulations [25] and Taurus Device Simulator available commercially from Synopsys [47] and use them in the nominal latch type sense amplifier design and on the Independent Gate Self Compensation Sense Amplifier Design (IGSSA) to compare the yield and performance benefits of sense amplifier design on FinFET technology over the conventional bulk type CMOS based sense amplifier on 32nm technology node

Contributions on using embedded memory circuits as physically unclonable functions considering reliability issues

[eng] Moving towards Internet-of-Things (IoT) era, hardware security becomes a crucial research topic, because of the growing demand of electronic products that are remotely connected through networks. Novel hardware security primitives based on manufacturing process variability are proposed to enhance the security of the IoT systems. As a trusted root that provides physical randomness, a physically unclonable function is an essential base for hardware security. SRAM devices are becoming one of the most promising alternatives for the implementation of embedded physical unclonable functions as the start-up value of each bit-cell depends largely on the variability related with the manufacturing process. Not all bit-cells experience the same degree of variability, so it is possible that some cells randomly modify their logical starting value, while others will start-up always at the same value. However, physically unclonable function applications, such as identification and key generation, require more constant logical starting value to assure high reliability in PUF response. For this reason, some kind of post-processing is needed to correct the errors in the PUF response. Unfortunately, those cells that have more constant logic output are difficult to be detected in advance. This work characterizes by simulation the start-up value reproducibility proposing several metrics suitable for reliability estimation during design phases. The aim is to be able to predict by simulation the percentage of cells that will be suitable to be used as PUF generators. We evaluate the metrics results and analyze the start-up values reproducibility considering different external perturbation sources like several power supply ramp up times, previous internal values in the bit-cell, and different temperature scenarios. The characterization metrics can be exploited to estimate the number of suitable SRAM cells for use in PUF implementations that can be expected from a specific SRAM design.[cat] En l’era de la Internet de les coses (IoT), garantir la seguretat del hardware ha esdevingut un tema de recerca crucial, en especial a causa de la creixent demanda de productes electrònics que es connecten remotament a través de xarxes. Per millorar la seguretat dels sistemes IoT, s’han proposat noves solucions hardware basades en la variabilitat dels processos de fabricació. Les funcions físicament inclonables (PUF) constitueixen una font fiable d’aleatorietat física i són una base essencial per a la seguretat hardware. Les memòries SRAM s’estan convertint en una de les alternatives més prometedores per a la implementació de funcions físicament inclonables encastades. Això és així ja que el valor d’encesa de cada una de les cel·les que formen els bits de la memòria depèn en gran mesura de la variabilitat pròpia del procés de fabricació. No tots els bits tenen el mateix grau de variabilitat, així que algunes cel·les canvien el seu estat lògic d’encesa de forma aleatòria entre enceses, mentre que d’altres sempre assoleixen el mateix valor en totes les enceses. No obstant això, les funcions físicament inclonables, que s’utilitzen per generar claus d’identificació, requereixen un valor lògic d’encesa constant per tal d’assegurar una resposta fiable del PUF. Per aquest motiu, normalment es necessita algun tipus de postprocessament per corregir els possibles errors presents en la resposta del PUF. Malauradament, les cel·les que presenten una resposta més constant són difícils de detectar a priori. Aquest treball caracteritza per simulació la reproductibilitat del valor d’encesa de cel·les SRAM, i proposa diverses mètriques per estimar la fiabilitat de les cel·les durant les fases de disseny de la memòria. L'objectiu és ser capaç de predir per simulació el percentatge de cel·les que seran adequades per ser utilitzades com PUF. S’avaluen els resultats de diverses mètriques i s’analitza la reproductibilitat dels valors d’encesa de les cel·les considerant diverses fonts de pertorbacions externes, com diferents rampes de tensió per a l’encesa, els valors interns emmagatzemats prèviament en les cel·les, i diferents temperatures. Es proposa utilitzar aquestes mètriques per estimar el nombre de cel·les SRAM adients per ser implementades com a PUF en un disseny d‘SRAM específic.[spa] En la era de la Internet de las cosas (IoT), garantizar la seguridad del hardware se ha convertido en un tema de investigación crucial, en especial a causa de la creciente demanda de productos electrónicos que se conectan remotamente a través de redes. Para mejorar la seguridad de los sistemas IoT, se han propuesto nuevas soluciones hardware basadas en la variabilidad de los procesos de fabricación. Las funciones físicamente inclonables (PUF) constituyen una fuente fiable de aleatoriedad física y son una base esencial para la seguridad hardware. Las memorias SRAM se están convirtiendo en una de las alternativas más prometedoras para la implementación de funciones físicamente inclonables empotradas. Esto es así, puesto que el valor de encendido de cada una de las celdas que forman los bits de la memoria depende en gran medida de la variabilidad propia del proceso de fabricación. No todos los bits tienen el mismo grado de variabilidad. Así pues, algunas celdas cambian su estado lógico de encendido de forma aleatoria entre encendidos, mientras que otras siempre adquieren el mismo valor en todos los encendidos. Sin embargo, las funciones físicamente inclonables, que se utilizan para generar claves de identificación, requieren un valor lógico de encendido constante para asegurar una respuesta fiable del PUF. Por este motivo, normalmente se necesita algún tipo de posprocesado para corregir los posibles errores presentes en la respuesta del PUF. Desafortunadamente, las celdas que presentan una respuesta más constante son difíciles de detectar a priori. Este trabajo caracteriza por simulación la reproductibilidad del valor de encendido de celdas SRAM, y propone varias métricas para estimar la fiabilidad de las celdas durante las fases de diseño de la memoria. El objetivo es ser capaz de predecir por simulación el porcentaje de celdas que serán adecuadas para ser utilizadas como PUF. Se evalúan los resultados de varias métricas y se analiza la reproductibilidad de los valores de encendido de las celdas considerando varias fuentes de perturbaciones externas, como diferentes rampas de tensión para el encendido, los valores internos almacenados previamente en las celdas, y diferentes temperaturas. Se propone utilizar estas métricas para estimar el número de celdas SRAM adecuadas para ser implementadas como PUF en un diseño de SRAM específico

Skybridge-3D-CMOS: A Fine-Grained Vertical 3D-CMOS Technology Paving New Direction for 3D IC

2D CMOS integrated circuit (IC) technology scaling faces severe challenges that result from device scaling limitations, interconnect bottleneck that dominates power and performance, etc. 3D ICs with die-die and layer-layer stacking using Through Silicon Vias (TSVs) and Monolithic Inter-layer Vias (MIVs) have been explored in recent years to generate circuits with considerable interconnect saving for continuing technology scaling. However, these 3D IC technologies still rely on conventional 2D CMOS’s device, circuit and interconnect mindset showing only incremental benefits while adding new challenges reliability issues, robustness of power delivery network design and short-channel effects as technology node scaling. Skybridge-3D-CMOS (S3DC) is a fine-grained 3D IC fabric that uses vertically-stacked gates and 3D interconnections composed on vertical nanowires to yield orders of magnitude benefits over 2D ICs. This 3D fabric fully uses the vertical dimension instead of relying on a multi-layered 2D mindset. Its core fabric aspects including device, circuit-style, interconnect and heat-extraction components are co-architected considering the major challenges in 3D IC technology. In S3DC, the 3D interconnections provide greater routing capacity in both vertical and horizontal directions compared to conventional 3D ICs, which eliminates the routability issue in conventional 3D IC technology while enabling ultra-high density design and significant benefits over 2D. Also, the improved vertical routing capacity in S3DC is beneficial for achieving robust and high-density power delivery network (PDN) design while conventional 3D IC has design issues in PDN design due to limited routing resource in vertical direction. Additionally, the 3D gate-all-around transistor incorporating with 3D interconnect in S3DC enables significant SRAM design benefits and good tolerance of process variation compared to conventional 3D IC technology as well as 2D CMOS. The transistor-level (TR-L) monolithic 3D IC (M3D) is the state-of-the-art monolithic 3D technology which shows better benefits than other M3D approaches as well as the TSV-based 3D IC approach. The S3DC is evaluated in large-scale benchmark circuits with comparison to TR-L M3D as well as 2D CMOS. Skybridge yields up to 3x lower power against 2D with no routing congestion in benchmark circuits while TR-L M3D only has up-to 22% power saving with severe routing congestions in the design. The PDN design in S3DC show

Ultra Low Power Digital Circuit Design for Wireless Sensor Network Applications

Ny forskning innenfor feltet trådløse sensornettverk åpner for nye og innovative produkter og løsninger. Biomedisinske anvendelser er blant områdene med størst potensial og det investeres i dag betydelige beløp for å bruke denne teknologien for å gjøre medisinsk diagnostikk mer effektiv samtidig som man åpner for fjerndiagnostikk basert på trådløse sensornoder integrert i et ”helsenett”. Målet er å forbedre tjenestekvalitet og redusere kostnader samtidig som brukerne skal oppleve forbedret livskvalitet som følge av økt trygghet og mulighet for å tilbringe mest mulig tid i eget hjem og unngå unødvendige sykehusbesøk og innleggelser. For å gjøre dette til en realitet er man avhengige av sensorelektronikk som bruker minst mulig energi slik at man oppnår tilstrekkelig batterilevetid selv med veldig små batterier. I sin avhandling ” Ultra Low power Digital Circuit Design for Wireless Sensor Network Applications” har PhD-kandidat Farshad Moradi fokusert på nye løsninger innenfor konstruksjon av energigjerrig digital kretselektronikk. Avhandlingen presenterer nye løsninger både innenfor aritmetiske og kombinatoriske kretser, samtidig som den studerer nye statiske minneelementer (SRAM) og alternative minnearkitekturer. Den ser også på utfordringene som oppstår når silisiumteknologien nedskaleres i takt med mikroprosessorutviklingen og foreslår løsninger som bidrar til å gjøre kretsløsninger mer robuste og skalerbare i forhold til denne utviklingen. De viktigste konklusjonene av arbeidet er at man ved å introdusere nye konstruksjonsteknikker både er i stand til å redusere energiforbruket samtidig som robusthet og teknologiskalerbarhet øker. Forskningen har vært utført i samarbeid med Purdue University og vært finansiert av Norges Forskningsråd gjennom FRINATprosjektet ”Micropower Sensor Interface in Nanometer CMOS Technology”

A design concept for radiation hardened RADFET readout system for space applications

Instruments for measuring the absorbed dose and dose rate under radiation exposure, known as radiation dosimeters, are indispensable in space missions. They are composed of radiation sensors that generate current or voltage response when exposed to ionizing radiation, and processing electronics for computing the absorbed dose and dose rate. Among a wide range of existing radiation sensors, the Radiation Sensitive Field Effect Transistors (RADFETs) have unique advantages for absorbed dose measurement, and a proven record of successful exploitation in space missions. It has been shown that the RADFETs may be also used for the dose rate monitoring. In that regard, we propose a unique design concept that supports the simultaneous operation of a single RADFET as absorbed dose and dose rate monitor. This enables to reduce the cost of implementation, since the need for other types of radiation sensors can be minimized or eliminated. For processing the RADFET's response we propose a readout system composed of analog signal conditioner (ASC) and a self-adaptive multiprocessing system-on-chip (MPSoC). The soft error rate of MPSoC is monitored in real time with embedded sensors, allowing the autonomous switching between three operating modes (high-performance, de-stress and fault-tolerant), according to the application requirements and radiation conditions

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

Radiation Tolerant Electronics, Volume II

Research on radiation tolerant electronics has increased rapidly over the last few years, resulting in many interesting approaches to model radiation effects and design radiation hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation hardened electronics for space applications, high-energy physics experiments such as those on the large hadron collider at CERN, and many terrestrial nuclear applications, including nuclear energy and safety management. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their ionizing radiation susceptibility has raised many exciting challenges, which are expected to drive research in the coming decade.After the success of the first Special Issue on Radiation Tolerant Electronics, the current Special Issue features thirteen articles highlighting recent breakthroughs in radiation tolerant integrated circuit design, fault tolerance in FPGAs, radiation effects in semiconductor materials and advanced IC technologies and modelling of radiation effects