High-speed Low-voltage CMOS Flash Analog-to-Digital Converter for Wideband Communication System-on-a-Chip

With higher-level integration driven by increasingly complex digital systems and downscaling CMOS processes available, system-on-a-chip (SoC) is an emerging technology of low power, high cost effectiveness and high reliability and is exceedingly attractive for applications in high-speed data conversion wireless and wideband communication systems. This research presents a novel ADC comparator design methodology; the speed and performance of which is not restricted by the supply voltage reduction and device linearity deterioration in scaling-down CMOS processes. By developing a dynamic offset suppression technique and a circuit optimization method, the comparator can achieve a 3 dB frequency of 2 GHz in 130 nanometer (nm) CMOS process. Combining this new comparator design and a proposed pipelined thermometer-Gray- binary encoder designed by the DCVSPG logic, a high-speed, low-voltage clocked-digital- comparator (CDC) pipelined CMOS flash ADC architecture is proposed for wideband communication SoC. This architecture has advantages of small silicon area, low power, and low cost. Three CDC-based pipelined CMOS flash ADCs were implemented in 130 nm CMOS process and their experimental results are reported: 1. 4-b, 2.5-GSPS ADC: SFDR of 21.48-dB, SNDR of 15.99-dB, ENOB of 2.4-b, ERBW of 1-GHz, power of 7.9-mW, and area of 0.022-mm2. 2. 4-b, 4-GSPS ADC: SFDR of 25-dB, SNDR of 18.6-dB, ENOB of 2.8-b, ERBW of 2-GHz, power of 11-mW. 3. 6-b, 4-GSPS ADC: SFDR of 48-dB at a signal frequency of 11.72-MHz, SNDR of 34.43-dB, ENOB of 5.4-b, power of 28-mW. An application of the proposed CDC-based pipelined CMOS flash ADC is 1-GHz bandwidth, 2.5-GSPS digital receiver on a chip. To verify the performance of the receiver, a mixed-signal block-level simulation and verification flow was built in Cadence AMS integrated platform. The verification results of the digital receiver using a 4-b 2.5-GSPS CDC-based pipelined CMOS ADC, a 256-point, 12-point kernel function FFT and a frequency detection logic show that two tone signals up to 1125 MHz can be detected and discriminated. A notable contribution of this research is that the proposed ADC architecture and the comparator design with dynamic offset suppression and optimization are extremely suitable for future VDSM CMOS processes and make all-digital receiver SoC design practical

Wideband CMOS Data Converters for Linear and Efficient mmWave Transmitters

With continuously increasing demands for wireless connectivity, higher\ua0carrier frequencies and wider bandwidths are explored. To overcome a limited transmit power at these higher carrier frequencies, multiple\ua0input multiple output (MIMO) systems, with a large number of transmitters\ua0and antennas, are used to direct the transmitted power towards\ua0the user. With a large transmitter count, each individual transmitter\ua0needs to be small and allow for tight integration with digital circuits. In\ua0addition, modern communication standards require linear transmitters,\ua0making linearity an important factor in the transmitter design.In this thesis, radio frequency digital-to-analog converter (RF-DAC)-based transmitters are explored. They shift the transition from digital\ua0to analog closer to the antennas, performing both digital-to-analog\ua0conversion and up-conversion in a single block. To reduce the need for\ua0computationally costly digital predistortion (DPD), a linear and wellbehaved\ua0RF-DAC transfer characteristic is desirable. The combination\ua0of non-overlapping local oscillator (LO) signals and an expanding segmented\ua0non-linear RF-DAC scaling is evaluated as a way to linearize\ua0the transmitter. This linearization concept has been studied both for\ua0the linearization of the RF-DAC itself and for the joint linearization of\ua0the cascaded RF-DAC-based modulator and power amplifier (PA) combination.\ua0To adapt the linearization, observation receivers are needed.\ua0In these, high-speed analog-to-digital converters (ADCs) have a central\ua0role. A high-speed ADC has been designed and evaluated to understand\ua0how concepts used to increase the sample rate affect the dynamic performance

Low-power 4-bit flash analogue to digital converter for ranging applications

A 4-bit 700 MS/s flash ADC is presented in 0.18 mu m CMOS. By lowering the kickback noise of the individual comparators it was possible to reduce the power consumption to 4.43 mW. Improved calibration capabilities resulted in an INL and DNL smaller than 0.25 LSB. These low nonlinearities give rise to 3.77 effective number of bits at the Nyquist input frequency and this in turn yields an overall figure of merit of 0.46 pJ per conversion step, the lowest figure of merit reported for ADCs with sampling rate above 500 MHz in 0.18 mu m CMOS

Carbon footprint of 3D-printed bone tissue engineering scaffolds: an life cycle assessment study

The bone tissue engineering scaffolds is one of the methods for repairing bone defects caused by various factors. According to modern tissue engineering technology, three-dimensional (3D) printing technology for bone tissue engineering provides a temporary basis for the creation of biological replacements. Through the generated 3D bone tissue engineering scaffolds from previous studies, the assessment to evaluate the environmental impact has shown less attention in research. Therefore, this paper is aimed to propose the Model of life cycle assessment (LCA) for 3D bone tissue engineering scaffolds of 3D gel-printing technology and presented the analysis technique of LCA from cradle-to-gate for assessing the environmental impacts of carbon footprint. Acrylamide (C3H5NO), citric acid (C6H8O7), N,N-Dimethylaminopropyl acrylamide (C8H16N2O), deionized water (H2O), and 2-Hydroxyethyl acrylate (C5H8O3) was selected as the material resources. Meanwhile, the 3D gel-printing technology was used as the manufacturing processes in the system boundary. The analysis is based on the LCA Model through the application of GaBi software. The environmental impact was assessed in the 3D gel-printing technology and it was obtained that the system shows the environmental impact of global warming potential (GWP). All of the emissions contributed to GWP have been identified such as emissions to air, freshwater, seawater, and industrial soil. The aggregation of GWP result in the stage of manufacturing process for input and output data contributed 47.6% and 32.5% respectively. Hence, the data analysis of the results is expected to use for improving the performance at the material and manufacturing process of the product life cycle

A robust 2.4 GHz time-of-arrival based ranging system with sub-meter accuracy: feasibility study and realization of low power CMOS receiver

Draadloze sensornetwerken worden meer en meer aangewend om verschillende soorten informatie te verzamelen. De locatie, waar deze informatie verzameld is, is een belangerijke eigenschap en voor sommige toepassingen, zoals het volgen van personen of goederen, zelfs de meest belangrijke en mogelijkmakende factor. Om de positie van een sensor te bepalen, is een technologie nodig die de afstand tot een gekend referentiepunt schat. Door verschillende afstandsmetingen te combineren, is het mogelijk de absolute locatie van de node te berekenen

Design and Implementation of a Novel Flash ADC for Ultra Wide Band Applications

This dissertation presents a design and implementation of a novel flash ADC architecture for ultra wide band applications. The advancement in wireless technology takes us in to a world without wires. Most of the wireless communication systems use digital signal processing to transmit as well as receive the information. The real world signals are analog. Due to the processing complexity of the analog signal, it is converted to digital form so that processing becomes easier. The development in the digital signal processor field is rapid due to the advancement in the integrated circuit technology over the last decade. Therefore, analog-to -digital converter acts as an interface in between analog signal and digital signal processing systems. The continuous speed enhancement of the wireless communication systems brings out huge demands in speed and power specifications of high-speed low-resolution analog-to -digital converters. Even though wired technology is a primary mode of communication, the quality and efficiency of the wireless technology allows us to apply to biomedical applications, in home services and even to radar applications. These applications are highly relying on wireless technology to send and receive information at high speed with great accuracy. Ultra Wideband (UWB) technology is the best method to these applications. A UWB signal has a bandwidth of minimum 500MHz or a fractional bandwidth of 25 percentage of its centre frequency. The two different technology standards that are used in UWB are multiband orthogonal frequency division multiplexing ultra wideband technology (MB-OFDM) and carrier free direct sequence ultra wideband technology (DS-UWB). ADC is the core of any UWB receiver. Generally a high speed flash ADC is used in DS-UWB receiver. Two different flash ADC architectures are proposed in this thesis for DS-UWB applications. The first design is a high speed five bit flash ADC architecture with a sampling rate of 5 GS/s. The design is verified using CADENCE tool with CMOS 90 nm technology. The total power dissipation of the ADC is 8.381 mW from power supply of 1.2 V. The die area of the proposed flash ADC is 186 μm × 210 μm (0.039 mm2). The proposed flash ADC is analysed and compared with other papers in the literature having same resolution and it is concluded that it has the highest speed of operation with medium power dissipation. iii The second design is a reconfigurable five bit flash ADC architecture with a sampling rate of 1.25 GS/s. The design is verified using CADENCE tool with UMC 180 nm technology. The total power dissipation of the ADC is 11.71 mW from power supply of 1.8 V. The die area of the implementation is 432 μm × 720 μm (0.31104 mm2). The chip tape out of the proposed reconfigurable flash ADC is made for fabrication