Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Millimeter-scale RF Integrated Circuits and Antennas for Energy-efficient Wireless Sensor Nodes

Recently there has been increased demand for a millimeter-scale wireless sensor node for applications such as biomedical devices, defense, and surveillance. This form-factor is driven by a desire to be vanishingly small, injectable through a needle, or implantable through a minimally-invasive surgical procedure. Wireless communication is a necessity, but there are several challenges at the millimeter-scale wireless sensor node. One of the main challenges is external components like crystal reference and antenna become the bottleneck of realizing the mm-scale wireless sensor node device. A second challenge is power consumption of the electronics. At mm-scale, the micro-battery has limited capacity and small peak current. Moreover, the RF front-end circuits that operates at the highest frequency in the system will consume most of the power from the battery. Finally, as node volume reduces, there is a challenge of integrating the entire system together, in particular for the RF performance, because all components, including the battery and ICs, need to be placed in close proximity of the antenna. This research explores ways to implement low-power integrated circuits in an energy-constrained and volume constrained application. Three different prototypes are mainly conducted in the proposal. The first is a fully-encapsulated, autonomous, complete wireless sensor node with UWB transmitter in 10.6mm3 volume. It is the first time to demonstrate a full and stand-alone wireless sensing functionality with such a tiny integrated system. The second prototype is a low power GPS front-end receiver that supports burst-mode. A double super-heterodyne topology enables the reception of the three public GPS bands, L1, L2 and L5 simultaneously. The third prototype is an integrated rectangular slot loop antenna in a standard 0.13-μm BiCMOS technology. The antenna is efficiently designed to cover the bandwidth at 60 GHz band and easily satisfy the metal density rules and can be integrated with other circuitry in a standard process.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/143972/1/hskims_1.pd

A Current-Mode Multi-Channel Integrating Analog-to-Digital Converter

Multi-channel analog to digital converters (ADCs) are required where signals from multiple sensors can be digitized. A lower power per channel for such systems is important in order that when the number of channels is increased the power does not increase drastically. Many applications require signals from current output sensors, such as photosensors and photodiodes to be digitized. Applications for these sensors include spectroscopy and imaging. The ability to digitize current signals without converting currents to voltages saves power, area, and the design time required to implement I-to-V converters. This work describes a novel and unique current-mode multi-channel integrating ADC which processes current signals from sensors and converts it to digital format. The ADC facilitates the processing of current analog signals without the use of transconductors. An attempt has been made also to incorporate voltage-mode techniques into the current-mode design so that the advantages of both techniques can be utilized to augment the performance of the system. Additionally since input signals are in the form of currents, the dynamic range of the ADC is less dependant on the supply voltage. A prototype 4-channel ADC design was fabricated in a 0.5-micron bulk CMOS process. The measurement results for a 10Ksps sampling rate include a DNL, which is less than 0.5 LSB, and a power consumption of less than 2mW per channel

Infrastructure for Detector Research and Development towards the International Linear Collider

The EUDET-project was launched to create an infrastructure for developing and testing new and advanced detector technologies to be used at a future linear collider. The aim was to make possible experimentation and analysis of data for institutes, which otherwise could not be realized due to lack of resources. The infrastructure comprised an analysis and software network, and instrumentation infrastructures for tracking detectors as well as for calorimetry.Comment: 54 pages, 48 picture

DIGITALLY ASSISTED TECHNIQUES FOR NYQUIST RATE ANALOG-to-DIGITAL CONVERTERS

With the advance of technology and rapid growth of digital systems, low power high speed analog-to-digital converters with great accuracy are in demand. To achieve high effective number of bits Analog-to-Digital Converter(ADC) calibration as a time consuming process is a potential bottleneck for designs. This dissertation presentsa fully digital background calibration algorithm for a 7-bit redundant flash ADC using split structure and look-up table based correction. Redundant comparators are used in the flash ADC design of this work in order to tolerate large offset voltages while minimizing signal input capacitance. The split ADC structure helps by eliminating the unknown input signal from the calibration path. The flash ADC has been designed in 180nm IBM CMOS technology and fabricated through MOSIS. This work was supported by Analog Devices, Wilmington,MA. While much research on ADC design has concentrated on increasing resolution and sample rate, there are many applications (e.g. biomedical devices and sensor networks) that do not require high performance but do require low power energy efficient ADCs. This dissertation also explores on design of a low quiescent current 100kSps Successive Approximation (SAR) ADC that has been used as an error detection ADC for an automotive application in 350nm CD (CMOS-DMOS) technology. This work was supported by ON Semiconductor Corp, East Greenwich,RI

Electrochemical Sensors and On-chip Optical Sensors

abstract: The microelectronics technology has seen a tremendous growth over the past sixty years. The advancements in microelectronics, which shows the capability of yielding highly reliable and reproducible structures, have made the mass production of integrated electronic components feasible. Miniaturized, low-cost, and accurate sensors became available due to the rise of the microelectronics industry. A variety of sensors are being used extensively in many portable applications. These sensors are promising not only in research area but also in daily routine applications. However, many sensing systems are relatively bulky, complicated, and expensive and main advantages of new sensors do not play an important role in practical applications. Many challenges arise due to intricacies for sensor packaging, especially operation in a solution environment. Additional problems emerge when interfacing sensors with external off-chip components. A large amount of research in the field of sensors has been focused on how to improve the system integration. This work presents new methods for the design, fabrication, and integration of sensor systems. This thesis addresses these challenges, for example, interfacing microelectronic system to a liquid environment and developing a new technique for impedimetric measurement. This work also shows a new design for on-chip optical sensor without any other extra components or post-processing.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Energy-Efficient Circuit Designs for Miniaturized Internet of Things and Wireless Neural Recording

Internet of Things (IoT) have become omnipresent over various territories including healthcare, smart building, agriculture, and environmental and industrial monitoring. Today, IoT are getting miniaturized, but at the same time, they are becoming more intelligent along with the explosive growth of machine learning. Not only do IoT sense and collect data and communicate, but they also edge-compute and extract useful information within the small form factor. A main challenge of such miniaturized and intelligent IoT is to operate continuously for long lifetime within its low battery capacity. Energy efficiency of circuits and systems is key to addressing this challenge. This dissertation presents two different energy-efficient circuit designs: a 224pW 260ppm/°C gate-leakage-based timer for wireless sensor nodes (WSNs) for the IoT and an energy-efficient all analog machine learning accelerator with 1.2 µJ/inference of energy consumption for the CIFAR-10 and SVHN datasets. Wireless neural interface is another area that demands miniaturized and energy-efficient circuits and systems for safe long-term monitoring of brain activity. Historically, implantable systems have used wires for data communication and power, increasing risks of tissue damage. Therefore, it has been a long-standing goal to distribute sub-mm-scale true floating and wireless implants throughout the brain and to record single-neuron-level activities. This dissertation presents a 0.19×0.17mm2 0.74µW wireless neural recording IC with near-infrared (NIR) power and data telemetry and a 0.19×0.28mm2 0.57µW light tolerant wireless neural recording IC.PHDElectrical and Computer EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/169712/1/jongyup_1.pd

The ALICE TPC, a large 3-dimensional tracking device with fast readout for ultra-high multiplicity events

The design, construction, and commissioning of the ALICE Time-Projection Chamber (TPC) is described. It is the main device for pattern recognition, tracking, and identification of charged particles in the ALICE experiment at the CERN LHC. The TPC is cylindrical in shape with a volume close to 90 m^3 and is operated in a 0.5 T solenoidal magnetic field parallel to its axis. In this paper we describe in detail the design considerations for this detector for operation in the extreme multiplicity environment of central Pb--Pb collisions at LHC energy. The implementation of the resulting requirements into hardware (field cage, read-out chambers, electronics), infrastructure (gas and cooling system, laser-calibration system), and software led to many technical innovations which are described along with a presentation of all the major components of the detector, as currently realized. We also report on the performance achieved after completion of the first round of stand-alone calibration runs and demonstrate results close to those specified in the TPC Technical Design Report.Comment: 55 pages, 82 figure